Glasses

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H01L2224/05688

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05688Glasses

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with barrier layer
- Patent number 12,148,722
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Ming-Hung Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with barrier layer and method for fabricating...
- Patent number 11,545,453
- Issue date Jan 3, 2023
- NANYA TECHNOLOGY CORPORATION
- Ming-Hung Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...
- Patent number 10,910,782
- Issue date Feb 2, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Laurent Vandroux
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Hybrid wafer-to-wafer bonding and methods of surface preparation fo...
- Patent number 10,886,249
- Issue date Jan 5, 2021
- ams International AG
- Jens Hofrichter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating glass substrate package
- Patent number 10,453,819
- Issue date Oct 22, 2019
- Ping-Jung Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor devices including conductive pillars
- Patent number 10,276,529
- Issue date Apr 30, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating glass substrate package
- Patent number 10,096,565
- Issue date Oct 9, 2018
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive materials on semiconductor devices, a...
- Patent number 9,768,134
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 9,595,469
- Issue date Mar 14, 2017
- Infineon Technologies AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 8,922,026
- Issue date Dec 30, 2014
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly system
- Patent number 8,896,121
- Issue date Nov 25, 2014
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with heavily doped region and fabrication method thereof
- Patent number 8,748,949
- Issue date Jun 10, 2014
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with heavily doped regions and fabrication method thereof
- Patent number 8,497,534
- Issue date Jul 30, 2013
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,373,284
- Issue date Feb 12, 2013
- NEC Corporation
- Toshinobu Ogatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,915,731
- Issue date Mar 29, 2011
- Sanyo Electric Co., LTD
- Hiroshi Ishizeki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413125
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Seho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240251610
- Publication date Jul 25, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20230230945
- Publication date Jul 20, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230103256
- Publication date Mar 30, 2023
- RENESAS ELECTRONICS CORPORATION
- Tatsuya USAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BARRIER LAYER AND METHOD FOR FABRICATING...
- Publication number 20220336389
- Publication date Oct 20, 2022
- NANYA TECHNOLOGY CORPORATION
- Ming-Hung HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BARRIER LAYER
- Publication number 20220336390
- Publication date Oct 20, 2022
- NANYA TECHNOLOGY CORPORATION
- Ming-Hung HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...
- Publication number 20190252338
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
- Publication number 20190027459
- Publication date Jan 24, 2019
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS
- Publication number 20170358547
- Publication date Dec 14, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
- Publication number 20170207188
- Publication date Jul 20, 2017
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY SYSTEM
- Publication number 20130207268
- Publication date Aug 15, 2013
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT, BEFORE THE BONDING OF A MIXED CU-OXIDE SURFACE, BY A PLA...
- Publication number 20130153093
- Publication date Jun 20, 2013
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Laurent Vandroux
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120280389
- Publication date Nov 8, 2012
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110042804
- Publication date Feb 24, 2011
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110042807
- Publication date Feb 24, 2011
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100213622
- Publication date Aug 26, 2010
- Toshinobu Ogatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090212426
- Publication date Aug 27, 2009
- SANYO ELECTRIC CO., LTD.
- Hiroshi Ishizeki
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with barrier layer

Semiconductor device with barrier layer and method for fabricating...

Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...

Hybrid wafer-to-wafer bonding and methods of surface preparation fo...

Semiconductor devices and semiconductor devices including a redistr...

Method for fabricating glass substrate package

Semiconductor devices including conductive pillars

Method for fabricating glass substrate package

Methods of forming conductive materials on semiconductor devices, a...

Semiconductor device and method for producing the same

Chip package and fabrication method thereof

Chip assembly system

Chip package with heavily doped region and fabrication method thereof

Chip package with heavily doped regions and fabrication method thereof

Semiconductor device

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

DISPLAY PANEL AND DISPLAY DEVICE

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH BARRIER LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE WITH BARRIER LAYER

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...

METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE

SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS

METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE

CHIP ASSEMBLY SYSTEM

TREATMENT, BEFORE THE BONDING OF A MIXED CU-OXIDE SURFACE, BY A PLA...

CHIP PACKAGE AND FABRICATION METHOD THEREOF

CHIP PACKAGE AND FABRICATION METHOD THEREOF

CHIP PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF