Gallium [Ga] as principal constituent

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H01L2224/05605

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05605Gallium [Ga] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure in microelectronic component
- Patent number 11,088,099
- Issue date Aug 10, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive testing of integrated circuit chips
- Patent number 10,651,099
- Issue date May 12, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,535,626
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages and methods of fabricating the same
- Patent number 9,368,482
- Issue date Jun 14, 2016
- SK hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages and methods of fabricating the same
- Patent number 9,214,410
- Issue date Dec 15, 2015
- SK Hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through via electrodes, methods of fabri...
- Patent number 9,117,938
- Issue date Aug 25, 2015
- SK Hynix Inc.
- Jin Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate structure and manufacturing method...
- Patent number 8,269,354
- Issue date Sep 18, 2012
- Unimicron Technology Corp.
- Wen-Hung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board surface structure
- Patent number 8,058,564
- Issue date Nov 15, 2011
- Unimicron Technology Corp.
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package substrate structure and manufacturing method...
- Patent number 7,847,400
- Issue date Dec 7, 2010
- Unimicron Technology Corp.
- Wen-Hung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an insulating film and insulating pi...
- Patent number 7,675,183
- Issue date Mar 9, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved bonding
- Patent number 6,727,593
- Issue date Apr 27, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20240203917
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240063159
- Publication date Feb 22, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063178
- Publication date Feb 22, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE INTERCONNECTS AND METHODS FOR FORMING THE SAME
- Publication number 20230058704
- Publication date Feb 23, 2023
- TOKYO ELECTRON LIMITED
- Robert D. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...
- Publication number 20220415853
- Publication date Dec 29, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20210335737
- Publication date Oct 28, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20200152598
- Publication date May 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20110031617
- Publication date Feb 10, 2011
- UNIMICRON TECHONOLOGY COPR.
- Wen-Hung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE HAVING ELECTRICAL CONNECTING PADS
- Publication number 20080290528
- Publication date Nov 27, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20080272501
- Publication date Nov 6, 2008
- Phoenix Precision Technology Corporation
- Wen-Hung HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20080237863
- Publication date Oct 2, 2008
- Kabushiki Kaisha Tosiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD SURFACE STRUCTURE
- Publication number 20080217047
- Publication date Sep 11, 2008
- Phoenix Precision Technology Corporation
- Wen-Hung HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Nitride-based semiconductor light-emitting device and method of man...
- Publication number 20070051968
- Publication date Mar 8, 2007
- Shuichiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20060113674
- Publication date Jun 1, 2006
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20040159951
- Publication date Aug 19, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20020121703
- Publication date Sep 5, 2002
- KABUSHI KAISHA TOSHIBA
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS

Gallium [Ga] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structures for low temperature bonding using nanoparticles

Methods for low temperature bonding using nanoparticles

Multi-metal contact structure

Structures and methods for low temperature bonding using nanoparticles

Multi-metal contact structure in microelectronic component

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Non-destructive testing of integrated circuit chips

Structures and methods for low temperature bonding using nanoparticles

Stack packages and methods of fabricating the same

Stack packages and methods of fabricating the same

Semiconductor devices with through via electrodes, methods of fabri...

Semiconductor package substrate structure and manufacturing method...

Circuit board surface structure

Semiconductor package substrate structure and manufacturing method...

Semiconductor device including an insulating film and insulating pi...

Semiconductor device with improved bonding

Patents Applicationslast 30 patents

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

MULTI-METAL CONTACT STRUCTURE

PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME

QUASI-MONOLITHIC DIE ARCHITECTURES

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

PHASE CHANGE INTERCONNECTS AND METHODS FOR FORMING THE SAME

HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...

MULTI-METAL CONTACT STRUCTURE

Structures And Methods For Low Temperature Bonding Using Nanoparticles

Structures And Methods For Low Temperature Bonding Using Nanoparticles

SEMICONDUCTOR PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD...

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING ELECTRICAL CONNECTING PADS

SEMICONDUCTOR PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD...

Semiconductor device and manufacturing method of semiconductor device

CIRCUIT BOARD SURFACE STRUCTURE

Nitride-based semiconductor light-emitting device and method of man...

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and manufacturing method of semiconductor device