Forming openings in dielectrics

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H01L2221/101

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

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H01L2221/101Forming openings in dielectrics

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 12,125,741
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a conductive pillar and methods of man...
- Patent number 12,027,495
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Kun Sil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 11,862,512
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and electronic device
- Patent number 11,669,181
- Issue date Jun 6, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Tatsuya Sakuishi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device and electronic device
- Patent number 11,199,920
- Issue date Dec 14, 2021
- Semiconductor Energy Laboratory Co., Ltd.
- Tatsuya Sakuishi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Creating an aligned via and metal line in an integrated circuit inc...
- Patent number 11,081,387
- Issue date Aug 3, 2021
- Marvell Asia Pte, Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a conductive pillar and methods of man...
- Patent number 11,031,375
- Issue date Jun 8, 2021
- Samsung Electronics Co., Ltd.
- Kun Sil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnect structure
- Patent number 11,011,419
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Zen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 10,937,688
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of metal wraparound for low via resistance
- Patent number 10,636,737
- Issue date Apr 28, 2020
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnect structure
- Patent number 10,629,481
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Zen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of creating aligned vias in ultra-high density integrated ci...
- Patent number 10,522,394
- Issue date Dec 31, 2019
- Marvell World Trade Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for building up a fan-out RDL structure with fine pitch line...
- Patent number 10,504,845
- Issue date Dec 10, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and electronic device
- Patent number 10,496,203
- Issue date Dec 3, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Tatsuya Sakuishi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic conductive routes and methods of making the same
- Patent number 10,497,613
- Issue date Dec 3, 2019
- Intel Corporation
- Jasmeet S. Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control method for differentiated etching depth
- Patent number 10,418,276
- Issue date Sep 17, 2019
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio gap fill
- Patent number 10,361,112
- Issue date Jul 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 10,276,428
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for building up a fan-out RDL structure with fine pitch line...
- Patent number 9,978,700
- Issue date May 22, 2018
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and electronic device
- Patent number 9,772,706
- Issue date Sep 26, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Tatsuya Sakuishi
- G02 - OPTICS
Information Patent Grant
Method for forming interconnect structure
- Patent number 9,716,034
- Issue date Jul 25, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Zen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing display substrate, repair method of display...
- Patent number 9,618,815
- Issue date Apr 11, 2017
- Samsung Display Co., Ltd.
- Hong-Beom Lee
- G02 - OPTICS
Information Patent Grant
Air gaps between copper lines
- Patent number 9,396,989
- Issue date Jul 19, 2016
- Applied Materials, Inc.
- Vinod R. Purayath
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate manufacturing method
- Patent number 9,380,711
- Issue date Jun 28, 2016
- MEIKO ELECTRONICS CO., LTD.
- Shukichi Takii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plasma etching method and semiconductor device manufacturing method
- Patent number 9,330,930
- Issue date May 3, 2016
- Tokyo Electron Limited
- Kazuhiro Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnect structure
- Patent number 9,190,319
- Issue date Nov 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsuan-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method and semiconductor device manufacturing method
- Patent number 9,048,178
- Issue date Jun 2, 2015
- Tokyo Electron Limited
- Kazuhiro Kubota
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20240071814
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20230377951
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Device and Electronic Device
- Publication number 20220100306
- Publication date Mar 31, 2022
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Tatsuya Sakuishi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20210183694
- Publication date Jun 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Interconnect Structure
- Publication number 20200227316
- Publication date Jul 16, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Bor-Zen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CREATING AN ALIGNED VIA AND METAL LINE IN AN INTEGRATED CIRCUIT INC...
- Publication number 20200118868
- Publication date Apr 16, 2020
- Marvell World Trade Ltd.
- Runzi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Device and Electronic Device
- Publication number 20200104001
- Publication date Apr 2, 2020
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Tatsuya Sakuishi
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20190067086
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO GAP FILL
- Publication number 20190006227
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Building up a Fan-Out RDL Structure with Fine Pitch Line...
- Publication number 20180233467
- Publication date Aug 16, 2018
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Device and Electronic Device
- Publication number 20180024680
- Publication date Jan 25, 2018
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Tatsuya Sakuishi
- G02 - OPTICS
Information Patent Application
Method for Forming Interconnect Structure
- Publication number 20170323827
- Publication date Nov 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Zen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Forming Interconnect Structure
- Publication number 20140252621
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsuan-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20140234992
- Publication date Aug 21, 2014
- TOKYO ELECTRON LIMITED
- Kazuhiro Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Manufacturing Method
- Publication number 20140224762
- Publication date Aug 14, 2014
- Meiko Electronics Co., Ltd.
- Shukichi Takii
- H01 - BASIC ELECTRIC ELEMENTS

Forming openings in dielectrics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of fabricating semiconductor package

Semiconductor devices having a conductive pillar and methods of man...

Semiconductor package and method of fabricating semiconductor package

Display device and electronic device

Display device and electronic device

Creating an aligned via and metal line in an integrated circuit inc...

Semiconductor devices having a conductive pillar and methods of man...

Method for forming interconnect structure

Semiconductor package and method of fabricating semiconductor package

Structure and method of metal wraparound for low via resistance

Method for forming interconnect structure

Method of creating aligned vias in ultra-high density integrated ci...

Method for building up a fan-out RDL structure with fine pitch line...

Display device and electronic device

Microelectronic conductive routes and methods of making the same

Control method for differentiated etching depth

High aspect ratio gap fill

Semiconductor package and method of fabricating semiconductor package

Method for building up a fan-out RDL structure with fine pitch line...

Display device and electronic device

Method for forming interconnect structure

Method of manufacturing display substrate, repair method of display...

Air gaps between copper lines

Substrate manufacturing method

Plasma etching method and semiconductor device manufacturing method

Method for forming interconnect structure

Plasma etching method and semiconductor device manufacturing method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

Display Device and Electronic Device

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

Method for Forming Interconnect Structure

CREATING AN ALIGNED VIA AND METAL LINE IN AN INTEGRATED CIRCUIT INC...

Display Device and Electronic Device

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

HIGH ASPECT RATIO GAP FILL

Method for Building up a Fan-Out RDL Structure with Fine Pitch Line...

Display Device and Electronic Device

Method for Forming Interconnect Structure

Method For Forming Interconnect Structure

PLASMA ETCHING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Substrate Manufacturing Method