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H01L2224/11019

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/11019for protecting parts during the process

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and preparation methods thereof
- Patent number 12,132,022
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump integration with redistribution layer
- Patent number 12,057,423
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,742,310
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joints on nickel surface finishes without gold plating
- Patent number 11,676,926
- Issue date Jun 13, 2023
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,456,268
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,081,459
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including solder bracing material with a rough...
- Patent number 11,018,106
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive vias in semiconductor packages and methods of forming same
- Patent number 10,978,346
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive vias in semiconductor packages and methods of forming same
- Patent number 10,510,603
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 10,483,226
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packaging method for semiconductor components
- Patent number 10,418,339
- Issue date Sep 17, 2019
- Imec VZW
- Fabrice Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and package structure for image sensing chip
- Patent number 10,325,946
- Issue date Jun 18, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 10,319,691
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 10,256,210
- Issue date Apr 9, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with L-shaped non-metal sidewall protection structure
- Patent number 10,163,837
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,157,893
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,090,375
- Issue date Oct 2, 2018
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductive packaging device and manufacturing method thereof
- Patent number 10,020,275
- Issue date Jul 10, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures having a tapering curved profile and methods of making same
- Patent number 10,008,459
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of forming same
- Patent number 9,966,346
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Company
- Guan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contacts having varying widths and method of manufacturi...
- Patent number 9,953,939
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package (PoP) structure including stud bulbs
- Patent number 9,812,427
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 9,786,632
- Issue date Oct 10, 2017
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic device package
- Patent number 9,771,259
- Issue date Sep 26, 2017
- Xintec Inc.
- Chien-Hung Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Power semiconductor device with a double metal contact and related...
- Patent number 9,761,550
- Issue date Sep 12, 2017
- Infineon Technologies Americas Corp.
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device and structure therefor
- Patent number 9,646,951
- Issue date May 9, 2017
- Semiconductor Components Industries, LLC
- Richard D. Moyers
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PASSIVATION LAYERS WITH ROUNDED CORNERS
- Publication number 20240387244
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Mingni CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP INTEGRATION WITH REDISTRIBUTION LAYER
- Publication number 20240363569
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION
- Publication number 20230317662
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Layers with Rounded Corners
- Publication number 20230290673
- Publication date Sep 14, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS
- Publication number 20230123307
- Publication date Apr 20, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF
- Publication number 20230054495
- Publication date Feb 23, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND CHIP PREPARATION METHOD
- Publication number 20230012986
- Publication date Jan 19, 2023
- Huawei Technologies Co., Ltd
- Heng LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Integration with Redistribution Layer
- Publication number 20220246565
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING
- Publication number 20220059489
- Publication date Feb 24, 2022
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210257326
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200235065
- Publication date Jul 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Bump Sidewall Protection
- Publication number 20200135677
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200035634
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE VIAS IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20200006143
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20190326239
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE VIAS IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20190067104
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packaging Method for Semiconductor Components
- Publication number 20190006301
- Publication date Jan 3, 2019
- IMEC vzw
- Fabrice Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180301431
- Publication date Oct 18, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGE STRUCTURE FOR IMAGE SENSING CHIP
- Publication number 20180286903
- Publication date Oct 4, 2018
- China Wafer Level CSP Co., Ltd
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COPPER MIGRATION STOPPING OF A REDISTRIBU...
- Publication number 20180174992
- Publication date Jun 21, 2018
- Chengdu Monolithic Power Systems Co., Ltd.
- Fayou Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20170373038
- Publication date Dec 28, 2017
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20170179055
- Publication date Jun 22, 2017
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH L-SHAPED NON-METAL SIDEWALL PROTECTION STRUCTURE
- Publication number 20170084563
- Publication date Mar 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...
- Publication number 20170069587
- Publication date Mar 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20160322321
- Publication date Nov 3, 2016
- RENESAS ELECTRONICS CORPORATION
- Akira YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device with a Double Metal Contact and Related...
- Publication number 20160233185
- Publication date Aug 11, 2016
- Infineon Technologies Americas Corp.
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Manufacturing Method
- Publication number 20160233184
- Publication date Aug 11, 2016
- Nitto Denko Corporation
- Hiroyuki Hanazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR SIDEWALL PROTECTION
- Publication number 20150340332
- Publication date Nov 26, 2015
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS

for protecting parts during the process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and preparation methods thereof

Bump integration with redistribution layer

Solderless interconnection structure and method of forming same

Method of manufacturing semiconductor device

Solder joints on nickel surface finishes without gold plating

Semiconductor package and manufacturing method thereof

Semiconductor device

Solderless interconnection structure and method of forming same

Semiconductor device including solder bracing material with a rough...

Conductive vias in semiconductor packages and methods of forming same

Package-on-package (PoP) structure including stud bulbs

Conductive vias in semiconductor packages and methods of forming same

Semiconductor device and method of forming the same

3D packaging method for semiconductor components

Packaging method and package structure for image sensing chip

Solderless interconnection structure and method of forming same

Semiconductor devices and methods of forming thereof

Semiconductor package structure and method for forming the same

Cu pillar bump with L-shaped non-metal sidewall protection structure

Package-on-package (PoP) structure including stud bulbs

Semiconductor structure

Semiconductive packaging device and manufacturing method thereof

Structures having a tapering curved profile and methods of making same

Bump structure and method of forming same

Conductive contacts having varying widths and method of manufacturi...

Package on-package (PoP) structure including stud bulbs

Semiconductor package structure and method for forming the same

Method for fabricating electronic device package

Power semiconductor device with a double metal contact and related...

Method of forming a semiconductor device and structure therefor

Patents Applicationslast 30 patents

PASSIVATION LAYERS WITH ROUNDED CORNERS

BUMP INTEGRATION WITH REDISTRIBUTION LAYER

ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION

Passivation Layers with Rounded Corners

ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS

SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF

CHIP STRUCTURE AND CHIP PREPARATION METHOD

Bump Integration with Redistribution Layer

SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Metal-Bump Sidewall Protection

SEMICONDUCTOR DEVICE

CONDUCTIVE VIAS IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Package-On-Package (PoP) Structure Including Stud Bulbs

CONDUCTIVE VIAS IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

3D Packaging Method for Semiconductor Components

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGING METHOD AND PACKAGE STRUCTURE FOR IMAGE SENSING CHIP

SEMICONDUCTOR DEVICE WITH COPPER MIGRATION STOPPING OF A REDISTRIBU...

Package-On-Package (PoP) Structure Including Stud Bulbs

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE

CU PILLAR BUMP WITH L-SHAPED NON-METAL SIDEWALL PROTECTION STRUCTURE

CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Power Semiconductor Device with a Double Metal Contact and Related...

Semiconductor Device Manufacturing Method

COPPER PILLAR SIDEWALL PROTECTION