formed through a semiconductor substrate

Industry

CPC
H01L21/76898

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76898formed through a semiconductor substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including through-silicon via and method of fo...
- Patent number 12,183,660
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Jeonil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process control for package formation
- Patent number 12,183,728
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,176,258
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro bump, method for forming micro bump, chip interconnection str...
- Patent number 12,176,311
- Issue date Dec 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor bidirectional switching device and meth...
- Patent number 12,176,343
- Issue date Dec 24, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Qiyue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, having via wiring, method of manufacturing se...
- Patent number 12,176,265
- Issue date Dec 24, 2024
- Fujitsu Limited
- Naoya Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via formation to enlarge electrochemical plating...
- Patent number 12,176,266
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Ling Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,176,267
- Issue date Dec 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Liang-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with photonic die and method
- Patent number 12,176,270
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating redistribution circuit structure
- Patent number 12,170,223
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric anchors for anchoring a conductive pillar
- Patent number 12,170,243
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lung Yuan Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and elec...
- Patent number 12,166,061
- Issue date Dec 10, 2024
- Sony Group Corporation
- Taku Umebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures and methods of manufacturing the same
- Patent number 12,166,114
- Issue date Dec 10, 2024
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Jingyu Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated circuit device with bonding stru...
- Patent number 12,159,831
- Issue date Dec 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge die with through-silicon vias
- Patent number 12,159,813
- Issue date Dec 3, 2024
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation and bonding methods and structures formed thereby
- Patent number 12,159,860
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside CMOS trench epi with close N2P space
- Patent number 12,154,945
- Issue date Nov 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of wafer thinning
- Patent number 12,154,783
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,154,874
- Issue date Nov 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoto Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating and deplating currents for material co-planarity in semicon...
- Patent number 12,146,235
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate loss reduction for semiconductor devices
- Patent number 12,148,706
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and manufacturing methods thereof
- Patent number 12,148,613
- Issue date Nov 19, 2024
- ENKRIS SEMICONDUCTOR, INC.
- Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell in wafer backside
- Patent number 12,148,682
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Biswanath Senapati
- G11 - INFORMATION STORAGE
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising metal layer configured for electromagnetic inter...
- Patent number 12,142,577
- Issue date Nov 12, 2024
- QUALCOMM Technologies, Inc.
- Marc Huesgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power distribution network semiconductor package and metho...
- Patent number 12,142,564
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip with shared clock distribution network
- Patent number 12,142,528
- Issue date Nov 12, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested architectures for enhanced heterogeneous integration
- Patent number 12,142,545
- Issue date Nov 12, 2024
- Intel Corporation
- Ravindranath Mahajan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES AND METHODS FOR BONDING DIES
- Publication number 20250006689
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CONTACT INTEGRATION IN GALLIUM NITRIDE DEVICES
- Publication number 20250006593
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Dong Seup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE
- Publication number 20250006590
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SELF-ALIGNED NANOMETER THROUGH-SILICON-VIA STRUCTURE AND METHOD OF...
- Publication number 20250006556
- Publication date Jan 2, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Xianyu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING
- Publication number 20250006663
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH IMPROVED METAL CAPPING LAYERS
- Publication number 20250006553
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE VIA STRUCTURES
- Publication number 20250006592
- Publication date Jan 2, 2025
- Intel Corporation
- Ming-Yi Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT WITH TOP CHIP INCLUDING LOCAL...
- Publication number 20240429128
- Publication date Dec 26, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Anupam Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING
- Publication number 20240429131
- Publication date Dec 26, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH CAVITY AROUND THROUGH SEMICONDUCTOR VIA
- Publication number 20240429127
- Publication date Dec 26, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Dewei Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20240429190
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT
- Publication number 20240429099
- Publication date Dec 26, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON
- Publication number 20240429100
- Publication date Dec 26, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20240429252
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Changkeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240429086
- Publication date Dec 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING THROUGH-SUBSTRATE VIAS (TSVs) FOR BACKSIDE INTERC...
- Publication number 20240421790
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240420961
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seunghoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES
- Publication number 20240421079
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421130
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240412991
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-En Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20240413177
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Changkeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20240413185
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- TETSUO GOCHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA PATTERNING FOR BACKSIDE INTERCONNECTS
- Publication number 20240404917
- Publication date Dec 5, 2024
- Intel Corporation
- Sikandar Abbas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...
- Publication number 20240404880
- Publication date Dec 5, 2024
- Lodestar Licensing Group LLC
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240404962
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Hsuan LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404951
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Che CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA AND METHOD FOR FORMING THE SAME
- Publication number 20240405069
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
- Publication number 20240404866
- Publication date Dec 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH VIA AND METHOD OF FABRICATING T...
- Publication number 20240395619
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Yu LEE
- H01 - BASIC ELECTRIC ELEMENTS

formed through a semiconductor substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including through-silicon via and method of fo...

Process control for package formation

Semiconductor package and method manufacturing the same

Micro bump, method for forming micro bump, chip interconnection str...

Nitride-based semiconductor bidirectional switching device and meth...

Semiconductor device, having via wiring, method of manufacturing se...

Through-substrate via formation to enlarge electrochemical plating...

Semiconductor device and method for manufacturing the same

Package structure with photonic die and method

Method of fabricating redistribution circuit structure

Dielectric anchors for anchoring a conductive pillar

Semiconductor device and method of manufacturing the same, and elec...

Semiconductor device structures and methods of manufacturing the same

Method of manufacturing integrated circuit device with bonding stru...

Embedded bridge die with through-silicon vias

Singulation and bonding methods and structures formed thereby

Backside CMOS trench epi with close N2P space

Semiconductor wafer and method of wafer thinning

Methods for producing a 3D semiconductor memory device and structure

Semiconductor device

Plating and deplating currents for material co-planarity in semicon...

Semiconductor device and method having a through substrate via and...

Substrate loss reduction for semiconductor devices

Semiconductor structures and manufacturing methods thereof

Memory cell in wafer backside

Power amplifier modules including semiconductor resistor and tantal...

Package comprising metal layer configured for electromagnetic inter...

Backside power distribution network semiconductor package and metho...

3D chip with shared clock distribution network

Nested architectures for enhanced heterogeneous integration

Patents Applicationslast 30 patents

STRUCTURES AND METHODS FOR BONDING DIES

SUBSTRATE CONTACT INTEGRATION IN GALLIUM NITRIDE DEVICES

DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

SELF-ALIGNED NANOMETER THROUGH-SILICON-VIA STRUCTURE AND METHOD OF...

DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING

SEMICONDUCTOR STRUCTURES WITH IMPROVED METAL CAPPING LAYERS

LOW-RESISTANCE VIA STRUCTURES

THREE-DIMENSIONAL INTEGRATED CIRCUIT WITH TOP CHIP INCLUDING LOCAL...

MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING

STRUCTURE WITH CAVITY AROUND THROUGH SEMICONDUCTOR VIA

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT

THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

DEVICES INCLUDING THROUGH-SUBSTRATE VIAS (TSVs) FOR BACKSIDE INTERC...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

SELF-ALIGNED VIA PATTERNING FOR BACKSIDE INTERCONNECTS

MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

THROUGH-SUBSTRATE VIA AND METHOD FOR FORMING THE SAME

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...

SEMICONDUCTOR DEVICE HAVING THROUGH VIA AND METHOD OF FABRICATING T...