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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/76898
formed through a semiconductor substrate
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last 30 patents
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Patent Grant
Method probe with high density electrodes, and a formation thereof
Patent number
11,963,774
Issue date
Apr 23, 2024
International Business Machines Corporation
Kangguo Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method of the same
Patent number
11,967,553
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers
Patent number
11,967,583
Issue date
Apr 23, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Assembly including plural through wafer vias, method of cooling the...
Patent number
11,967,548
Issue date
Apr 23, 2024
International Business Machines Corporation
Kerry Bernstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded wafer device structure and methods for making the same
Patent number
11,961,826
Issue date
Apr 16, 2024
Harry-Hak-Lay Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including through-electrodes
Patent number
11,961,788
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Hyoukyung Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers
Patent number
11,961,827
Issue date
Apr 16, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,961,882
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Shaofeng Ding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,955,383
Issue date
Apr 9, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Jie Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal pads over TSV
Patent number
11,955,445
Issue date
Apr 9, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit semiconductor device including through silicon via
Patent number
11,955,408
Issue date
Apr 9, 2024
Samsung Electronics Co., Ltd.
Sohye Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate comprising interconnects in a core layer configured for s...
Patent number
11,955,409
Issue date
Apr 9, 2024
QUALCOMM Incorporated
Aniket Patil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,955,428
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Hsin-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,948,930
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chin-Chuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
11,948,896
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Fu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip suitable for 2.5D and 3D packaging integration a...
Patent number
11,948,838
Issue date
Apr 2, 2024
Qorvo US, Inc.
Deep C. Dumka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structures and method of forming the same
Patent number
11,948,862
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer light detecting device and electronic apparatus
Patent number
11,948,833
Issue date
Apr 2, 2024
Sony Group Corporation
Masaki Okamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through silicon vias and methods of fabricating thereof
Patent number
11,942,368
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Min-Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip packages having bond over active circuit (BOAC)...
Patent number
11,942,407
Issue date
Mar 26, 2024
Texas Instruments Incorporated
Jeffrey Salvacion Solas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrostatic discharge protection cell and antenna integrated with...
Patent number
11,942,441
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
HoChe Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Liquid crystal on silicon panel, and preparation method thereof
Patent number
11,940,698
Issue date
Mar 26, 2024
Advanced Silicon Display Optoelectronics Corporation Ltd.
Yeuk-Keung Fung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state imaging device, method for manufacturing the same, and...
Patent number
11,942,502
Issue date
Mar 26, 2024
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Kyohei Mizuta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor including a back via stack
Patent number
11,935,908
Issue date
Mar 19, 2024
Samsung Electronics Co., Ltd.
Mihye Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having reduced bump height variation
Patent number
11,935,866
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Image sensor device
Patent number
11,935,907
Issue date
Mar 19, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High voltage device with boosted breakdown voltage
Patent number
11,935,918
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Harry-Hak-Lay Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure having thermal dissipation structure therein and...
Patent number
11,935,760
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive feature with non-uniform critical dimension and method o...
Patent number
11,935,816
Issue date
Mar 19, 2024
NANYA TECHNOLOGY CORPORATION
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of forming the same
Patent number
11,929,318
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING MULTI-DIMENSION THROUGH SILICON VIA...
Publication number
20240145435
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ke-Gang Wen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240145366
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Dongjoon Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
Publication number
20240145289
Publication date
May 2, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
Publication number
20240145305
Publication date
May 2, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIA STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20240145344
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Chieh Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE WITH INDUCTOR EMBEDDED IN BONDED SEMICONDUCTOR SUBSTRATES...
Publication number
20240145382
Publication date
May 2, 2024
GLOBALFOUNDRIES U.S. Inc.
Ravi P. Srivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED CHIP AND FABRICATION METHOD OF STACKED CHIP
Publication number
20240136314
Publication date
Apr 25, 2024
Advantest Corporation
Shinji SUGATANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Hybrid Power Rail Formation in Dielectric Isolation for Semiconduct...
Publication number
20240136288
Publication date
Apr 25, 2024
International Business Machines Corporation
Nikhil Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE
Publication number
20240136254
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Sangkoo KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240128122
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Chung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method of Manufacturing the Same
Publication number
20240128157
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chin-Chuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP SIZE PACKAGE AND SYSTEM
Publication number
20240128203
Publication date
Apr 18, 2024
STMicroelectronics Pte Ltd
Jing-En LUAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
Publication number
20240128237
Publication date
Apr 18, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
Publication number
20240128162
Publication date
Apr 18, 2024
Intel Corporation
Ravindranath MAHAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
Publication number
20240128116
Publication date
Apr 18, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
BACKSIDE POWER WITH ON-DIE POWER SWITCHES
Publication number
20240128192
Publication date
Apr 18, 2024
ADVANCED MICRO DEVICES, INC.
Suphachai Sutanthavibul
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process Control Monitor Device Structure for Buried TSV Formation i...
Publication number
20240120242
Publication date
Apr 11, 2024
Raytheon Company
Sean P. Kilcoyne
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Layer-By-Layer Formation Of Through-Substrate Via
Publication number
20240120257
Publication date
Apr 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Chieh Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
Publication number
20240120332
Publication date
Apr 11, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD FOR SEMICONDUCTOR SUB...
Publication number
20240120259
Publication date
Apr 11, 2024
SONY GROUP CORPORATION
KOICHI TAKEUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER VIA WITH REDUCED RESISTANCE
Publication number
20240113022
Publication date
Apr 4, 2024
ADVANCED MICRO DEVICES, INC.
Richard T. Schultz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20240114681
Publication date
Apr 4, 2024
SK HYNIX INC.
Sung Soo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HYBRID INTERCONNECTION
Publication number
20240114703
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Fu TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
Publication number
20240112942
Publication date
Apr 4, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
METHODS FOR FORMING SEMICONDUCTOR PACKAGE
Publication number
20240113034
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hung LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...
Publication number
20240105527
Publication date
Mar 28, 2024
NANYA TECHNOLOGY CORPORATION
Yi-Jen LO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY BACKSIDE CAPACITOR AND INDUCTOR
Publication number
20240105609
Publication date
Mar 28, 2024
International Business Machines Corporation
Heng Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK AND BACKSIDE SINGLE CRYSTAL TRA...
Publication number
20240105612
Publication date
Mar 28, 2024
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILICON CARBIDE POWER DEVICES INTEGRATED WITH SILICON LOGIC DEVICES
Publication number
20240105700
Publication date
Mar 28, 2024
Intel Corporation
Abhishek Anil Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
Publication number
20240105490
Publication date
Mar 28, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE