for supporting the semiconductor or solid-state body

Industry

CPC
H01L2224/11002

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11002for supporting the semiconductor or solid-state body

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Fabricating active-bridge-coupled GPU chiplets
- Patent number 12,170,263
- Issue date Dec 17, 2024
- Advanced Micro Devices, Inc.
- Skyler J. Saleh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, display backplane and system for manufacturing disp...
- Patent number 12,015,113
- Issue date Jun 18, 2024
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Shoujun Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic carrier for high aspect ratio fanout
- Patent number 11,955,349
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 11,855,045
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,841,531
- Issue date Dec 12, 2023
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through silicon vias and manufacturing...
- Patent number 11,817,427
- Issue date Nov 14, 2023
- LONGITUDE LICENSING LIMITED
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnection structure and manufacturing method thereof...
- Patent number 11,776,820
- Issue date Oct 3, 2023
- Huawei Technologies Co., Ltd.
- Xiaoyun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive devices in package-on-package structures and methods for fo...
- Patent number 11,742,217
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of processor wafer bonding for wafer-scale int...
- Patent number 11,651,973
- Issue date May 16, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of making semiconductor device package including conformal m...
- Patent number 11,488,842
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,435,523
- Issue date Sep 6, 2022
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic carrier for high aspect ratio fanout
- Patent number 11,393,701
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,335,655
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming vias using silicon on insulator substrate
- Patent number 11,257,744
- Issue date Feb 22, 2022
- Micron Technology, Inc.
- Toshiyuki Maenosono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 11,217,562
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through silicon vias and manufacturing...
- Patent number 11,211,363
- Issue date Dec 28, 2021
- LONGITUDE LICENSING LIMITED
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming modular 3D semiconductor...
- Patent number 11,211,359
- Issue date Dec 28, 2021
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with protected bump and method of fo...
- Patent number 11,171,100
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 11,164,835
- Issue date Nov 2, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuits with components on both sides of a selected sub...
- Patent number 11,164,891
- Issue date Nov 2, 2021
- pSemi Corporation
- James S. Cable
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and method for forming same
- Patent number 11,133,274
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages and methods of manufacture thereof
- Patent number 11,133,286
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for standard logic performance improvement having a back-...
- Patent number 11,107,767
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package system for integrated circuits
- Patent number 11,081,372
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 11,075,166
- Issue date Jul 27, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous miniaturization platform
- Patent number 11,055,459
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Qianwen Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Passive devices in package-on-package structures and methods for fo...
- Patent number 11,018,086
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with reduced parasitic coupling effects and p...
- Patent number 10,985,033
- Issue date Apr 20, 2021
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE
- Publication number 20240395654
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387457
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240379536
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240145417
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeongwoo JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20230307419
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Harvested Reconstitution Bumping
- Publication number 20230245988
- Publication date Aug 3, 2023
- Kwan-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anisotropic Carrier for High Aspect Ratio Fanout
- Publication number 20220328327
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Through Silicon Vias and Manufacturing...
- Publication number 20220102318
- Publication date Mar 31, 2022
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF...
- Publication number 20220102164
- Publication date Mar 31, 2022
- Huawei Technologies Co., Ltd
- Xiaoyun WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20220028812
- Publication date Jan 27, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210175168
- Publication date Jun 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTED BUMP AND METHOD OF F...
- Publication number 20210159197
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive Devices in Package-on-Package Structures and Methods for Fo...
- Publication number 20210125923
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20210090906
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anisotropic Carrier for High Aspect Ratio Fanout
- Publication number 20210050229
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20200395301
- Publication date Dec 17, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Interconnect Structure and Method for Forming Same
- Publication number 20200328169
- Publication date Oct 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Through Silicon Vias and Manufacturing...
- Publication number 20200273846
- Publication date Aug 27, 2020
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR STANDARD LOGIC PERFORMANCE IMPROVEMENT HAVING A BACK-...
- Publication number 20200161244
- Publication date May 21, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEM FOR INTEGRATED CIRCUITS
- Publication number 20200118839
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Discrete Blocks
- Publication number 20200118978
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20200111682
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200058607
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded 3D Interposer Structure
- Publication number 20200035554
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ching Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20190355666
- Publication date Nov 21, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20190333888
- Publication date Oct 31, 2019
- ABLIC Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETECTING DELAMINATION IN AN INTEGRATED CIRCUIT PACKAGE S...
- Publication number 20190333829
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- G01 - MEASURING TESTING
Information Patent Application
HETEROGENEOUS MINIATURIZATION PLATFORM
- Publication number 20190311082
- Publication date Oct 10, 2019
- International Business Machines Corporation
- Qianwen Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device Having Through Silicon Vias
- Publication number 20190206842
- Publication date Jul 4, 2019
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20190164928
- Publication date May 30, 2019
- KAIJO CORPORATION
- Hideki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS

for supporting the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fabricating active-bridge-coupled GPU chiplets

Semiconductor wafer and method of ball drop on thin wafer with edge...

Integrated chip for standard logic performance improvement having a...

Bonding method, display backplane and system for manufacturing disp...

Anisotropic carrier for high aspect ratio fanout

Semiconductor device with discrete blocks

Wafer scale bonded active photonics interposer

Semiconductor device having through silicon vias and manufacturing...

Vertical interconnection structure and manufacturing method thereof...

Passive devices in package-on-package structures and methods for fo...

Method and apparatus of processor wafer bonding for wafer-scale int...

Method of making semiconductor device package including conformal m...

Wafer scale bonded active photonics interposer

Anisotropic carrier for high aspect ratio fanout

Package structure and manufacturing method thereof

Method of forming vias using silicon on insulator substrate

Semiconductor device with discrete blocks

Semiconductor device having through silicon vias and manufacturing...

Semiconductor device and method of forming modular 3D semiconductor...

Semiconductor device structure with protected bump and method of fo...

Semiconductor wafer and method of ball drop on thin wafer with edge...

Integrated circuits with components on both sides of a selected sub...

Fan-out interconnect structure and method for forming same

Chip packages and methods of manufacture thereof

Structure for standard logic performance improvement having a back-...

Package system for integrated circuits

Microelectronic structures having multiple microelectronic devices...

Heterogeneous miniaturization platform

Passive devices in package-on-package structures and methods for fo...

Semiconductor package with reduced parasitic coupling effects and p...

Patents Applicationslast 30 patents

STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD OF FORMING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

Harvested Reconstitution Bumping

Anisotropic Carrier for High Aspect Ratio Fanout

Semiconductor Device Having Through Silicon Vias and Manufacturing...

VERTICAL INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF...

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTED BUMP AND METHOD OF F...

Passive Devices in Package-on-Package Structures and Methods for Fo...

Semiconductor Device and Method

Anisotropic Carrier for High Aspect Ratio Fanout

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

Fan-Out Interconnect Structure and Method for Forming Same

Semiconductor Device Having Through Silicon Vias and Manufacturing...

STRUCTURE FOR STANDARD LOGIC PERFORMANCE IMPROVEMENT HAVING A BACK-...

PACKAGE SYSTEM FOR INTEGRATED CIRCUITS

Semiconductor Device with Discrete Blocks

Semiconductor Device and Method

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Embedded 3D Interposer Structure

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

METHOD OF DETECTING DELAMINATION IN AN INTEGRATED CIRCUIT PACKAGE S...

HETEROGENEOUS MINIATURIZATION PLATFORM

Semiconductor Device Having Through Silicon Vias

BONDING METHOD