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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83051Forming additional members

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and power conversion device
- Patent number 11,990,447
- Issue date May 21, 2024
- Mitsubishi Electric Corporation
- Isao Oshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic light emitting display device including dam structure and a...
- Patent number 11,968,860
- Issue date Apr 23, 2024
- LG Display Co., Ltd.
- Dongjin Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Package with underfill containment barrier
- Patent number 11,935,805
- Issue date Mar 19, 2024
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment method and apparatus for semiconductor packaging
- Patent number 11,776,880
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 11,664,290
- Issue date May 30, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic light emitting display device including curve-shaped third...
- Patent number 11,552,141
- Issue date Jan 10, 2023
- LG Display Co, Ltd.
- Dongjin Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Micro LED display and manufacturing method with conductive film
- Patent number 11,417,627
- Issue date Aug 16, 2022
- Samsung Electronics Co., Ltd.
- Jamyeong Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing assembly pads on a carrier for the self-a...
- Patent number 11,380,648
- Issue date Jul 5, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Léa Di Cioccio
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 11,211,355
- Issue date Dec 28, 2021
- Mitsubishi Electric Corporation
- Isao Oshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 11,158,558
- Issue date Oct 26, 2021
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic light emitting display device having a multi-directional da...
- Patent number 10,916,604
- Issue date Feb 9, 2021
- LG Display Co., Ltd.
- Dongjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,867,878
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment method and apparatus for semiconductor packaging
- Patent number 10,811,338
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment method and apparatus for semiconductor packaging
- Patent number 10,522,444
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,490,486
- Issue date Nov 26, 2019
- Renesas Electronics Corporation
- Hajime Hasebe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer level package and manufacturing method thereof
- Patent number 10,446,506
- Issue date Oct 15, 2019
- WISOL CO., LTD.
- Jung Hoon Han
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device
- Patent number 10,115,658
- Issue date Oct 30, 2018
- Renesas Electronics Corporation
- Hajime Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and electr...
- Patent number 9,691,805
- Issue date Jun 27, 2017
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,496,204
- Issue date Nov 15, 2016
- Renesas Electronics Corporation
- Hajime Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump-on-lead interconnec...
- Patent number 9,385,101
- Issue date Jul 5, 2016
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,324,644
- Issue date Apr 26, 2016
- Renesas Electronics Corporation
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of forming an etch-back type semiconductor pac...
- Patent number 9,305,868
- Issue date Apr 5, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and electr...
- Patent number 9,275,922
- Issue date Mar 1, 2016
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming narrow interconnect site...
- Patent number 9,258,904
- Issue date Feb 9, 2016
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and process for fabricating same
- Patent number 9,165,900
- Issue date Oct 20, 2015
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High bond line thickness for semiconductor devices
- Patent number 9,147,665
- Issue date Sep 29, 2015
- Fairchild Semiconductor Corporation
- Zhengyu Zhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming bump-on-lead interconnec...
- Patent number 9,064,858
- Issue date Jun 23, 2015
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 9,041,199
- Issue date May 26, 2015
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20240186202
- Publication date Jun 6, 2024
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20230245940
- Publication date Aug 3, 2023
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC LIGHT EMITTING DISPLAY DEVICE
- Publication number 20230116429
- Publication date Apr 13, 2023
- LG Display Co., Ltd.
- Dongjin Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20220013493
- Publication date Jan 13, 2022
- Mitsubishi Electric Corporation
- Isao OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20210391232
- Publication date Dec 16, 2021
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20210202435
- Publication date Jul 1, 2021
- Mitsubishi Electric Corporation
- Isao OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Treatment Method and Apparatus for Semiconductor Packaging
- Publication number 20210050281
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Treatment Method and Apparatus for Semiconductor Packaging
- Publication number 20200126893
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027427
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180358305
- Publication date Dec 13, 2018
- WISOL CO., LTD.
- Jung Hoon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180358308
- Publication date Dec 13, 2018
- WISOL CO., LTD.
- Jung Hoon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...
- Publication number 20150048523
- Publication date Feb 19, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTR...
- Publication number 20140284749
- Publication date Sep 25, 2014
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Treatment Method and Apparatus for Semiconductor Packaging
- Publication number 20140252614
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20140209924
- Publication date Jul 31, 2014
- KABUSHIKI KAISHA TOSHIBA
- Hisao Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PROCESS FOR FABRICATING SAME
- Publication number 20140151876
- Publication date Jun 5, 2014
- Advanced Semiconductor Engineering, Inc.
- YUAN-CHANG SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH
- Publication number 20140103506
- Publication date Apr 17, 2014
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140084440
- Publication date Mar 27, 2014
- HITACHI HOKKAI SEMICONDUCTOR LTD.
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FLIP CHIP PACKAGE
- Publication number 20140030855
- Publication date Jan 30, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Ey Yong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump-on-Lead Interconnec...
- Publication number 20140008792
- Publication date Jan 9, 2014
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE
- Publication number 20130334695
- Publication date Dec 19, 2013
- Edwin TIJSSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20130313563
- Publication date Nov 28, 2013
- KABUSHIKI KAISHA TOSHIBA
- Hisao Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNEC...
- Publication number 20130277826
- Publication date Oct 24, 2013
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACK PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20130256911
- Publication date Oct 3, 2013
- Korea Institute of Machinery and Materials
- Jae-Hak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130203219
- Publication date Aug 8, 2013
- Ji-hyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Adjacent Channel and Dam...
- Publication number 20130147065
- Publication date Jun 13, 2013
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130020725
- Publication date Jan 24, 2013
- FUJI ELECTRIC CO., LTD.
- Kazunaga Onishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130020692
- Publication date Jan 24, 2013
- Renesas Electronics Corporation
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK
- Publication number 20130017652
- Publication date Jan 17, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
- Publication number 20130009296
- Publication date Jan 10, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS

Forming additional members

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and power conversion device

Organic light emitting display device including dam structure and a...

Package with underfill containment barrier

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Surface treatment method and apparatus for semiconductor packaging

Package with underfill containment barrier

Organic light emitting display device including curve-shaped third...

Micro LED display and manufacturing method with conductive film

Process for manufacturing assembly pads on a carrier for the self-a...

Semiconductor device, method for manufacturing semiconductor device...

Package with underfill containment barrier

Organic light emitting display device having a multi-directional da...

Dam for three-dimensional integrated circuit

Surface treatment method and apparatus for semiconductor packaging

Surface treatment method and apparatus for semiconductor packaging

Semiconductor device

Wafer level package and manufacturing method thereof

Semiconductor device

Semiconductor device, method for manufacturing the same, and electr...

Semiconductor device

Semiconductor device and method of forming bump-on-lead interconnec...

Semiconductor device

Manufacturing method of forming an etch-back type semiconductor pac...

Semiconductor device, method for manufacturing the same, and electr...

Semiconductor device and method of forming narrow interconnect site...

Semiconductor package and process for fabricating same

High bond line thickness for semiconductor devices

Chip-on-wafer bonding method and bonding device, and structure comp...

Semiconductor device and method of forming bump-on-lead interconnec...

Semiconductor device and method of fabricating the same

Patents Applicationslast 30 patents

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

ORGANIC LIGHT EMITTING DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

Surface Treatment Method and Apparatus for Semiconductor Packaging

Surface Treatment Method and Apparatus for Semiconductor Packaging

SEMICONDUCTOR DEVICE

WAFER LEVEL PACKAGE AND MANUFACTURING METHOD THEREOF

WAFER LEVEL PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTR...

Surface Treatment Method and Apparatus for Semiconductor Packaging

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR PACKAGE AND PROCESS FOR FABRICATING SAME

SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING FLIP CHIP PACKAGE

Semiconductor Device and Method of Forming Bump-on-Lead Interconnec...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNEC...

SEMICONDUCTOR CHIP STACK PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Forming Adjacent Channel and Dam...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING