gaseous at the normal operating temperature of the device

Industry

CPC
H01L23/20

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/20gaseous at the normal operating temperature of the device

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package having stress relief structure
- Patent number 12,087,729
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages to minimize stress on a semiconductor die
- Patent number 12,027,472
- Issue date Jul 2, 2024
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting substrate, and electronic device
- Patent number 11,996,339
- Issue date May 28, 2024
- Kyocera Corporation
- Kenichi Ura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical bonding method, package-type electronic component, and hyb...
- Patent number 11,916,038
- Issue date Feb 27, 2024
- Canon Anelva Corporation
- Takayuki Saitoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hermetically sealed housing with a semiconductor component and meth...
- Patent number 11,876,007
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a plurality of dielectric materials...
- Patent number 11,742,325
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages to minimize stress on a semiconductor die
- Patent number 11,616,027
- Issue date Mar 28, 2023
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with chemical reaction chamber
- Patent number 11,587,839
- Issue date Feb 21, 2023
- Analog Devices, Inc.
- David Frank Bolognia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Device package with reduced radio frequency losses
- Patent number 11,574,879
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Pedro Augusto Borrego Lambin Torres Amaral
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,367,664
- Issue date Jun 21, 2022
- Amkor Technology Japan, Inc.
- Shojiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radar component package and method for manufacturing the same
- Patent number 11,346,920
- Issue date May 31, 2022
- National Center for Advanced Packaging Co., Ltd.
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed housing with a semiconductor component and meth...
- Patent number 11,289,353
- Issue date Mar 29, 2022
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging cover plate, organic light-emitting diode display and man...
- Patent number 11,245,099
- Issue date Feb 8, 2022
- BOE Technology Group Co., Ltd.
- Linlin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bypass thyristor device with gas expansion cavity within a contact...
- Patent number 11,139,219
- Issue date Oct 5, 2021
- ABB Schweiz AG
- Tobias Wikström
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with inner and outer cavities
- Patent number 11,081,413
- Issue date Aug 3, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsin Lin Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 10,879,210
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low stress integrated device packages
- Patent number 10,800,651
- Issue date Oct 13, 2020
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Oscillator, electronic apparatus, and vehicle
- Patent number 10,720,886
- Issue date Jul 21, 2020
- Seiko Epson Corporation
- Naohisa Obata
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bonded structures
- Patent number 10,522,499
- Issue date Dec 31, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Power module
- Patent number 10,468,315
- Issue date Nov 5, 2019
- Mitsubishi Electric Corporation
- Kozo Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor package including the same
- Patent number 10,347,576
- Issue date Jul 9, 2019
- Samsung Electronics Co., Ltd.
- Kwang-Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a printed circuit module having a semicond...
- Patent number 10,199,301
- Issue date Feb 5, 2019
- Qorvo US, Inc.
- Dirk Robert Walter Leipold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing a printed circuit module having a semicond...
- Patent number 10,163,748
- Issue date Dec 25, 2018
- Qorvo US, Inc.
- Dirk Robert Walter Leipold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Remapped packaged extracted die with 3D printed bond connections
- Patent number 10,147,660
- Issue date Dec 4, 2018
- Global Circuits Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed hermetic package assembly and method
- Patent number 10,128,161
- Issue date Nov 13, 2018
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit module having a semiconductor device with a protect...
- Patent number 10,121,718
- Issue date Nov 6, 2018
- Qorvo US, Inc.
- Dirk Robert Walter Leipold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Repackaged reconditioned die method and assembly
- Patent number 10,115,645
- Issue date Oct 30, 2018
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit module having a semiconductor device with a protect...
- Patent number 10,109,548
- Issue date Oct 23, 2018
- Qorvo US, Inc.
- Dirk Robert Walter Leipold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gasses for increasing yield and reliability of MEMS devices
- Patent number 10,081,536
- Issue date Sep 25, 2018
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Antenna impedance matching and aperture tuning circuitry
- Patent number 10,062,629
- Issue date Aug 28, 2018
- Qorvo US, Inc.
- George Maxim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS...
- Publication number 20240395773
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20240304569
- Publication date Sep 12, 2024
- Analong Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan et al.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING RIGID DIELECTRIC LID AND OVERLAYING THE...
- Publication number 20240203809
- Publication date Jun 20, 2024
- EAGLE TECHNOLOGY. LLC
- Louis R. PARADISO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE
- Publication number 20240055396
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS...
- Publication number 20230352448
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20230207489
- Publication date Jun 29, 2023
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS...
- Publication number 20230069496
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...
- Publication number 20230051810
- Publication date Feb 16, 2023
- Canon ANELVA Corporation
- Takayuki SAITOH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20220384284
- Publication date Dec 1, 2022
- Amkor Technology Japan, Inc.
- Shojiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE
- Publication number 20220352119
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETICALLY SEALED HOUSING WITH A SEMICONDUCTOR COMPONENT AND METH...
- Publication number 20220172971
- Publication date Jun 2, 2022
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC ELEMENT MOUNTING SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20210407872
- Publication date Dec 30, 2021
- KYOCERA CORPORATION
- Kenichi URA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR D...
- Publication number 20210193539
- Publication date Jun 24, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Shojiro Hanada
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
RADAR COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210181297
- Publication date Jun 17, 2021
- National Center for Advanced Packaging Co., Ltd.
- Wenqi Zhang
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20210183790
- Publication date Jun 17, 2021
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH CHEMICAL REACTION CHAMBER
- Publication number 20200411398
- Publication date Dec 31, 2020
- Analog Devices, Inc.
- David Frank Bolognia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BONDED STRUCTURES
- Publication number 20200144217
- Publication date May 7, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BYPASS THYRISTOR DEVICE WITH GAS EXPANSION CAVITY WITHIN A CONTACT...
- Publication number 20200144141
- Publication date May 7, 2020
- ABB Schweiz AG
- Tobias Wikström
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190267298
- Publication date Aug 29, 2019
- Advanced Semiconductor Engineering, Inc.
- Hsin Lin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OSCILLATOR, ELECTRONIC APPARATUS, AND VEHICLE
- Publication number 20190267940
- Publication date Aug 29, 2019
- SEIKO EPSON CORPORATION
- Naohisa OBATA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
OSCILLATOR, ELECTRONIC APPARATUS, AND VEHICLE
- Publication number 20190267943
- Publication date Aug 29, 2019
- SEIKO EPSON CORPORATION
- Naohisa OBATA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20180090430
- Publication date Mar 29, 2018
- Kwang-Won CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20180082915
- Publication date Mar 22, 2018
- Freescale Semiconductor Inc.
- LAKSHMINARAYAN VISWANATHAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT MODULE HAVING A SEMICONDUCTOR DEVICE WITH A PROTECT...
- Publication number 20180053704
- Publication date Feb 22, 2018
- Qorvo US, Inc.
- Dirk Robert Walter Leipold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Printed Hermetic Package Assembly and Method
- Publication number 20180053702
- Publication date Feb 22, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Remapped Packaged Extracted Die with 3D Printed Bond Connections
- Publication number 20180040529
- Publication date Feb 8, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS INTEGRATED DEVICE PACKAGES
- Publication number 20170320725
- Publication date Nov 9, 2017
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOLID STATE DRIVE OPTIMIZED FOR WAFERS
- Publication number 20170186731
- Publication date Jun 29, 2017
- SanDisk Technologies LLC
- Atsuyoshi Koike
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRIC MODULE COMPRISING A TENSIONING DEVICE
- Publication number 20170133327
- Publication date May 11, 2017
- Siemens Aktiengesellschaft
- DANIEL SCHMITT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING A PRINTED CIRCUIT MODULE HAVING A SEMICOND...
- Publication number 20170098587
- Publication date Apr 6, 2017
- Qorvo US, Inc.
- Dirk Robert Walter Leipold
- H01 - BASIC ELECTRIC ELEMENTS

gaseous at the normal operating temperature of the device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-chip package having stress relief structure

Integrated circuit packages to minimize stress on a semiconductor die

Electronic element mounting substrate, and electronic device

Chemical bonding method, package-type electronic component, and hyb...

Hermetically sealed housing with a semiconductor component and meth...

Semiconductor device including a plurality of dielectric materials...

Integrated circuit packages to minimize stress on a semiconductor die

Device with chemical reaction chamber

Device package with reduced radio frequency losses

Semiconductor devices and methods of manufacturing semiconductor de...

Radar component package and method for manufacturing the same

Hermetically sealed housing with a semiconductor component and meth...

Packaging cover plate, organic light-emitting diode display and man...

Bypass thyristor device with gas expansion cavity within a contact...

Semiconductor package with inner and outer cavities

Bonded structures

Low stress integrated device packages

Oscillator, electronic apparatus, and vehicle

Bonded structures

Power module

Package substrate and semiconductor package including the same

Methods of manufacturing a printed circuit module having a semicond...

Methods of manufacturing a printed circuit module having a semicond...

Remapped packaged extracted die with 3D printed bond connections

3D printed hermetic package assembly and method

Printed circuit module having a semiconductor device with a protect...

Repackaged reconditioned die method and assembly

Printed circuit module having a semiconductor device with a protect...

Gasses for increasing yield and reliability of MEMS devices

Antenna impedance matching and aperture tuning circuitry

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS...

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

ELECTRONIC DEVICE INCLUDING RIGID DIELECTRIC LID AND OVERLAYING THE...

MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS...

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS...

CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE

HERMETICALLY SEALED HOUSING WITH A SEMICONDUCTOR COMPONENT AND METH...

ELECTRONIC ELEMENT MOUNTING SUBSTRATE, AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR D...

RADAR COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

DEVICE WITH CHEMICAL REACTION CHAMBER

BONDED STRUCTURES

BYPASS THYRISTOR DEVICE WITH GAS EXPANSION CAVITY WITHIN A CONTACT...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

OSCILLATOR, ELECTRONIC APPARATUS, AND VEHICLE

OSCILLATOR, ELECTRONIC APPARATUS, AND VEHICLE

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

PRINTED CIRCUIT MODULE HAVING A SEMICONDUCTOR DEVICE WITH A PROTECT...

3D Printed Hermetic Package Assembly and Method

Remapped Packaged Extracted Die with 3D Printed Bond Connections

LOW STRESS INTEGRATED DEVICE PACKAGES

SOLID STATE DRIVE OPTIMIZED FOR WAFERS

ELECTRIC MODULE COMPRISING A TENSIONING DEVICE

METHODS OF MANUFACTURING A PRINTED CIRCUIT MODULE HAVING A SEMICOND...