Forming the micromechanical structure with a CMOS process

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B81C2203/0714

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

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B81C2203/0714Forming the micromechanical structure with a CMOS process

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Patents Grantslast 30 patents

Information Patent Grant
Monolithic post complementary metal-oxide-semiconductor integration...
- Patent number 12,168,603
- Issue date Dec 17, 2024
- MERIDIAN INNOVATION PTE LTD
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure for CMOS-MEMS thin film encapsulation
- Patent number 12,134,555
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Gas sensor MEMS structures and methods of fabrication thereof
- Patent number 11,988,600
- Issue date May 21, 2024
- National University of Singapore
- Enrico Macrelli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated digital force sensors and related methods of manufacture
- Patent number 11,946,817
- Issue date Apr 2, 2024
- DecaWave, Ltd.
- Ali Foughi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heterogenous integration of complementary metal-oxide-semiconductor...
- Patent number 11,845,653
- Issue date Dec 19, 2023
- MERIDIAN INNOVATION PTE LTD
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bi-layer metal electrode for micromachined ultrasonic transducer de...
- Patent number 11,766,696
- Issue date Sep 26, 2023
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure for CMOS-MEMS thin film encapsulation
- Patent number 11,667,517
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS structure and manufacturing method thereof
- Patent number 11,505,454
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kang-Che Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated digital force sensors and related methods of manufacture
- Patent number 11,255,737
- Issue date Feb 22, 2022
- NEXTINPUT, INC.
- Ali Foughi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) structures and design struct...
- Patent number 11,167,980
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Michael T. Brigham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices including MEMS dies and connectors thereto
- Patent number 11,117,796
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device, method for manufacturing a microelec...
- Patent number 11,078,072
- Issue date Aug 3, 2021
- Infineon Technologies Dresden GmbH & Co. KG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Complementary metal-oxide-semiconductor (CMOS) micro electro-mechan...
- Patent number 11,008,215
- Issue date May 18, 2021
- Chuan-Wei Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support pillar
- Patent number 10,961,113
- Issue date Mar 30, 2021
- Chien-Chang Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS structure with an etch stop layer buried within inter-dielectr...
- Patent number 10,927,000
- Issue date Feb 23, 2021
- United Microelectronics Corp.
- Li-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Group III-N MEMS structures on a group IV substrate
- Patent number 10,850,977
- Issue date Dec 1, 2020
- Intel Corporation
- Han Wui Then
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices including MEMS dies and connectors thereto
- Patent number 10,710,871
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure for CMOS-MEMS thin film encapsulation
- Patent number 10,689,247
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device, method for manufacturing a microelec...
- Patent number 10,683,203
- Issue date Jun 16, 2020
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating MEMS device integrated with a semiconductor...
- Patent number 10,640,372
- Issue date May 5, 2020
- United Microelectronics Corp.
- Tsong-Lin Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) structures and design struct...
- Patent number 10,589,991
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Michael T. Brigham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) structures and design struct...
- Patent number 10,589,992
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Michael T. Brigham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support pillar
- Patent number 10,562,759
- Issue date Feb 18, 2020
- Chien-Chang Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support pillar
- Patent number 10,562,760
- Issue date Feb 18, 2020
- Chien-Chang Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) structures and design struct...
- Patent number 10,549,987
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Michael T. Brigham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices including MEMS dies and connectors thereto
- Patent number 10,508,023
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device integrated with a semiconductor integrated circuit and...
- Patent number 10,472,232
- Issue date Nov 12, 2019
- United Microelectronics Corp.
- Tsong-Lin Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrating MEMS structures with interconnects and vias
- Patent number 10,457,548
- Issue date Oct 29, 2019
- Intel Corporation
- Kevin Lai Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for manufacturing a microelectromechanical interaction syst...
- Patent number 10,221,066
- Issue date Mar 5, 2019
- STMicroelectronics S.r.l.
- Giuseppe Barillaro
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hybrid CMOS-MEMS devices adapted for high-temperature operation and...
- Patent number 10,214,415
- Issue date Feb 26, 2019
- National Technology & Engineering Solutions of Sandia, LLC
- Benjamin Griffin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230386948
- Publication date Nov 30, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- You-Ru Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Structure for CMOS-MEMS Thin Film Encapsulation
- Publication number 20230278856
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED DIGITAL FORCE SENSORS AND RELATED METHODS OF MANUFACTURE
- Publication number 20220268648
- Publication date Aug 25, 2022
- NextInput, Inc.
- Ali Foughi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HETEROGENOUS INTEGRATION OF COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR...
- Publication number 20220162062
- Publication date May 26, 2022
- Meridian Innovation Pte Ltd
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED MEMS-CMOS ULTRASONIC SENSOR
- Publication number 20220130899
- Publication date Apr 28, 2022
- Shenzhen Goodix Technology Co., Ltd.
- Mostafa SOLIMAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210087056
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- KANG-CHE HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Structure for CMOS-MEMS Thin Film Encapsulation
- Publication number 20200317506
- Publication date Oct 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE, METHOD FOR MANUFACTURING A MICROELE...
- Publication number 20200290867
- Publication date Sep 17, 2020
- Infineon Technologies Dresden GmbH & Co. KG
- Thoralf KAUTZSCH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) MICRO ELECTRO-MECHAN...
- Publication number 20200207613
- Publication date Jul 2, 2020
- CHUAN-WEI WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED DIGITAL FORCE SENSORS AND RELATED METHODS OF MANUFACTURE
- Publication number 20190383676
- Publication date Dec 19, 2019
- NextInput, Inc.
- Ali Foughi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING MEMS DEVICE INTEGRATED WITH A SEMICONDUCTOR...
- Publication number 20190345029
- Publication date Nov 14, 2019
- UNITED MICROELECTRONICS CORP.
- Tsong-Lin Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURES AND DESIGN STRUCT...
- Publication number 20180201503
- Publication date Jul 19, 2018
- International Business Machines Corporation
- Michael T. Brigham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURES AND DESIGN STRUCT...
- Publication number 20180201502
- Publication date Jul 19, 2018
- International Business Machines Corporation
- Michael T. Brigham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Devices Including MEMS Dies and Connectors Thereto
- Publication number 20180194613
- Publication date Jul 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURES AND DESIGN STRUCT...
- Publication number 20180179052
- Publication date Jun 28, 2018
- International Business Machines Corporation
- Michael T. Brigham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20180162725
- Publication date Jun 14, 2018
- UNITED MICROELECTRONICS CORP.
- Tsong-Lin Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Structure for CMOS-MEMS Thin Film Encapsulation
- Publication number 20180118560
- Publication date May 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATING MEMS STRUCTURES WITH INTERCONNECTS AND VIAS
- Publication number 20180086627
- Publication date Mar 29, 2018
- Intel Corporation
- Kevin LAI LIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUPPORT PILLAR
- Publication number 20170355592
- Publication date Dec 14, 2017
- Foresee Technology Corp.
- Chien-Chang CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUPPORT PILLAR
- Publication number 20170313575
- Publication date Nov 2, 2017
- Foresee Technology Corp.
- Chien-Chang CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUPPORT PILLAR
- Publication number 20170313576
- Publication date Nov 2, 2017
- Foresee Technology Corp.
- Chien-Chang CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GETTER ELECTRODE TO IMPROVE VACUUM LEVEL IN A MICROELECTROMECHANICA...
- Publication number 20170297904
- Publication date Oct 19, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Shiang-Chi Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Structure for CMOS-MEMS Thin Film Encapsulation
- Publication number 20170260042
- Publication date Sep 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170088417
- Publication date Mar 30, 2017
- XINTEC INC.
- Yu-Chen LAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS STRUCTURE WITH AN ETCH STOP LAYER BURIED WITHIN INTER-DIELECTR...
- Publication number 20170036905
- Publication date Feb 9, 2017
- UNITED MICROELECTRONICS CORP.
- Li-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20170005045
- Publication date Jan 5, 2017
- NXP B.V.
- Matthias Merz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Devices and Methods for Forming Same
- Publication number 20160368762
- Publication date Dec 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUPPORT PILLAR
- Publication number 20160332865
- Publication date Nov 17, 2016
- Foresee Technology Corp.
- Chien-Chan CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MANUFACTURING A MICROELECTROMECHANICAL INTERACTION SYST...
- Publication number 20160332871
- Publication date Nov 17, 2016
- STMicroelectronics S.r.l.
- Giuseppe Barillaro
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PRESSURE SENSOR AND METHOD OF FABRICATING SAME
- Publication number 20160272487
- Publication date Sep 22, 2016
- Mitsubishi Electric Corporation
- Kimitoshi SATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Forming the micromechanical structure with a CMOS process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Monolithic post complementary metal-oxide-semiconductor integration...

Method and structure for CMOS-MEMS thin film encapsulation

Gas sensor MEMS structures and methods of fabrication thereof

Integrated digital force sensors and related methods of manufacture

Heterogenous integration of complementary metal-oxide-semiconductor...

Bi-layer metal electrode for micromachined ultrasonic transducer de...

Method and structure for CMOS-MEMS thin film encapsulation

MEMS structure and manufacturing method thereof

Integrated digital force sensors and related methods of manufacture

Micro-electro-mechanical system (MEMS) structures and design struct...

MEMS devices including MEMS dies and connectors thereto

Microelectromechanical device, method for manufacturing a microelec...

Complementary metal-oxide-semiconductor (CMOS) micro electro-mechan...

Support pillar

MEMS structure with an etch stop layer buried within inter-dielectr...

Group III-N MEMS structures on a group IV substrate

MEMS devices including MEMS dies and connectors thereto

Method and structure for CMOS-MEMS thin film encapsulation

Microelectromechanical device, method for manufacturing a microelec...

Method for fabricating MEMS device integrated with a semiconductor...

Micro-electro-mechanical system (MEMS) structures and design struct...

Micro-electro-mechanical system (MEMS) structures and design struct...

Support pillar

Support pillar

Micro-electro-mechanical system (MEMS) structures and design struct...

MEMS devices including MEMS dies and connectors thereto

MEMS device integrated with a semiconductor integrated circuit and...

Integrating MEMS structures with interconnects and vias

Process for manufacturing a microelectromechanical interaction syst...

Hybrid CMOS-MEMS devices adapted for high-temperature operation and...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Method and Structure for CMOS-MEMS Thin Film Encapsulation

INTEGRATED DIGITAL FORCE SENSORS AND RELATED METHODS OF MANUFACTURE

HETEROGENOUS INTEGRATION OF COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR...

INTEGRATED MEMS-CMOS ULTRASONIC SENSOR

MEMS STRUCTURE AND MANUFACTURING METHOD THEREOF

Method and Structure for CMOS-MEMS Thin Film Encapsulation

MICROELECTROMECHANICAL DEVICE, METHOD FOR MANUFACTURING A MICROELE...

COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) MICRO ELECTRO-MECHAN...

INTEGRATED DIGITAL FORCE SENSORS AND RELATED METHODS OF MANUFACTURE

METHOD FOR FABRICATING MEMS DEVICE INTEGRATED WITH A SEMICONDUCTOR...

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURES AND DESIGN STRUCT...

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURES AND DESIGN STRUCT...

MEMS Devices Including MEMS Dies and Connectors Thereto

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURES AND DESIGN STRUCT...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Method and Structure for CMOS-MEMS Thin Film Encapsulation

INTEGRATING MEMS STRUCTURES WITH INTERCONNECTS AND VIAS

SUPPORT PILLAR

SUPPORT PILLAR

SUPPORT PILLAR

GETTER ELECTRODE TO IMPROVE VACUUM LEVEL IN A MICROELECTROMECHANICA...

Method and Structure for CMOS-MEMS Thin Film Encapsulation

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

MEMS STRUCTURE WITH AN ETCH STOP LAYER BURIED WITHIN INTER-DIELECTR...

SEMICONDUCTOR DEVICE AND METHOD

MEMS Devices and Methods for Forming Same

SUPPORT PILLAR

PROCESS FOR MANUFACTURING A MICROELECTROMECHANICAL INTERACTION SYST...

SEMICONDUCTOR PRESSURE SENSOR AND METHOD OF FABRICATING SAME