Four-layer arrangements

Industry

CPC
H01L2224/13084

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13084Four-layer arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 12,148,725
- Issue date Nov 19, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a barrier layer
- Patent number 11,984,419
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure, chip structure and method for forming chip...
- Patent number 11,894,331
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,862,587
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Mark Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 11,770,982
- Issue date Sep 26, 2023
- Rigetti & Co, LLC
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reduced pitch conductive pillars
- Patent number 11,676,924
- Issue date Jun 13, 2023
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,640,958
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,626,388
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having counductive bump with tapered portio...
- Patent number 11,495,556
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with a barrier layer
- Patent number 11,469,203
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-metal-solder stack for electronic interconnect
- Patent number 11,239,190
- Issue date Feb 1, 2022
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,233,036
- Issue date Jan 25, 2022
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 11,201,129
- Issue date Dec 14, 2021
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for bonding a group III-V device to a substrate by stack...
- Patent number 11,158,593
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,158,592
- Issue date Oct 26, 2021
- Murata Manufacturing Co., Ltd.
- Masahiro Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 11,121,301
- Issue date Sep 14, 2021
- Rigetti & Co, Inc.
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure having a conductive bump with a plurality o...
- Patent number 11,018,099
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,004,838
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reduced pitch conductive pillars
- Patent number 10,943,880
- Issue date Mar 9, 2021
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 10,943,888
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pillar in a film-type seconductor package
- Patent number 10,867,948
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Jung-woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
- Patent number 10,818,583
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure with a barrier layer and method for forming the same
- Patent number 10,811,377
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHOD...
- Publication number 20240387386
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20240297138
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE
- Publication number 20240178173
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS SOLDER BUMP STRUCTURE
- Publication number 20240113060
- Publication date Apr 4, 2024
- Societe de commercialisation des produits de la recherche appliquee SOCPRA Sc...
- Abderrahim EL AMRANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE
- Publication number 20240021556
- Publication date Jan 18, 2024
- Shinko Electric Industries Co., LTD.
- Mitsuhiro Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH FLEXIBLE INTERCONNECTS AND ASSOCI...
- Publication number 20230260943
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Christopher Glancey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20230253395
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20230215825
- Publication date Jul 6, 2023
- Rohm Co., Ltd.
- Reona TAKEOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20230112531
- Publication date Apr 13, 2023
- AU OPTRONICS CORPORATION
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE, CHIP STRUCTURE AND METHOD FOR FORMING CHIP...
- Publication number 20230060457
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER
- Publication number 20230054800
- Publication date Feb 23, 2023
- Shinko Electric Industries Co., Ltd.
- Kengo YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20230027664
- Publication date Jan 26, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...
- Publication number 20220367398
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS
- Publication number 20220173062
- Publication date Jun 2, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20220059484
- Publication date Feb 24, 2022
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20210249399
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER-METAL-SOLDER STACK FOR ELECTRONIC INTERCONNECT
- Publication number 20210217718
- Publication date Jul 15, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS
- Publication number 20210193604
- Publication date Jun 24, 2021
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20210035937
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210028134
- Publication date Jan 28, 2021
- Advanced Semiconductor Engineering, Inc.
- Mark GERBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS
- Publication number 20200365543
- Publication date Nov 19, 2020
- ADVANCED MICRO DEVICES, INC.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS
- Publication number 20200321299
- Publication date Oct 8, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200303333
- Publication date Sep 24, 2020
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE BY STACK...
- Publication number 20200227369
- Publication date Jul 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200211991
- Publication date Jul 2, 2020
- NANYA TECHNOLOGY CORPORATION
- Chih-Ching LIN
- H01 - BASIC ELECTRIC ELEMENTS

Four-layer arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding structures and methods for forming the same

Structures for low temperature bonding using nanoparticles

Packaged die and RDL with bonding structures therebetween

Package structure with a barrier layer

Methods for low temperature bonding using nanoparticles

Chip package structure, chip structure and method for forming chip...

Semiconductor package structure and method of manufacturing the same

Microwave integrated quantum circuits with cap wafers and their met...

Structures and methods for low temperature bonding using nanoparticles

Semiconductor chip with reduced pitch conductive pillars

Packaged die and RDL with bonding structures therebetween

Interconnect structure with redundant electrical connectors and ass...

Semiconductor structure having counductive bump with tapered portio...

Method for forming package structure with a barrier layer

Solder-metal-solder stack for electronic interconnect

Interconnect structure with redundant electrical connectors and ass...

Designs and methods for conductive bumps

Structures for bonding a group III-V device to a substrate by stack...

Semiconductor device

Microwave integrated quantum circuits with cap wafers and their met...

Semiconductor structure having a conductive bump with a plurality o...

Packaged die and RDL with bonding structures therebetween

Semiconductor chip with reduced pitch conductive pillars

Interconnect structure with redundant electrical connectors and ass...

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Metal pillar in a film-type seconductor package

Semiconductor devices, methods of manufacture thereof, and semicond...

Tall and fine pitch interconnects

Package structure with a barrier layer and method for forming the same

Patents Applicationslast 30 patents

INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHOD...

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

PACKAGE STRUCTURE WITH A BARRIER LAYER

CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE

HETEROGENEOUS SOLDER BUMP STRUCTURE

CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SEMICONDUCTOR DIE ASSEMBLIES WITH FLEXIBLE INTERCONNECTS AND ASSOCI...

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

DISPLAY PANEL

CHIP PACKAGE STRUCTURE, CHIP STRUCTURE AND METHOD FOR FORMING CHIP...

WAFER

BONDING STRUCTURES AND METHODS FOR FORMING THE SAME

PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...

MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

Structures And Methods For Low Temperature Bonding Using Nanoparticles

SOLDER-METAL-SOLDER STACK FOR ELECTRONIC INTERCONNECT

SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS

METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS

MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

EXPANDED HEAD PILLAR FOR BUMP BONDS

STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE BY STACK...

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME