Forming connectors during the connecting process

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H01L2224/9201

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/9201Forming connectors during the connecting process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Close butted collocated variable technology imaging arrays on a sin...
- Patent number 12,051,712
- Issue date Jul 30, 2024
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the display device
- Patent number 11,749,658
- Issue date Sep 5, 2023
- Samsung Display Co., Ltd.
- Ji Hye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Close butted collocated variable technology imaging arrays on a sin...
- Patent number 11,705,471
- Issue date Jul 18, 2023
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly and method therefor
- Patent number 11,557,565
- Issue date Jan 17, 2023
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the display device
- Patent number 11,380,664
- Issue date Jul 5, 2022
- Samsung Display Co., Ltd.
- Ji Hye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,174,157
- Issue date Nov 16, 2021
- Advanced Semiconductor Engineering Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Arrangement of multiple power semiconductor chips and method of man...
- Patent number 10,049,962
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable device assembly
- Patent number 9,893,030
- Issue date Feb 13, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a reliable microelectronic assembly
- Patent number 9,398,700
- Issue date Jul 19, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising at least a chip enclosed in a package...
- Patent number 9,159,652
- Issue date Oct 13, 2015
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of semiconductor structures and corresponding manufacturing m...
- Patent number 9,093,456
- Issue date Jul 28, 2015
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of semiconductor structures and corresponding manufacturing m...
- Patent number 8,907,481
- Issue date Dec 9, 2014
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 8,692,386
- Issue date Apr 8, 2014
- Fujitsu Limited
- Toshiya Akamatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip, wafer stack package using the same, and methods...
- Patent number 8,119,448
- Issue date Feb 21, 2012
- Samsung Electronics Co., Ltd.
- Son-Kwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting body, flip chip mounting method and flip chip mo...
- Patent number 8,071,425
- Issue date Dec 6, 2011
- Panasonic Corporation
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mutually connecting substrates, flip chip mounting body,...
- Patent number 7,919,357
- Issue date Apr 5, 2011
- Panasonic Corporation
- Susumu Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal filled through via structure for providing vertical wafer-to-...
- Patent number 7,821,120
- Issue date Oct 26, 2010
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting body, flip chip mounting method and flip chip mo...
- Patent number 7,732,920
- Issue date Jun 8, 2010
- Panasonic Corporation
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive connection, electronic component and method...
- Patent number 7,626,262
- Issue date Dec 1, 2009
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with stacked chips and method for manufacturin...
- Patent number 7,605,019
- Issue date Oct 20, 2009
- Qimonda AG
- Juergen Simon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated circuit
- Patent number 7,579,268
- Issue date Aug 25, 2009
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package (MCP) with a conductive bar and method for manuf...
- Patent number 7,531,890
- Issue date May 12, 2009
- Samsung Electronics Co., Ltd.
- Gu-Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal filled through via structure for providing vertical wafer-to-...
- Patent number 7,344,959
- Issue date Mar 18, 2008
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package (MCP) with a conductive bar and method for manuf...
- Patent number 6,908,785
- Issue date Jun 21, 2005
- Samsung Electronics Co., Ltd.
- Gu-Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, circuit...
- Patent number 6,806,176
- Issue date Oct 19, 2004
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, circuit...
- Patent number 6,642,615
- Issue date Nov 4, 2003
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUFFER LAYER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20250054898
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361073
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...
- Publication number 20230282665
- Publication date Sep 7, 2023
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE DISPLAY DEVICE
- Publication number 20220320059
- Publication date Oct 6, 2022
- SAMSUNG DISPLAY CO., LTD.
- Ji Hye LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...
- Publication number 20220130883
- Publication date Apr 28, 2022
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR
- Publication number 20220108973
- Publication date Apr 7, 2022
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE DISPLAY DEVICE
- Publication number 20210272943
- Publication date Sep 2, 2021
- SAMSUNG DISPLAY CO., LTD.
- Ji Hye LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20200002162
- Publication date Jan 2, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RELIABLE DEVICE ASSEMBLY
- Publication number 20140376200
- Publication date Dec 25, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT
- Publication number 20140328039
- Publication date Nov 6, 2014
- Paul J. Koep
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Bonding Semiconductor Devices
- Publication number 20140242777
- Publication date Aug 28, 2014
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AT LEAST A CHIP ENCLOSED IN A PACKAGE...
- Publication number 20140239502
- Publication date Aug 28, 2014
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK OF SEMICONDUCTOR STRUCTURES AND CORRESPONDING MANUFACTURING M...
- Publication number 20130292823
- Publication date Nov 7, 2013
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METH...
- Publication number 20120319268
- Publication date Dec 20, 2012
- Tomohiro Kagimoto
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20120193782
- Publication date Aug 2, 2012
- Fujitsu Limited
- Toshiya Akamatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP, WAFER STACK PACKAGE USING THE SAME, AND METHODS...
- Publication number 20110097846
- Publication date Apr 28, 2011
- Son-Kwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...
- Publication number 20100203675
- Publication date Aug 12, 2010
- PANASONIC CORPORATION
- Seiichi NAKATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY,...
- Publication number 20100001411
- Publication date Jan 7, 2010
- Susumu SAWADA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD
- Publication number 20090085227
- Publication date Apr 2, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...
- Publication number 20090008800
- Publication date Jan 8, 2009
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FILLED THROUGH VIA STRUCTURE FOR PROVIDING VERTICAL WAFER-TO-...
- Publication number 20080105976
- Publication date May 8, 2008
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with stacked chips and method for manufacturin...
- Publication number 20080032448
- Publication date Feb 7, 2008
- Juergen Simon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Conductive Connection, Electronic Component and Method...
- Publication number 20070290337
- Publication date Dec 20, 2007
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing an Integrated Circuit
- Publication number 20070287225
- Publication date Dec 13, 2007
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070262468
- Publication date Nov 15, 2007
- Hayato Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Growth of carbon nanotubes to join surfaces
- Publication number 20060251897
- Publication date Nov 9, 2006
- Molecular Nanosystems, Inc.
- Lawrence S. Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip package (MCP) with a conductive bar and method for manuf...
- Publication number 20050205968
- Publication date Sep 22, 2005
- Samsung Electronics Co., Ltd.
- Gu-Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same, circuit...
- Publication number 20040072413
- Publication date Apr 15, 2004
- SEIKO EPSON CORPORATION
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip package (MCP) with a conductive bar and method for manuf...
- Publication number 20030107119
- Publication date Jun 12, 2003
- Samsung Electronics Co., Ltd.
- Gu-Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same, circuit...
- Publication number 20010028105
- Publication date Oct 11, 2001
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS

Forming connectors during the connecting process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Close butted collocated variable technology imaging arrays on a sin...

Display device and method of fabricating the display device

Close butted collocated variable technology imaging arrays on a sin...

Semiconductor device assembly and method therefor

Display device and method of fabricating the display device

Semiconductor device packages and methods of manufacturing the same

Method for electrically contacting a component by galvanic connecti...

Arrangement of multiple power semiconductor chips and method of man...

Reliable device assembly

Electrode connection structure and electrode connection method

Method of forming a reliable microelectronic assembly

Electronic device comprising at least a chip enclosed in a package...

Stack of semiconductor structures and corresponding manufacturing m...

Stack of semiconductor structures and corresponding manufacturing m...

Semiconductor device, method of manufacturing semiconductor device,...

Semiconductor chip, wafer stack package using the same, and methods...

Flip chip mounting body, flip chip mounting method and flip chip mo...

Method for mutually connecting substrates, flip chip mounting body,...

Metal filled through via structure for providing vertical wafer-to-...

Flip chip mounting body, flip chip mounting method and flip chip mo...

Electrically conductive connection, electronic component and method...

Semiconductor device with stacked chips and method for manufacturin...

Method of manufacturing an integrated circuit

Multi-chip package (MCP) with a conductive bar and method for manuf...

Metal filled through via structure for providing vertical wafer-to-...

Multi-chip package (MCP) with a conductive bar and method for manuf...

Semiconductor device and method of manufacturing the same, circuit...

Semiconductor device and method of manufacturing the same, circuit...

Patents Applicationslast 30 patents

BUFFER LAYER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...

DISPLAY DEVICE AND METHOD OF FABRICATING THE DISPLAY DEVICE

CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...

SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR

DISPLAY DEVICE AND METHOD OF FABRICATING THE DISPLAY DEVICE

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

RELIABLE DEVICE ASSEMBLY

SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT

Method for Bonding Semiconductor Devices

ELECTRONIC DEVICE COMPRISING AT LEAST A CHIP ENCLOSED IN A PACKAGE...

STACK OF SEMICONDUCTOR STRUCTURES AND CORRESPONDING MANUFACTURING M...

CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METH...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR CHIP, WAFER STACK PACKAGE USING THE SAME, AND METHODS...

FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...

METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY,...

FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD

FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...

METAL FILLED THROUGH VIA STRUCTURE FOR PROVIDING VERTICAL WAFER-TO-...

Semiconductor device with stacked chips and method for manufacturin...

Electrically Conductive Connection, Electronic Component and Method...

Method of Manufacturing an Integrated Circuit

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Growth of carbon nanotubes to join surfaces

Multi-chip package (MCP) with a conductive bar and method for manuf...

Semiconductor device and method of manufacturing the same, circuit...

Multi-chip package (MCP) with a conductive bar and method for manuf...

Semiconductor device and method of manufacturing the same, circuit...