formed through a semiconductor substrate

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H01L21/76898

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76898formed through a semiconductor substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,368,138
- Issue date Jul 22, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor apparatus and semiconductor appa...
- Patent number 12,368,107
- Issue date Jul 22, 2025
- Shin-Etsu Handotai Co., Ltd.
- Tsuyoshi Ohtsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,362,344
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Juhyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,362,326
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor body with a trench, semiconduct...
- Patent number 12,362,230
- Issue date Jul 15, 2025
- ams AG
- Georg Parteder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,362,274
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including TSVs of different lengths...
- Patent number 12,362,243
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing line bending during metal fill process
- Patent number 12,362,188
- Issue date Jul 15, 2025
- Lam Research Corporation
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,354,961
- Issue date Jul 8, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,356,611
- Issue date Jul 8, 2025
- SK Hynix Inc.
- Sung Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring structure
- Patent number 12,354,975
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogenous integration scheme for III-V/Si and Si CMOS integrated...
- Patent number 12,355,024
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing substrate having through-silicon vias, substra...
- Patent number 12,354,914
- Issue date Jul 8, 2025
- Resonac Corporation
- Yoshinori Ejiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,354,929
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device
- Patent number 12,356,688
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Tsung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement buried power rail in backside power delivery
- Patent number 12,354,991
- Issue date Jul 8, 2025
- Tokyo Electron Limited
- Hoyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked devices and methods of fabrication
- Patent number 12,347,820
- Issue date Jul 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure having vias with di...
- Patent number 12,347,730
- Issue date Jul 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor structure and semiconductor structure
- Patent number 12,349,372
- Issue date Jul 1, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,347,748
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Bo Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 12,347,731
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor backside transistor integration with backside power d...
- Patent number 12,341,099
- Issue date Jun 24, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with through-electrode and electrode land...
- Patent number 12,341,084
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Hojin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D trench capacitor for integrated passive devices
- Patent number 12,334,475
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide resists for EUV patterning and methods for developing t...
- Patent number 12,332,568
- Issue date Jun 17, 2025
- Tokyo Electron Limited
- Hamed Hajibabaeinajafabadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via (TSV) validation structure for an integrated...
- Patent number 12,334,416
- Issue date Jun 17, 2025
- NXP USA, INC.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits
- Patent number 12,334,459
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,334,434
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...
- Publication number 20250239541
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HoChe YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC VIAS WITH LOWER PARASITIC CAPACITANCES
- Publication number 20250239488
- Publication date Jul 24, 2025
- HAHN-SCHICKARD-GESELLSCHAFT FUR ANGEWANDTE FORSCHUNG E.V.
- Alfons Dehé
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT
- Publication number 20250239489
- Publication date Jul 24, 2025
- Siemens Healthineers AG
- Michael HOSEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239501
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Via Power Delivery Structure for Stacked Chips
- Publication number 20250233054
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH GLASS SUBSTRATE AND PACKAGING...
- Publication number 20250233060
- Publication date Jul 17, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA STRUCTURE WITH ELECTROSTATIC DISCHARGE PROTECTI...
- Publication number 20250234654
- Publication date Jul 17, 2025
- WINBOND ELECTRONICS CORP.
- Jen-Hao HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP-FILLING METHOD FOR A SEMICONDUCTOR DEVICE AND METHOD OF MANUFAC...
- Publication number 20250233017
- Publication date Jul 17, 2025
- WONIK IPS CO., LTD.
- Chang Gyu SONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS
- Publication number 20250233108
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Mark L. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226277
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED CONDUCTIVE STRUCTURE IN SEMICONDUCTOR SUBSTRATE
- Publication number 20250226291
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kan-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF CAPPING LAYER
- Publication number 20250218867
- Publication date Jul 3, 2025
- Applied Materials, Inc.
- Feng Q. Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250218899
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED ACTIVE CHIP WITHIN INTERPOSER
- Publication number 20250219022
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Manasa MEDIKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250219016
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA WITH SPACED SHALLOW TRENCH ISOLATION
- Publication number 20250218900
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250218902
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT WITH SELECTIVE BACKSIDE POWER AND GROUND DIST...
- Publication number 20250210464
- Publication date Jun 26, 2025
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210589
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE...
- Publication number 20250210468
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20250210415
- Publication date Jun 26, 2025
- WINBOND ELECTRONICS CORP.
- Shih-Han Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORE SUBSTRATE AND METHOD OF PRODUCING THE METAL CORE SUBSTRATE
- Publication number 20250210425
- Publication date Jun 26, 2025
- Nitto Denko Corporation
- Takahiro IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA
- Publication number 20250210462
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH BURIED ELECTRICAL INTERCONNECTIONS
- Publication number 20250210463
- Publication date Jun 26, 2025
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH VIAS OF SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20250201672
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS THEREOF WITH SELECTIVELY FORMED I...
- Publication number 20250201719
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE
- Publication number 20250194281
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES
- Publication number 20250191972
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME
- Publication number 20250194118
- Publication date Jun 12, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE NOISE ISOLATION STRUCTURES FOR ELECTRONIC DEVICES
- Publication number 20250185311
- Publication date Jun 5, 2025
- Xilinx, Inc.
- Jing JING
- H01 - BASIC ELECTRIC ELEMENTS

formed through a semiconductor substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D semiconductor device and structure with metal layers

Microelectronic devices with through-substrate interconnects and as...

Method for producing semiconductor apparatus and semiconductor appa...

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing semiconductor pac...

Method of producing a semiconductor body with a trench, semiconduct...

Package structure and method of forming the same

3D semiconductor memory device and structure

Semiconductor device assemblies including TSVs of different lengths...

Method for preventing line bending during metal fill process

Semiconductor structure and manufacturing method thereof

Semiconductor device and method for fabricating the same

Guard ring structure

Heterogenous integration scheme for III-V/Si and Si CMOS integrated...

Method for producing substrate having through-silicon vias, substra...

Package structure and manufacturing method thereof

Method for forming semiconductor device

Replacement buried power rail in backside power delivery

Stacked devices and methods of fabrication

Method of manufacturing semiconductor structure having vias with di...

Method of forming semiconductor structure and semiconductor structure

Semiconductor device and method of manufacturing the same

Semiconductor components having conductive vias with aligned back s...

Semiconductor backside transistor integration with backside power d...

Integrated circuit device with through-electrode and electrode land...

3D trench capacitor for integrated passive devices

Metal oxide resists for EUV patterning and methods for developing t...

Through substrate via (TSV) validation structure for an integrated...

Integrated circuits

Package structure and method of forming the same

Patents Applicationslast 30 patents

METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...

HERMETIC VIAS WITH LOWER PARASITIC CAPACITANCES

VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT

SEMICONDUCTOR PACKAGE

Through Via Power Delivery Structure for Stacked Chips

SEMICONDUCTOR PACKAGE STRUCTURE WITH GLASS SUBSTRATE AND PACKAGING...

THROUGH-SILICON VIA STRUCTURE WITH ELECTROSTATIC DISCHARGE PROTECTI...

GAP-FILLING METHOD FOR A SEMICONDUCTOR DEVICE AND METHOD OF MANUFAC...

PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

BURIED CONDUCTIVE STRUCTURE IN SEMICONDUCTOR SUBSTRATE

SELECTIVE DEPOSITION OF CAPPING LAYER

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

EMBEDDED ACTIVE CHIP WITHIN INTERPOSER

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

THROUGH SUBSTRATE VIA WITH SPACED SHALLOW TRENCH ISOLATION

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR CIRCUIT WITH SELECTIVE BACKSIDE POWER AND GROUND DIST...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE...

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

METAL CORE SUBSTRATE AND METHOD OF PRODUCING THE METAL CORE SUBSTRATE

THROUGH SILICON VIA

SEMICONDUCTOR DIE WITH BURIED ELECTRICAL INTERCONNECTIONS

THROUGH VIAS OF SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR DEVICES AND METHODS THEREOF WITH SELECTIVELY FORMED I...

MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE

METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES

INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME

SUBSTRATE NOISE ISOLATION STRUCTURES FOR ELECTRONIC DEVICES