Gas flow control

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CPC
Y10S438/935

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S438/00Semiconductor device manufacturing: process

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Y10S438/935Gas flow control

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Patents Grantslast 30 patents

Information Patent Grant
Insitu post atomic layer deposition destruction of active species
- Patent number 8,257,497
- Issue date Sep 4, 2012
- Micron Technology, Inc.
- Demetrius Sarigiannis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processing method for recovering a damaged low-k film of a substrat...
- Patent number 8,048,687
- Issue date Nov 1, 2011
- Tokyo Electron Limited
- Wataru Shimizu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of making silicon solar cells containing μC silicon layers
- Patent number 7,927,907
- Issue date Apr 19, 2011
- Forschungszentrum Julich GmbH
- Tobias Repmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pulsed mass flow delivery system and method
- Patent number 7,829,353
- Issue date Nov 9, 2010
- MKS Instruments, Inc.
- Ali Shajii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Baking method of quartz products, computer program and storage medium
- Patent number 7,829,475
- Issue date Nov 9, 2010
- Tokyo Electron Limited
- Katsuhiko Anbai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 7,799,690
- Issue date Sep 21, 2010
- Renesas Electronics Corporation
- Yoshikazu Tanabe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Pulsed mass flow delivery system and method
- Patent number 7,628,860
- Issue date Dec 8, 2009
- MKS Instruments, Inc.
- Ali Shajii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pulsed mass flow delivery system and method
- Patent number 7,615,120
- Issue date Nov 10, 2009
- MKS Instruments, Inc.
- Ali Shajii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of semiconductor device, and substrate process...
- Patent number 7,494,941
- Issue date Feb 24, 2009
- Hitachi Kokusai Electric Inc.
- Osamu Kasahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laser irradiating apparatus and method of manufacturing semiconduct...
- Patent number 7,485,586
- Issue date Feb 3, 2009
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rotatable valve
- Patent number 7,426,939
- Issue date Sep 23, 2008
- ASM International N.V
- Henderikus H. N. J. Jorg
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Method of flattening a crystallized semiconductor film surface by u...
- Patent number 7,253,032
- Issue date Aug 7, 2007
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 7,250,376
- Issue date Jul 31, 2007
- Renesas Technology Corp.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for remediating cross contamination in semiconductor manufac...
- Patent number 7,200,498
- Issue date Apr 3, 2007
- Texas Instruments Incorporated
- Deepak A. Ramappa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Determining method of thermal processing condition
- Patent number 7,138,607
- Issue date Nov 21, 2006
- Tokyo Electron Limited
- Wenling Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimal operation of conformal silica deposition reactors
- Patent number 7,135,418
- Issue date Nov 14, 2006
- Novellus Systems, Inc.
- George D. Papasouliotis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 7,086,410
- Issue date Aug 8, 2006
- Tokyo Electron Limited
- Yasuhiro Chouno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 7,053,007
- Issue date May 30, 2006
- Renesas Technology Corp.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Long-wavelength semiconductor light emitting device and its manufac...
- Patent number 7,026,183
- Issue date Apr 11, 2006
- Sony Corporation
- Tomonori Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boron phosphide-based semiconductor device and production method th...
- Patent number 7,018,728
- Issue date Mar 28, 2006
- Showa Denko K.K.
- Takashi Udagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for heat treatment of silicon wafers and silicon wafer
- Patent number 7,011,717
- Issue date Mar 14, 2006
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 7,008,880
- Issue date Mar 7, 2006
- Renesas Technology Corp.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of etching a contact opening over a node location on a semi...
- Patent number 6,982,228
- Issue date Jan 3, 2006
- Micron Technology, Inc.
- Mark E. Jost
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 6,962,880
- Issue date Nov 8, 2005
- Renesas Technology Corp.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor integrated circuit device
- Patent number 6,962,881
- Issue date Nov 8, 2005
- Renesas Technology Corp.
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrated in-situ cleaning and subsequent atomic layer...
- Patent number 6,949,450
- Issue date Sep 27, 2005
- Novellus Systems, Inc.
- Tony P. Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low temperature metal oxide coating formation
- Patent number 6,921,707
- Issue date Jul 26, 2005
- Ultramet
- Alfred Zinn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabrication of B-doped silicon film by LPCVD method using BCI3 and...
- Patent number 6,905,963
- Issue date Jun 14, 2005
- Hitachi Kokusai Electric, Inc.
- Takaaki Noda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Properties of a silica thin film produced by a rapid vapor depositi...
- Patent number 6,867,152
- Issue date Mar 15, 2005
- Novellus Systems, Inc.
- Dennis M. Hausmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
SOI annealing method
- Patent number 6,858,508
- Issue date Feb 22, 2005
- Canon Kabushiki Kaisha
- Masataka Ito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSING METHOD AND STORAGE MEDIUM
- Publication number 20100304505
- Publication date Dec 2, 2010
- TOKYO ELECTRON LIMITED
- Wataru Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Making Silicon Solar Cells Containing μC Silicon Layers
- Publication number 20080274582
- Publication date Nov 6, 2008
- Tobias Repmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for fabricating semiconductor intergrated circuit device
- Publication number 20080045027
- Publication date Feb 21, 2008
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Baking method of quartz products, computer program and storage medium
- Publication number 20070298621
- Publication date Dec 27, 2007
- TOKYO ELECTRON LIMITED
- Katsuhiko Anbai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser irradiating apparatus and method of manufacturing semiconduct...
- Publication number 20070059949
- Publication date Mar 15, 2007
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pulsed mass flow delivery system and method
- Publication number 20070039549
- Publication date Feb 22, 2007
- MKS Instruments, Inc.
- Ali Shajii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Pulsed mass flow delivery system and method
- Publication number 20070039550
- Publication date Feb 22, 2007
- MKS Instruments, Inc.
- Ali Shajii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Pulsed mass flow delivery system and method
- Publication number 20070042508
- Publication date Feb 22, 2007
- MKS Instruments, Inc.
- Ali Shajii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for manufacturing semiconductor device and substrate process...
- Publication number 20070032045
- Publication date Feb 8, 2007
- Hitachi Kokusai Electric Inc.
- Osamu Kasahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Rotatable valve
- Publication number 20070017444
- Publication date Jan 25, 2007
- Henderikus H.N.J. Jorg
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
LONG-WAVELENGTH SEMICONDUCTOR LIGHT EMITTING DEVICE AND ITS MANUFAC...
- Publication number 20060120423
- Publication date Jun 8, 2006
- Tomonori Hino
- B82 - NANO-TECHNOLOGY
Information Patent Application
Methods of etching a contact opening over a node location on a semi...
- Publication number 20060024973
- Publication date Feb 2, 2006
- Mark E. Jost
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
System for remediating cross contamination in semiconductor manufac...
- Publication number 20050274805
- Publication date Dec 15, 2005
- Deepak A. Ramappa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor integrated circuit device
- Publication number 20050227501
- Publication date Oct 13, 2005
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pulsed mass flow delivery system and method
- Publication number 20050223979
- Publication date Oct 13, 2005
- Ali Shajii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Rotatable valve
- Publication number 20050211315
- Publication date Sep 29, 2005
- Henderikus H.N.J. Jorg
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
Method for fabricating semiconductor integrated circuit device
- Publication number 20050208731
- Publication date Sep 22, 2005
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insitu post atomic layer deposition destruction of active species
- Publication number 20050150460
- Publication date Jul 14, 2005
- Micron Technology, Inc.
- Demetrius Sarigiannis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Long-wavelength semiconductor light emitting device and its manufac...
- Publication number 20050040408
- Publication date Feb 24, 2005
- Sony Corporation
- Tomonori Hino
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method for heat treatment of silicon wafers and silicon wafer
- Publication number 20050025691
- Publication date Feb 3, 2005
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Boron phosphide-based semiconductor device and production method th...
- Publication number 20040232404
- Publication date Nov 25, 2004
- Takashi Udagawa
- C30 - CRYSTAL GROWTH
Information Patent Application
Determining method of thermal processing condition
- Publication number 20040226933
- Publication date Nov 18, 2004
- Wenling Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor integrated circuit device
- Publication number 20040161945
- Publication date Aug 19, 2004
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor integrated circuit device
- Publication number 20040157468
- Publication date Aug 12, 2004
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Parallel divided flow-type fluid supply apparatus, and fluid-switch...
- Publication number 20040154664
- Publication date Aug 12, 2004
- FUJIKIN INCORPORATED
- Tadahiro Ohmi
- G05 - CONTROLLING REGULATING
Information Patent Application
Method for fabricating semiconductor intergrated circuit device
- Publication number 20040157467
- Publication date Aug 12, 2004
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insitu post atomic layer deposition destruction of active species
- Publication number 20040152304
- Publication date Aug 5, 2004
- Micron Technology, Inc.
- Demetrius Sarigiannis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE AND METHOD FOR PROCESSING SUBSTRATE
- Publication number 20040026037
- Publication date Feb 12, 2004
- Hiroshi Shinriki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for fabricating semiconductor integrated circuit device
- Publication number 20030219995
- Publication date Nov 27, 2003
- Yoshikazu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for etching vias
- Publication number 20030216034
- Publication date Nov 20, 2003
- Unaxis USA, Inc.
- Russell Westerman
- H01 - BASIC ELECTRIC ELEMENTS

Gas flow control

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Insitu post atomic layer deposition destruction of active species

Processing method for recovering a damaged low-k film of a substrat...

Method of making silicon solar cells containing μC silicon layers

Pulsed mass flow delivery system and method

Baking method of quartz products, computer program and storage medium

Method for fabricating semiconductor integrated circuit device

Pulsed mass flow delivery system and method

Pulsed mass flow delivery system and method

Manufacturing method of semiconductor device, and substrate process...

Laser irradiating apparatus and method of manufacturing semiconduct...

Rotatable valve

Method of flattening a crystallized semiconductor film surface by u...

Method for fabricating semiconductor integrated circuit device

System for remediating cross contamination in semiconductor manufac...

Determining method of thermal processing condition

Optimal operation of conformal silica deposition reactors

Substrate processing apparatus and substrate processing method

Method for fabricating semiconductor integrated circuit device

Long-wavelength semiconductor light emitting device and its manufac...

Boron phosphide-based semiconductor device and production method th...

Method for heat treatment of silicon wafers and silicon wafer

Method for fabricating semiconductor integrated circuit device

Methods of etching a contact opening over a node location on a semi...

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device

Method for integrated in-situ cleaning and subsequent atomic layer...

Low temperature metal oxide coating formation

Fabrication of B-doped silicon film by LPCVD method using BCI3 and...

Properties of a silica thin film produced by a rapid vapor depositi...

SOI annealing method

Patents Applicationslast 30 patents

PROCESSING METHOD AND STORAGE MEDIUM

Method of Making Silicon Solar Cells Containing μC Silicon Layers

Method for fabricating semiconductor intergrated circuit device

Baking method of quartz products, computer program and storage medium

Laser irradiating apparatus and method of manufacturing semiconduct...

Pulsed mass flow delivery system and method

Pulsed mass flow delivery system and method

Pulsed mass flow delivery system and method

Method for manufacturing semiconductor device and substrate process...

Rotatable valve

LONG-WAVELENGTH SEMICONDUCTOR LIGHT EMITTING DEVICE AND ITS MANUFAC...

Methods of etching a contact opening over a node location on a semi...

System for remediating cross contamination in semiconductor manufac...

Method for fabricating semiconductor integrated circuit device

Pulsed mass flow delivery system and method

Rotatable valve

Method for fabricating semiconductor integrated circuit device

Insitu post atomic layer deposition destruction of active species

Long-wavelength semiconductor light emitting device and its manufac...

Method for heat treatment of silicon wafers and silicon wafer

Boron phosphide-based semiconductor device and production method th...

Determining method of thermal processing condition

Method for fabricating semiconductor integrated circuit device

Method for fabricating semiconductor integrated circuit device

Parallel divided flow-type fluid supply apparatus, and fluid-switch...

Method for fabricating semiconductor intergrated circuit device

Insitu post atomic layer deposition destruction of active species

DEVICE AND METHOD FOR PROCESSING SUBSTRATE

Method for fabricating semiconductor integrated circuit device

Method for etching vias