Geometry or layout of the interconnection structure

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/528Geometry or layout of the interconnection structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit and method of designing the same
- Patent number 12,147,751
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Seungman Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices
- Patent number 12,148,837
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Bo Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiered-profile contact for semiconductor
- Patent number 12,148,663
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,692
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a trench having a high aspect rat...
- Patent number 12,148,654
- Issue date Nov 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 12,148,698
- Issue date Nov 19, 2024
- Realtek Semiconductor Corporation
- Chien Cheng Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High aspect ratio buried power rail metallization
- Patent number 12,148,699
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,148,714
- Issue date Nov 19, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-optimizing power supply voltage in an integrated circuit design
- Patent number 12,147,749
- Issue date Nov 19, 2024
- Synopsys, Inc.
- Qiang Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for reducing dual damascene distortion
- Patent number 12,148,696
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and associated method and system
- Patent number 12,148,700
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout pattern for magnetoresistive random access memory
- Patent number 12,150,315
- Issue date Nov 19, 2024
- United Microelectronics Corp.
- Ya-Huei Tsai
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for forming stairs in three-dimensional memory devices
- Patent number 12,148,655
- Issue date Nov 19, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xiangning Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods of local interconnect stitches and power grids
- Patent number 12,148,697
- Issue date Nov 19, 2024
- ARM Limited
- Jean-Luc Pelloie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Array substrate and display panel
- Patent number 12,148,762
- Issue date Nov 19, 2024
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Xingfeng Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active via
- Patent number 12,148,838
- Issue date Nov 19, 2024
- ZINITE CORPORATION
- Douglas W. Barlage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with built-in electronic components and electronic device
- Patent number 12,148,724
- Issue date Nov 19, 2024
- Fujitsu Limited
- Yukiko Oshikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetoresistive random access memory having a blocking layer on me...
- Patent number 12,150,313
- Issue date Nov 19, 2024
- United Microelectronics Corp.
- Jia-Rong Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming stacked trench contacts and structures formed the...
- Patent number 12,142,566
- Issue date Nov 12, 2024
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly and display device
- Patent number 12,142,581
- Issue date Nov 12, 2024
- Innolux Corporation
- Tsung-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including select cutting structure, method for...
- Patent number 12,144,171
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Choasub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer circuit, semiconductor integrated circuit device, oscillator...
- Patent number RE50208
- Issue date Nov 12, 2024
- Seiko Epson Corporation
- Kenji Hayashi
Information Patent Grant
Transistor structures having conductive structures along pillars of...
- Patent number 12,142,680
- Issue date Nov 12, 2024
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for enhancing insertion loss performance of an...
- Patent number 12,142,585
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jun-De Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive metal etch with improved isolation for BEOL interconnec...
- Patent number 12,142,562
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 12,144,181
- Issue date Nov 12, 2024
- Kioxia Corporation
- Go Oike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip having a back-side power rail
- Patent number 12,142,557
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power distribution network semiconductor package and metho...
- Patent number 12,142,564
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligning spacer tight pitch via
- Patent number 12,142,525
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip with shared clock distribution network
- Patent number 12,142,528
- Issue date Nov 12, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...
- Publication number 20240387658
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Thereof
- Publication number 20240387664
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION SENSOR
- Publication number 20240387411
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240387462
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Junbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS OF TESTING MEMORY DEVICES
- Publication number 20240387303
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING
- Publication number 20240387316
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Circuit Vias In Interconnect Structures
- Publication number 20240387331
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING OVERLYING THIN FILM TRAN...
- Publication number 20240387370
- Publication date Nov 21, 2024
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Satoru MAYUZUMI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
- Publication number 20240387372
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Having a High Cell Density
- Publication number 20240387373
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Multigate Devices with Varying Channel Layers
- Publication number 20240387743
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuan-Lun Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAYS WITH LAYER SELECTOR TRANSISTORS
- Publication number 20240389300
- Publication date Nov 21, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF THREE-DIMENSIONAL MEMORY ARRAY
- Publication number 20240389339
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387630
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guan-Yao TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387314
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Katsumi TANIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20240387366
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Ming LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL
- Publication number 20240387369
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Hung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240387400
- Publication date Nov 21, 2024
- STATS ChipPAC Pte Ltd.
- JiSeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spacers for Semiconductor Devices Including Backside Power Rails
- Publication number 20240387249
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20240387260
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- Cheng Yan JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES
- Publication number 20240389337
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMIN...
- Publication number 20240387519
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387524
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Che CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
L-SHAPED FIELD EFFECT TRANSISTOR AND CORRESPONDING FABRICATION METH...
- Publication number 20240387543
- Publication date Nov 21, 2024
- National Cheng Kung University
- YEONG-HER WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIE OFF DEVICE
- Publication number 20240387547
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Lun Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MACRO DEVICE-UNDER-TEST STRUCTURE FOR MEASURING CONTACT RESISTANCE...
- Publication number 20240387555
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jaehong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLEXER CELL AND SEMICONDUCTOR DEVICE HAVING CAMOUFLAGE DESIGN,...
- Publication number 20240387407
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIH-LIEN LINUS LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grounded Metal Ring Structure For Through-Silicon Via
- Publication number 20240387410
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DUMMY CONDUCTIVE CELLS
- Publication number 20240387412
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TO DIE INTERFACE CIRCUIT
- Publication number 20240387471
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS

Geometry or layout of the interconnection structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit and method of designing the same

Semiconductor devices

Tiered-profile contact for semiconductor

Semiconductor package and manufacturing method thereof

Semiconductor structure including a trench having a high aspect rat...

Semiconductor device and semiconductor device manufacturing method

High aspect ratio buried power rail metallization

Three-dimensional memory devices and methods for forming the same

Co-optimizing power supply voltage in an integrated circuit design

Methods for reducing dual damascene distortion

Semiconductor device, and associated method and system

Layout pattern for magnetoresistive random access memory

Methods for forming stairs in three-dimensional memory devices

Devices and methods of local interconnect stitches and power grids

Array substrate and display panel

Active via

Package with built-in electronic components and electronic device

Magnetoresistive random access memory having a blocking layer on me...

Method of forming stacked trench contacts and structures formed the...

Substrate assembly and display device

Semiconductor device including select cutting structure, method for...

Buffer circuit, semiconductor integrated circuit device, oscillator...

Transistor structures having conductive structures along pillars of...

Devices and methods for enhancing insertion loss performance of an...

Subtractive metal etch with improved isolation for BEOL interconnec...

Semiconductor memory

Integrated chip having a back-side power rail

Backside power distribution network semiconductor package and metho...

Self-aligning spacer tight pitch via

3D chip with shared clock distribution network

Patents Applicationslast 30 patents

BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...

Semiconductor Device and Method of Forming Thereof

DELAMINATION SENSOR

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SYSTEMS AND METHODS OF TESTING MEMORY DEVICES

SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING

Through-Circuit Vias In Interconnect Structures

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING OVERLYING THIN FILM TRAN...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

Integrated Circuit Having a High Cell Density

Multigate Devices with Varying Channel Layers

THREE-DIMENSIONAL MEMORY ARRAYS WITH LAYER SELECTOR TRANSISTORS

STRUCTURE OF THREE-DIMENSIONAL MEMORY ARRAY

INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE STRUCTURES AND METHODS OF MANUFACTURE

MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

Spacers for Semiconductor Devices Including Backside Power Rails

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

MEMORY DEVICES

THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMIN...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

L-SHAPED FIELD EFFECT TRANSISTOR AND CORRESPONDING FABRICATION METH...

TIE OFF DEVICE

MACRO DEVICE-UNDER-TEST STRUCTURE FOR MEASURING CONTACT RESISTANCE...

MULTIPLEXER CELL AND SEMICONDUCTOR DEVICE HAVING CAMOUFLAGE DESIGN,...

Grounded Metal Ring Structure For Through-Silicon Via

SEMICONDUCTOR DEVICE INCLUDING DUMMY CONDUCTIVE CELLS

DIE TO DIE INTERFACE CIRCUIT