Glasses

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H01L2924/16788

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/16788Glasses

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated interposer solutions for 2D and 3D IC packaging
- Patent number 11,302,616
- Issue date Apr 12, 2022
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup device and electronic apparatus to increas...
- Patent number 10,986,292
- Issue date Apr 20, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kenji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,790,208
- Issue date Sep 29, 2020
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor components having substantially rigid suppor...
- Patent number 10,763,185
- Issue date Sep 1, 2020
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor components having substantially rigid suppor...
- Patent number 10,312,173
- Issue date Jun 4, 2019
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,290,556
- Issue date May 14, 2019
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated interposer solutions for 2D and 3D IC packaging
- Patent number 10,256,177
- Issue date Apr 9, 2019
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor components having substantially rigid suppor...
- Patent number 9,960,094
- Issue date May 1, 2018
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with reinforcement frames, and method...
- Patent number 9,887,166
- Issue date Feb 6, 2018
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 9,859,180
- Issue date Jan 2, 2018
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with cavities, and methods of fabrication
- Patent number 9,812,406
- Issue date Nov 7, 2017
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 9,693,462
- Issue date Jun 27, 2017
- Mitsubishi Electric Corporation
- Takeshi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded glass lid for wafer level packaging of opto-electronic assem...
- Patent number 9,575,266
- Issue date Feb 21, 2017
- Cisco Technology, Inc.
- Kishor Desai
- G02 - OPTICS
Information Patent Grant
Glass frit wafer bond protective structure
- Patent number 9,425,115
- Issue date Aug 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor components having substantially rigid suppor...
- Patent number 9,362,208
- Issue date Jun 7, 2016
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with reinforcement frames, and method...
- Patent number 9,355,997
- Issue date May 31, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded glass lid for wafer level packaging of opto-electronic assem...
- Patent number 9,052,445
- Issue date Jun 9, 2015
- Cisco Technology, Inc.
- Kishor Desai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imaging assembly
- Patent number 8,876,304
- Issue date Nov 4, 2014
- STMicroelectronics (Research & Development) Limited
- Ewan Findlay
- G02 - OPTICS
Information Patent Grant
Double-sided printed circuit board
- Patent number 8,780,574
- Issue date Jul 15, 2014
- Hon Hai Precision Industry Co., Ltd.
- Kai-Wen Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass frit wafer bond protective structure
- Patent number 8,633,088
- Issue date Jan 21, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure
- Patent number 8,552,544
- Issue date Oct 8, 2013
- Advanced Semiconductor Engineering, Inc.
- Ching-Hong Chuang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical coupling of wafer structures
- Patent number 8,138,062
- Issue date Mar 20, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Lianjun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming monolithic CMOS-MEMS hybrid integrated, packaged...
- Patent number 8,101,469
- Issue date Jan 24, 2012
- Advanced Microfab, LLC
- G. Krishna Kumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for packaging semiconductor device and package structure the...
- Patent number 7,855,424
- Issue date Dec 21, 2010
- Advanced Semiconductor Engineering, Inc.
- Chain-Hau Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus having an integrated circuit attached to fuse...
- Patent number 7,812,416
- Issue date Oct 12, 2010
- Cardiomems, Inc.
- Christophe Courcimault
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged semiconductor components having substantially rigid suppor...
- Patent number 7,750,449
- Issue date Jul 6, 2010
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,646,094
- Issue date Jan 12, 2010
- Sharp Kabushiki Kaisha
- Shinji Suminoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,595,540
- Issue date Sep 29, 2009
- Panasonic Corporation
- Toshiyuki Fukuda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor module
- Patent number 7,566,965
- Issue date Jul 28, 2009
- FUJIFILM Corporation
- Takehiko Senba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device package with an integral window mounted in a...
- Patent number 6,809,413
- Issue date Oct 26, 2004
- Sandia Corporation
- Kenneth A. Peterson
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH GAS RELEASE HOLES
- Publication number 20230307302
- Publication date Sep 28, 2023
- STMicroelectronics LTD
- David GANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
- Publication number 20190252281
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20190229025
- Publication date Jul 25, 2019
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
- Publication number 20180211896
- Publication date Jul 26, 2018
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20180082913
- Publication date Mar 22, 2018
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20170236761
- Publication date Aug 17, 2017
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Glass Frit Wafer Bond Protective Structure
- Publication number 20130285228
- Publication date Oct 31, 2013
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Molded Glass Lid For Wafer Level Packaging Of Opto-Electronic Assem...
- Publication number 20130101250
- Publication date Apr 25, 2013
- Kishor Desai
- G02 - OPTICS
Information Patent Application
DOUBLE-SIDED PRINTED CIRCUIT BOARD
- Publication number 20130021767
- Publication date Jan 24, 2013
- HON HAI Precision Industry CO., LTD.
- KAI-WEN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120025363
- Publication date Feb 2, 2012
- Advanced Semiconductor Engineering, Inc.
- Ching-Hong Chuang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL COUPLING OF WAFER STRUCTURES
- Publication number 20110143476
- Publication date Jun 16, 2011
- LIANJUN LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING MONOLITHIC CMOS-MEMS HYBRID INTEGRATED, PACKAGED...
- Publication number 20110003421
- Publication date Jan 6, 2011
- Advanced Microfab, LLC
- G. Krishna Kumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
- Publication number 20100255636
- Publication date Oct 7, 2010
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ASSEMBLY
- Publication number 20100128350
- Publication date May 27, 2010
- STMicroelectronics (Research and Development) Limited
- Ewan FINDLAY
- G02 - OPTICS
Information Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
- Publication number 20080224291
- Publication date Sep 18, 2008
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus having an integrated circuit attached to fuse...
- Publication number 20070267708
- Publication date Nov 22, 2007
- CardioMems, Inc.
- Christophe Courcimault
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device
- Publication number 20070194418
- Publication date Aug 23, 2007
- Sharp Kabushiki Kaisha
- Shinji Suminoe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for packaging semiconductor device and package structure the...
- Publication number 20070126075
- Publication date Jun 7, 2007
- Advanced Semiconductor Engineering, Inc.
- Chain-Hau Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070018301
- Publication date Jan 25, 2007
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Fukuda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor module
- Publication number 20060281231
- Publication date Dec 14, 2006
- Fuji Photo Film Co., Ltd.
- Takehiko Senba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for adhesive bonding in electronic packaging
- Publication number 20060243384
- Publication date Nov 2, 2006
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding apparatus, bonding method, and method for manufacturing sem...
- Publication number 20050284578
- Publication date Dec 29, 2005
- Sharp Kabushiki Kaisha
- Kenji Uchida
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated interposer solutions for 2D and 3D IC packaging

Solid-state image pickup device and electronic apparatus to increas...

High reliability wafer level semiconductor packaging

Packaged semiconductor components having substantially rigid suppor...

Packaged semiconductor components having substantially rigid suppor...

High reliability wafer level semiconductor packaging

Integrated interposer solutions for 2D and 3D IC packaging

Packaged semiconductor components having substantially rigid suppor...

Integrated circuit assemblies with reinforcement frames, and method...

High reliability wafer level semiconductor packaging

Microelectronic assemblies with cavities, and methods of fabrication

Printed circuit board

Molded glass lid for wafer level packaging of opto-electronic assem...

Glass frit wafer bond protective structure

Packaged semiconductor components having substantially rigid suppor...

Integrated circuit assemblies with reinforcement frames, and method...

Molded glass lid for wafer level packaging of opto-electronic assem...

Imaging assembly

Double-sided printed circuit board

Glass frit wafer bond protective structure

Package structure

Electrical coupling of wafer structures

Method of forming monolithic CMOS-MEMS hybrid integrated, packaged...

Method for packaging semiconductor device and package structure the...

Methods and apparatus having an integrated circuit attached to fuse...

Packaged semiconductor components having substantially rigid suppor...

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor module

Microelectronic device package with an integral window mounted in a...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH GAS RELEASE HOLES

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

Glass Frit Wafer Bond Protective Structure

Molded Glass Lid For Wafer Level Packaging Of Opto-Electronic Assem...

DOUBLE-SIDED PRINTED CIRCUIT BOARD

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRICAL COUPLING OF WAFER STRUCTURES

METHOD OF FORMING MONOLITHIC CMOS-MEMS HYBRID INTEGRATED, PACKAGED...

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...

IMAGING ASSEMBLY

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...

Methods and apparatus having an integrated circuit attached to fuse...

Semiconductor device

Method for packaging semiconductor device and package structure the...

Semiconductor device and method of manufacturing the same

Semiconductor module

Method for adhesive bonding in electronic packaging

Bonding apparatus, bonding method, and method for manufacturing sem...