formed through a semiconductor substrate

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H01L21/76898

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76898formed through a semiconductor substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having backside interconnect structure on thro...
- Patent number 12,322,680
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,322,679
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 12,324,268
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, method for forming same, and wafer on wafe...
- Patent number 12,322,654
- Issue date Jun 3, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yuanhao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,317,513
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shy-Jay Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having a contact plug electrically conn...
- Patent number 12,317,500
- Issue date May 27, 2025
- Kioxia Corporation
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die with memory macro including through-silicon...
- Patent number 12,308,303
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hidehiro Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV process window and fill performance enhancement by long pulsing...
- Patent number 12,305,307
- Issue date May 20, 2025
- Lam Research Corporation
- Jae Shin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a dummy section
- Patent number 12,300,543
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Osamu Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication process, and electronic device
- Patent number RE50431
- Issue date May 13, 2025
- Sony Group Corporation
- Masaya Nagata
Information Patent Grant
Semiconductor device and method
- Patent number 12,300,580
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,563
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold through silicon mask plating
- Patent number 12,293,943
- Issue date May 6, 2025
- Lam Research Corporation
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Deep trench capacitor array with reduced warpage
- Patent number 12,294,033
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-circuit Vias in interconnect structures
- Patent number 12,293,959
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal based hydrogen barrier
- Patent number 12,288,717
- Issue date Apr 29, 2025
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shared well structure manufacturing method
- Patent number 12,288,786
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Through via structure
- Patent number 12,288,735
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D inductor design using bundle substrate vias
- Patent number 12,283,607
- Issue date Apr 22, 2025
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device, method and system
- Patent number 12,283,586
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ling Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,283,564
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth package structure
- Patent number 12,278,166
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,278,167
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,278,216
- Issue date Apr 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried conductive structure in semiconductor substrate
- Patent number 12,272,621
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kan-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electrostatic discharge protection cell and antenn...
- Patent number 12,272,658
- Issue date Apr 8, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- HoChe Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reflectance isolation structure to increase image sensor perfo...
- Patent number 12,272,715
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of making semiconductor device having self-aligned interconn...
- Patent number 12,266,594
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE NOISE ISOLATION STRUCTURES FOR ELECTRONIC DEVICES
- Publication number 20250185311
- Publication date Jun 5, 2025
- Xilinx, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR FABRICATING A 3D MEMORY STRUCTURE
- Publication number 20250185259
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250183168
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20250183121
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250183122
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME
- Publication number 20250183203
- Publication date Jun 5, 2025
- Medtronic, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE
- Publication number 20250183210
- Publication date Jun 5, 2025
- Infineon Technologies Austria AG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Connection System and Method
- Publication number 20250174591
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...
- Publication number 20250174495
- Publication date May 29, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
- Publication number 20250174523
- Publication date May 29, 2025
- Intel Corporation
- Ravindranath MAHAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A DIE DAMAGE RING AND FABRICATION METHOD T...
- Publication number 20250174557
- Publication date May 29, 2025
- MEDIATEK INC.
- Cing-Yao Jhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250174584
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD
- Publication number 20250163602
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
- Publication number 20250167046
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...
- Publication number 20250167078
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR STRUCTURES INCLUDING A PASSIVE DEVICE
- Publication number 20250167109
- Publication date May 22, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- ANTHONY JEREMY VILLALON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING TSV AND MANUFACTURING METHOD THEREOF
- Publication number 20250157887
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20250157957
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- YONGBUM KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Multiple TSVs with Different Formation Schemes
- Publication number 20250157889
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE SIGNAL TRANSDUCTION ENABLED BY HIGH EFFICIENCY COPPE...
- Publication number 20250157927
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)
- Publication number 20250149407
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...
- Publication number 20250149509
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20250149383
- Publication date May 8, 2025
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITE COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250149423
- Publication date May 8, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya FUNAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20250149510
- Publication date May 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS
- Publication number 20250149500
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK
- Publication number 20250142942
- Publication date May 1, 2025
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250140687
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ling CHANG
- H01 - BASIC ELECTRIC ELEMENTS

formed through a semiconductor substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having backside interconnect structure on thro...

Semiconductor die including through substrate via barrier structure...

Image sensor device

Semiconductor structure, method for forming same, and wafer on wafe...

Semiconductor device and method for forming the same

Semiconductor memory device having a contact plug electrically conn...

Integrated circuit die with memory macro including through-silicon...

TSV process window and fill performance enhancement by long pulsing...

Backside contact for thermal displacement in a multi-wafer stacked...

Method for manufacturing a semiconductor device having a dummy section

Semiconductor device, fabrication process, and electronic device

Semiconductor device and method

Semiconductor package and method of fabricating the same

Gold through silicon mask plating

Deep trench capacitor array with reduced warpage

Through-circuit Vias in interconnect structures

Metal based hydrogen barrier

Shared well structure manufacturing method

Through via structure

3D inductor design using bundle substrate vias

Integrated circuit device, method and system

Semiconductor structure and manufacturing method thereof

High bandwidth package structure

Semiconductor die including through substrate via barrier structure...

3D semiconductor device and structure with metal layers

Buried conductive structure in semiconductor substrate

Method of making electrostatic discharge protection cell and antenn...

High reflectance isolation structure to increase image sensor perfo...

3D semiconductor memory device and structure with memory and metal...

Method of making semiconductor device having self-aligned interconn...

Patents Applicationslast 30 patents

SUBSTRATE NOISE ISOLATION STRUCTURES FOR ELECTRONIC DEVICES

TECHNOLOGIES FOR FABRICATING A 3D MEMORY STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC PACKAGE AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME

SEMICONDUCTOR DEVICE AND PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE

Semiconductor Die Connection System and Method

SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...

NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION

SEMICONDUCTOR DIE HAVING A DIE DAMAGE RING AND FABRICATION METHOD T...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD

VIAS WITH SELECTED GRAIN DISTRIBUTION

SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...

STACKED SEMICONDUCTOR STRUCTURES INCLUDING A PASSIVE DEVICE

SEMICONDUCTOR STRUCTURE HAVING TSV AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

Forming Multiple TSVs with Different Formation Schemes

LOW RESISTANCE SIGNAL TRANSDUCTION ENABLED BY HIGH EFFICIENCY COPPE...

SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)

BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...

TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION

COMPOSITE COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

HETEROGENEOUS ANNEALING METHOD AND DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS

3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME