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H01L2224/85951

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85951Forming additional members

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,373,979
- Issue date Jun 28, 2022
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,189,595
- Issue date Nov 30, 2021
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented shielding using wirebonds
- Patent number 11,127,689
- Issue date Sep 21, 2021
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,825,758
- Issue date Nov 3, 2020
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 10,756,049
- Issue date Aug 25, 2020
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,566,255
- Issue date Feb 18, 2020
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,431,529
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 10,134,648
- Issue date Nov 20, 2018
- Renesas Electronics Corporation
- Toshihiko Akiba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,083,900
- Issue date Sep 25, 2018
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 10,062,667
- Issue date Aug 28, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,761,558
- Issue date Sep 12, 2017
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,716,054
- Issue date Jul 25, 2017
- Rohm Co., Ltd.
- Akihiro Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,653,377
- Issue date May 16, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bond pad wiring lead-out arrangement avoi...
- Patent number 9,646,901
- Issue date May 9, 2017
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 9,515,046
- Issue date Dec 6, 2016
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device
- Patent number 9,502,456
- Issue date Nov 22, 2016
- Hamamatsu Photonics K.K.
- Shin-ichiro Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) card having an IC module and reduced bond w...
- Patent number 9,449,912
- Issue date Sep 20, 2016
- STMicroelectronics Pte Ltd
- Xueren Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,443,816
- Issue date Sep 13, 2016
- Rohm Co., Ltd.
- Akihiro Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package
- Patent number 9,437,791
- Issue date Sep 6, 2016
- LG Innotek Co., Ltd
- Byung Mok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,397,037
- Issue date Jul 19, 2016
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with removable backing element ha...
- Patent number 9,337,161
- Issue date May 10, 2016
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of manufacturing the same
- Patent number 9,252,123
- Issue date Feb 2, 2016
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,252,122
- Issue date Feb 2, 2016
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of manufacturing the same
- Patent number 9,171,821
- Issue date Oct 27, 2015
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,165,845
- Issue date Oct 20, 2015
- Renesas Electronics Corporation
- Toshihiko Akiba
- G01 - MEASURING TESTING
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,105,483
- Issue date Aug 11, 2015
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,041,227
- Issue date May 26, 2015
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module system having encapsulated through wire interc...
- Patent number 9,018,751
- Issue date Apr 28, 2015
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
STRENGTHENED WIRE-BOND
- Publication number 20220020717
- Publication date Jan 20, 2022
- Semiconductor Components Industries, LLC
- WuXing Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190378787
- Publication date Dec 12, 2019
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEGMENTED SHIELDING USING WIREBONDS
- Publication number 20190371738
- Publication date Dec 5, 2019
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190348332
- Publication date Nov 14, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20190057913
- Publication date Feb 21, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180366397
- Publication date Dec 20, 2018
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20180358331
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20180026007
- Publication date Jan 25, 2018
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170229382
- Publication date Aug 10, 2017
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361299
- Publication date Dec 11, 2014
- Toshihiko Akiba
- G01 - MEASURING TESTING
Information Patent Application
Integrated Circuit Package System with Removable Backing Element Ha...
- Publication number 20140332955
- Publication date Nov 13, 2014
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140284784
- Publication date Sep 25, 2014
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140264383
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transducer Assembly for an Imaging Device
- Publication number 20140257107
- Publication date Sep 11, 2014
- VOLCANO CORPORATION
- Cheryl Rice
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE
- Publication number 20140167095
- Publication date Jun 19, 2014
- LG Innotek Co., Ltd.
- Byung Mok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND CHIP PACKAGE USING THE SAME
- Publication number 20140118978
- Publication date May 1, 2014
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...
- Publication number 20140038406
- Publication date Feb 6, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130328219
- Publication date Dec 12, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Wire Interconnect (TWI) For Semiconductor Components Having...
- Publication number 20130299983
- Publication date Nov 14, 2013
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20130217183
- Publication date Aug 22, 2013
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20130200514
- Publication date Aug 8, 2013
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130200533
- Publication date Aug 8, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130193438
- Publication date Aug 1, 2013
- RENESAS ELECTRONICS CORPORATION
- Toshihiko Akiba
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130095610
- Publication date Apr 18, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130093080
- Publication date Apr 18, 2013
- Won-Gil HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130093087
- Publication date Apr 18, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130093088
- Publication date Apr 18, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130043502
- Publication date Feb 21, 2013
- PANASONIC CORPORATION
- Kenichi Koya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20130003381
- Publication date Jan 3, 2013
- Toyoda Gosei Co., Ltd.
- Hideki KOKUBU
- H01 - BASIC ELECTRIC ELEMENTS

Forming additional members

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked microfeature devices and associated methods

Package-on-package assembly with wire bond vias

Stacked microfeature devices and associated methods

Package-on-package assembly with wire bond vias

Segmented shielding using wirebonds

Semiconductor device

Package-on-package assembly with wire bond vias

Method of manufacturing semiconductor device

Semiconductor device

Manufacturing method of semiconductor device

Semiconductor device

Stacked microfeature devices and associated methods

Package-on-package assembly with wire bond vias

Semiconductor device

Semiconductor device

Semiconductor device with bond pad wiring lead-out arrangement avoi...

Stacked microfeature devices and associated methods

Electronic component device

Integrated circuit (IC) card having an IC module and reduced bond w...

Semiconductor device

Light emitting device package

Semiconductor device

Integrated circuit package system with removable backing element ha...

Multi-chip package and method of manufacturing the same

Package-on-package assembly with wire bond vias

Semiconductor packages and methods of manufacturing the same

Semiconductor device

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bond vias

Semiconductor module system having encapsulated through wire interc...

Patents Applicationslast 30 patents

STRENGTHENED WIRE-BOND

SEMICONDUCTOR DEVICE

SEGMENTED SHIELDING USING WIREBONDS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Integrated Circuit Package System with Removable Backing Element Ha...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Transducer Assembly for an Imaging Device

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

LIGHT EMITTING DEVICE PACKAGE

PACKAGE SUBSTRATE AND CHIP PACKAGE USING THE SAME

METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

Through Wire Interconnect (TWI) For Semiconductor Components Having...

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SEMICONDUCTOR DEVICE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

LIGHT EMITTING DEVICE