Form of non-self-supporting electrodes

Industry

CPC
H01G4/012

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01GCAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE H01G4/00Fixed capacitors Processes of their manufacture

Current Industry

H01G4/012Form of non-self-supporting electrodes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for producing multilayer ceramic electronic component and di...
- Patent number 11,972,901
- Issue date Apr 30, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Ohara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,972,903
- Issue date Apr 30, 2024
- Murata Manufacturing Co., Ltd.
- Tatsuya Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,972,905
- Issue date Apr 30, 2024
- Murata Manufacturing Co., Ltd.
- Yukie Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor including raised portions thicker from...
- Patent number 11,967,461
- Issue date Apr 23, 2024
- Murata Manufacturing Co., Ltd.
- Yasuyuki Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic device
- Patent number 11,967,463
- Issue date Apr 23, 2024
- Taiyo Yuden Co., Ltd.
- Teruo Atsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and manufacturing method therefor
- Patent number 11,967,468
- Issue date Apr 23, 2024
- TDK Corporation
- Masahiro Hiraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor component including indium and tin, and method of manufac...
- Patent number 11,967,462
- Issue date Apr 23, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yun Sung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component
- Patent number 11,967,466
- Issue date Apr 23, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and circuit board includin...
- Patent number 11,967,467
- Issue date Apr 23, 2024
- Taiyo Yuden Co., Ltd.
- Fumi Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and board having the same mounted thereon
- Patent number 11,961,682
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sim Chung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor and ceramic material powder
- Patent number 11,961,674
- Issue date Apr 16, 2024
- Taiyo Yuden Co., Ltd.
- Katsuya Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor with core-shell dielectric
- Patent number 11,961,679
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component without external electrodes on top sur...
- Patent number 11,961,680
- Issue date Apr 16, 2024
- Taiyo Yuden Co., Ltd.
- Takashi Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor including internal electrodes having pores on...
- Patent number 11,961,681
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yu Kwang Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered electronic component and method of manufacturing the same
- Patent number 11,955,286
- Issue date Apr 9, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Hoon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor
- Patent number 11,955,289
- Issue date Apr 9, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Soo Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,955,290
- Issue date Apr 9, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Min Gon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic device and manufacturing method of the same
- Patent number 11,948,751
- Issue date Apr 2, 2024
- Taiyo Yuden Co., Ltd.
- Hidetoshi Masuda
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Multilayer capacitor
- Patent number 11,948,745
- Issue date Apr 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Won Chul Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric body, multilayer ceramic capacitor, manufacturing method...
- Patent number 11,948,747
- Issue date Apr 2, 2024
- Taiyo Yuden Co., Ltd.
- Yuji Tsushima
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,948,746
- Issue date Apr 2, 2024
- Murata Manufacturing Co., Ltd.
- Yasuyuki Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component and method of manufacturing the same
- Patent number 11,948,752
- Issue date Apr 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sung Hyung Kang
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Manufacturing method of multilayer ceramic electronic device
- Patent number 11,948,753
- Issue date Apr 2, 2024
- Taiyo Yuden Co., Ltd.
- Kazuki Yamada
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
First-stage ceramic collective board, second-stage ceramic collecti...
- Patent number 11,942,276
- Issue date Mar 26, 2024
- Murata Manufacturing Co., Ltd.
- Daizo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor
- Patent number 11,942,278
- Issue date Mar 26, 2024
- TDK Corporation
- Michihiro Kumagae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure and semiconductor s...
- Patent number 11,942,277
- Issue date Mar 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Mao-Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric ceramic composition and multi-layered ceramic capacitor...
- Patent number 11,935,698
- Issue date Mar 19, 2024
- KEMET Electronics Corporation
- Hanzheng Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component and conductive paste for re...
- Patent number 11,935,702
- Issue date Mar 19, 2024
- Murata Manufacturing Co., Ltd.
- Yoshiyuki Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component including non-conductive resin laye...
- Patent number 11,935,703
- Issue date Mar 19, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Seok Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component having improved high temperature lo...
- Patent number 11,929,206
- Issue date Mar 12, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dong Jun Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240145174
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Young Ghyu AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Capacitor
- Publication number 20240145176
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Marianne Berolini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING MU...
- Publication number 20240145168
- Publication date May 2, 2024
- Murata Manufacturing Co., Ltd.
- Daisuke HAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Capacitor
- Publication number 20240145172
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Marianne Berolini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Capacitor
- Publication number 20240145169
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Marianne Berolini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR COMPONENT
- Publication number 20240145171
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING MULTILA...
- Publication number 20240145173
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitive Cable
- Publication number 20240128021
- Publication date Apr 18, 2024
- Enertechnos Limited
- Gareth O'Brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240120153
- Publication date Apr 11, 2024
- Taiyo Yuden Co., Ltd.
- Ayumi MATSUOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240120152
- Publication date Apr 11, 2024
- TDK Corporation
- Toshihiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240112863
- Publication date Apr 4, 2024
- TDK Corporation
- Atsushi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240112865
- Publication date Apr 4, 2024
- TDK Corporation
- Toshihiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED CAPACITOR
- Publication number 20240112862
- Publication date Apr 4, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sunghyung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL SUPPORTING STRUCTURE
- Publication number 20240105715
- Publication date Mar 28, 2024
- NANYA TECHNOLOGY CORPORATION
- WEN-CHIEH WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL SUPPORTING STRUCTURE
- Publication number 20240105714
- Publication date Mar 28, 2024
- NANYA TECHNOLOGY CORPORATION
- WEN-CHIEH WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT DEVICE AND METHOD OF FORMING EXTERNAL ELECTRODE
- Publication number 20240105398
- Publication date Mar 28, 2024
- Murata Manufacturing Co., Ltd.
- Yasuhiro SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240096553
- Publication date Mar 21, 2024
- Murata Manufacturing Co., Ltd.
- Ryota ASO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AN...
- Publication number 20240096558
- Publication date Mar 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Dong Yeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CAPACITOR AND SUBSTRATE INCLUDING THE SAME MOUNTED THEREON
- Publication number 20240096560
- Publication date Mar 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Hwi Dae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITORS
- Publication number 20240096561
- Publication date Mar 21, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUS CAPACITOR AND AUTOMOBILE
- Publication number 20240096555
- Publication date Mar 21, 2024
- BYD COMPANY LIMITED
- Bing HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED CERAMIC CAPACITOR
- Publication number 20240096559
- Publication date Mar 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Hwi Dae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096557
- Publication date Mar 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sung Hyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240087809
- Publication date Mar 14, 2024
- Murata Manufacturing Co., Ltd.
- Toshiyuki Nakaiso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM HIGH POLYMER LAMINATED CAPACITOR
- Publication number 20240087815
- Publication date Mar 14, 2024
- RUBYCON CORPORATION
- Tomonao KAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR UNIT
- Publication number 20240088205
- Publication date Mar 14, 2024
- Powerchip Semiconductor Manufacturing Corporation
- KUO-YU YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240079181
- Publication date Mar 7, 2024
- Taiyo Yuden Co., Ltd.
- Yoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE FEED-THROUGH CAPACITOR
- Publication number 20240071692
- Publication date Feb 29, 2024
- TDK Corporation
- Yuta KAMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240071689
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myung Chan SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240071690
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Yeop KIM
- H01 - BASIC ELECTRIC ELEMENTS

Form of non-self-supporting electrodes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing multilayer ceramic electronic component and di...

Multilayer ceramic capacitor

Multilayer ceramic capacitor

Multilayer ceramic capacitor including raised portions thicker from...

Ceramic electronic device

Thin film capacitor and manufacturing method therefor

Capacitor component including indium and tin, and method of manufac...

Multi-layer ceramic electronic component

Multi-layer ceramic electronic component and circuit board includin...

Multilayer capacitor and board having the same mounted thereon

Multilayer ceramic capacitor and ceramic material powder

Multilayer capacitor with core-shell dielectric

Ceramic electronic component without external electrodes on top sur...

Multilayer capacitor including internal electrodes having pores on...

Multilayered electronic component and method of manufacturing the same

Multilayer capacitor

Multilayer ceramic capacitor

Ceramic electronic device and manufacturing method of the same

Multilayer capacitor

Dielectric body, multilayer ceramic capacitor, manufacturing method...

Multilayer ceramic capacitor

Ceramic electronic component and method of manufacturing the same

Manufacturing method of multilayer ceramic electronic device

First-stage ceramic collective board, second-stage ceramic collecti...

Thin film capacitor

Method of manufacturing semiconductor structure and semiconductor s...

Dielectric ceramic composition and multi-layered ceramic capacitor...

Multilayer ceramic electronic component and conductive paste for re...

Multilayer electronic component including non-conductive resin laye...

Multilayer electronic component having improved high temperature lo...

Patents Applicationslast 30 patents

MULTILAYER ELECTRONIC COMPONENT

Multilayer Capacitor

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING MU...

Multilayer Capacitor

Multilayer Capacitor

CAPACITOR COMPONENT

MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING MULTILA...

Capacitive Cable

CERAMIC ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF THE SAME

ELECTRONIC DEVICE

ELECTRONIC COMPONENT

ELECTRONIC DEVICE

MULTILAYERED CAPACITOR

SEMICONDUCTOR DEVICE INCLUDING VERTICAL SUPPORTING STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING VERTICAL SUPPORTING STRUCTURE

ALIGNMENT DEVICE AND METHOD OF FORMING EXTERNAL ELECTRODE

MULTILAYER CERAMIC CAPACITOR

MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AN...

MULTILAYER CAPACITOR AND SUBSTRATE INCLUDING THE SAME MOUNTED THEREON

THIN FILM CAPACITORS

BUS CAPACITOR AND AUTOMOBILE

MULTI-LAYERED CERAMIC CAPACITOR

CAPACITOR COMPONENT AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT

THIN FILM HIGH POLYMER LAMINATED CAPACITOR

CAPACITOR UNIT

CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

HIGH VOLTAGE FEED-THROUGH CAPACITOR

METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT