for single side lapping of plane surfaces

Industry

CPC
B24B37/30

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/30for single side lapping of plane surfaces

Industries

Patents Grantslast 30 patents

Information Patent Grant
Filtering during in-situ monitoring of polishing
- Patent number 11,969,855
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus
- Patent number 11,969,858
- Issue date Apr 30, 2024
- Ebara Corporation
- Keisuke Namiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate holding apparatus, elastic membrane, polishing apparatus,...
- Patent number 11,958,163
- Issue date Apr 16, 2024
- Ebara Corporation
- Osamu Nabeya
- B24 - GRINDING POLISHING
Information Patent Grant
Deformable substrate chuck
- Patent number 11,931,857
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier wafers and methods of forming carrier wafers
- Patent number 11,919,125
- Issue date Mar 5, 2024
- Corning Incorporated
- Lance Changyong Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Monolithic platen
- Patent number 11,919,126
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,911,872
- Issue date Feb 27, 2024
- Ebara Corporation
- Nobuyuki Takada
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature control in chemical mechanical polish
- Patent number 11,904,430
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kei-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor manufacturing device and method of polishing semicond...
- Patent number 11,894,235
- Issue date Feb 6, 2024
- Lapis Semiconductor Co., Ltd.
- Kiyohiko Toshikawa
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,887,869
- Issue date Jan 30, 2024
- Tokyo Electron Limited
- Nobuhiko Mouri
- B08 - CLEANING
Information Patent Grant
Polishing apparatus
- Patent number 11,865,665
- Issue date Jan 9, 2024
- Ebara Corporation
- Kenichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Asymmetry correction via oriented wafer loading
- Patent number 11,869,815
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 11,858,088
- Issue date Jan 2, 2024
- Disco Corporation
- Toshiyuki Moriya
- B24 - GRINDING POLISHING
Information Patent Grant
RFID part authentication and tracking of processing components
- Patent number 11,848,220
- Issue date Dec 19, 2023
- Applied Materials, Inc.
- Earl Hunter
- B24 - GRINDING POLISHING
Information Patent Grant
Advanced polishing pads and related polishing pad manufacturing met...
- Patent number 11,806,829
- Issue date Nov 7, 2023
- Applied Materials, Inc.
- Puneet Narendra Jawali
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing carrier head with multiple angular pressurizable zones
- Patent number 11,780,049
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding equipment
- Patent number 11,772,232
- Issue date Oct 3, 2023
- AM TECHNOLOGY CO., LTD.
- Hyoung Joo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus
- Patent number 11,772,226
- Issue date Oct 3, 2023
- Disco Corporation
- Yuki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer holder
- Patent number 11,759,910
- Issue date Sep 19, 2023
- P.R. Hoffman Machine Products, Inc.
- David Melville Hutton
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head and polishing apparatus
- Patent number 11,752,590
- Issue date Sep 12, 2023
- Ebara Corporation
- Yuichi Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Method of making carrier head membrane with regions of different ro...
- Patent number 11,738,421
- Issue date Aug 29, 2023
- Applied Materials, Inc.
- Young J. Paik
- B24 - GRINDING POLISHING
Information Patent Grant
Method for selecting template assembly, method for polishing workpi...
- Patent number 11,731,236
- Issue date Aug 22, 2023
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Filtering during in-situ monitoring of polishing
- Patent number 11,679,466
- Issue date Jun 20, 2023
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing apparatus
- Patent number 11,679,467
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding apparatus
- Patent number 11,654,525
- Issue date May 23, 2023
- Disco Corporation
- Jiro Genozono
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus of substrate
- Patent number 11,607,769
- Issue date Mar 21, 2023
- Ebara Corporation
- Tetsuji Togawa
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer processing apparatus
- Patent number 11,607,771
- Issue date Mar 21, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier head of polishing apparatus and membrane used therein
- Patent number 11,597,055
- Issue date Mar 7, 2023
- KCTECH CO., LTD.
- Jun Ho Son
- B24 - GRINDING POLISHING
Information Patent Grant
Rotary body module and chemical mechanical polishing apparatus havi...
- Patent number 11,590,628
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Yonghee Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for polishing a substrate
- Patent number 11,548,113
- Issue date Jan 10, 2023
- Ebara Corporation
- Makoto Fukushima
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Temperature Control in Chemical Mechanical Polish
- Publication number 20240149388
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kei-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING APPARATUS
- Publication number 20240149391
- Publication date May 9, 2024
- Tokyo Seimitsu Co., Ltd.
- Tadashi MURASATO
- B24 - GRINDING POLISHING
Information Patent Application
GAS DELIVERY PALLET ASSEMBLY, CLEANING UNIT AND CHEMICAL MECHANICAL...
- Publication number 20240131562
- Publication date Apr 25, 2024
- Applied Materials, Inc.
- Edwin VELAZQUEZ
- B08 - CLEANING
Information Patent Application
MEMBRANE FAILURE DETECTION SYSTEM
- Publication number 20240109164
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Chang ZHANG
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20240091899
- Publication date Mar 21, 2024
- EBARA CORPORATION
- Kenichi KOBAYASHI
- B24 - GRINDING POLISHING
Information Patent Application
ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING
- Publication number 20240087965
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM
- Publication number 20240050995
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- B08 - CLEANING
Information Patent Application
MINIMIZING SUBSTRATE BOW DURING POLISHING
- Publication number 20240033878
- Publication date Feb 1, 2024
- Applied Materials, Inc.
- Eric L. Lau
- B24 - GRINDING POLISHING
Information Patent Application
ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING MET...
- Publication number 20240025010
- Publication date Jan 25, 2024
- Applied Materials, Inc.
- Puneet Narendra JAWALI
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20230405756
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING CARRIER HEAD WITH MULTIPLE ZONES
- Publication number 20230405758
- Publication date Dec 21, 2023
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS FOR POLISHING AND METHOD OF POLISHING
- Publication number 20230381916
- Publication date Nov 30, 2023
- EBARA CORPORATION
- Kuniaki YAMAGUCHI
- B24 - GRINDING POLISHING
Information Patent Application
Carrier Head Membrane With Regions of Different Roughness
- Publication number 20230356353
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Young J. Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP POLISHING PAD WITH PROTRUDING STRUCTURES HAVING ENGINEERED OPEN...
- Publication number 20230311269
- Publication date Oct 5, 2023
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- John R. McCormick
- B24 - GRINDING POLISHING
Information Patent Application
FILTERING DURING IN-SITU MONITORING OF POLISHING
- Publication number 20230286105
- Publication date Sep 14, 2023
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Application
NOVEL CHEMICAL-MECHANICAL POLISHING APPARATUS
- Publication number 20230286106
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Application
AUTOMATIC ABRASION COMPENSATION SYSTEM OF LOWER PLATE AND WAFER LAP...
- Publication number 20230211457
- Publication date Jul 6, 2023
- SK SILTRON CO., LTD.
- Jae Pyo LEE
- B24 - GRINDING POLISHING
Information Patent Application
CMP PROCESS APPLIED TO A THIN SIC WAFER FOR STRESS RELEASE AND DAMA...
- Publication number 20230128739
- Publication date Apr 27, 2023
- STMicroelectronics S.r.l.
- Agata GRASSO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD USING THE...
- Publication number 20230052061
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- Hyojin PARK
- B24 - GRINDING POLISHING
Information Patent Application
FILTERING DURING IN-SITU MONITORING OF POLISHING
- Publication number 20220388113
- Publication date Dec 8, 2022
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Application
MULTIPLE POLISHING HEADS WITH CROSS-ZONE PRESSURE ELEMENT DISTRIBUT...
- Publication number 20220362903
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Lung Lin
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD
- Publication number 20220339754
- Publication date Oct 27, 2022
- Disco Corporation
- Naruto FUWA
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...
- Publication number 20220324080
- Publication date Oct 13, 2022
- Bruker Nano Inc.
- Vladimir Gulkov
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20220305612
- Publication date Sep 29, 2022
- Disco Corporation
- Toshiyuki MORIYA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING SIMULTANEOUSLY OVER MULTIPLE MINI PLATENS
- Publication number 20220297258
- Publication date Sep 22, 2022
- Applied Materials, Inc.
- Jeonghoon OH
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING CARRIER HEAD WITH FLOATING EDGE CONTROL
- Publication number 20220281064
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING SYSTEM
- Publication number 20220274228
- Publication date Sep 1, 2022
- KCTECH CO., LTD.
- Hee Sung CHAE
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEMS AND METHODS FOR SUCTION PAD ASSEMBLIES
- Publication number 20220246483
- Publication date Aug 4, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yu-Hsiang CHAO
- B24 - GRINDING POLISHING
Information Patent Application
END FACE POLISHING DEVICE FOR OPTICAL FIBER FERRULE
- Publication number 20220212313
- Publication date Jul 7, 2022
- SEIKOH GIKEN CO., LTD.
- Atsushi YAMADA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20220203498
- Publication date Jun 30, 2022
- EBARA CORPORATION
- Yuta SUZUKI
- B24 - GRINDING POLISHING

for single side lapping of plane surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Filtering during in-situ monitoring of polishing

Substrate processing apparatus

Substrate holding apparatus, elastic membrane, polishing apparatus,...

Deformable substrate chuck

Carrier wafers and methods of forming carrier wafers

Monolithic platen

Substrate processing apparatus and substrate processing method

Temperature control in chemical mechanical polish

Semiconductor manufacturing device and method of polishing semicond...

Substrate processing apparatus and substrate processing method

Polishing apparatus

Asymmetry correction via oriented wafer loading

Polishing apparatus

RFID part authentication and tracking of processing components

Advanced polishing pads and related polishing pad manufacturing met...

Polishing carrier head with multiple angular pressurizable zones

Grinding equipment

Polishing apparatus

Method of manufacturing wafer holder

Polishing head and polishing apparatus

Method of making carrier head membrane with regions of different ro...

Method for selecting template assembly, method for polishing workpi...

Filtering during in-situ monitoring of polishing

Chemical-mechanical polishing apparatus

Grinding apparatus

Polishing apparatus of substrate

Wafer processing apparatus

Carrier head of polishing apparatus and membrane used therein

Rotary body module and chemical mechanical polishing apparatus havi...

Method and apparatus for polishing a substrate

Patents Applicationslast 30 patents

Temperature Control in Chemical Mechanical Polish

PROCESSING APPARATUS

GAS DELIVERY PALLET ASSEMBLY, CLEANING UNIT AND CHEMICAL MECHANICAL...

MEMBRANE FAILURE DETECTION SYSTEM

POLISHING APPARATUS

ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

MINIMIZING SUBSTRATE BOW DURING POLISHING

ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING MET...

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

POLISHING CARRIER HEAD WITH MULTIPLE ZONES

APPARATUS FOR POLISHING AND METHOD OF POLISHING

Carrier Head Membrane With Regions of Different Roughness

CMP POLISHING PAD WITH PROTRUDING STRUCTURES HAVING ENGINEERED OPEN...

FILTERING DURING IN-SITU MONITORING OF POLISHING

NOVEL CHEMICAL-MECHANICAL POLISHING APPARATUS

AUTOMATIC ABRASION COMPENSATION SYSTEM OF LOWER PLATE AND WAFER LAP...

CMP PROCESS APPLIED TO A THIN SIC WAFER FOR STRESS RELEASE AND DAMA...

SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD USING THE...

FILTERING DURING IN-SITU MONITORING OF POLISHING

MULTIPLE POLISHING HEADS WITH CROSS-ZONE PRESSURE ELEMENT DISTRIBUT...

POLISHING METHOD

CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...

POLISHING APPARATUS

SUBSTRATE POLISHING SIMULTANEOUSLY OVER MULTIPLE MINI PLATENS

POLISHING CARRIER HEAD WITH FLOATING EDGE CONTROL

SUBSTRATE POLISHING SYSTEM

SYSTEMS AND METHODS FOR SUCTION PAD ASSEMBLIES

END FACE POLISHING DEVICE FOR OPTICAL FIBER FERRULE

POLISHING APPARATUS AND POLISHING METHOD