Glasses

Industry

CPC
H01L2224/29288

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29288Glasses

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, mechanical quantity measuring device, and sem...
- Patent number 10,247,630
- Issue date Apr 2, 2019
- Hitachi Automotive Systems, Ltd.
- Hanae Shimokawa
- G01 - MEASURING TESTING
Information Patent Grant
Joint material, and jointed body
- Patent number 9,543,265
- Issue date Jan 10, 2017
- Hitachi, Ltd.
- Motomune Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive applications using alkali silicate glass for electronics
- Patent number 8,637,980
- Issue date Jan 28, 2014
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing near-hermetically coated integrated circuit as...
- Patent number 8,581,108
- Issue date Nov 12, 2013
- Rockwell Collins, Inc.
- Alan P. Boone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package system with multiple die
- Patent number 8,067,825
- Issue date Nov 29, 2011
- Stats Chippac Ltd.
- Abelardo Jr. Hadap Advincula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of package height in a stacked die configuration
- Patent number 7,932,131
- Issue date Apr 26, 2011
- Spansion LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided chip mount package
- Patent number 6,265,769
- Issue date Jul 24, 2001
- Texas Instruments Incorporated
- Jimmy Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver-glass pastes
- Patent number 5,084,421
- Issue date Jan 28, 1992
- Johnson Matthey, Inc.
- Thomas L. Herrington
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Silver-glass pastes
- Patent number 5,075,262
- Issue date Dec 24, 1991
- Johnson Matthey, Inc.
- My N. Nguyen
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Silver phosphate glass die-attach composition
- Patent number 4,997,718
- Issue date Mar 5, 1991
- VLSI Packaging Materials, Inc.
- Maurice E. Dumesnil
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Semiconductor die attach system
- Patent number 4,978,052
- Issue date Dec 18, 1990
- Olin Corporation
- Julius C. Fister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver-filled glass
- Patent number 4,436,785
- Issue date Mar 13, 1984
- Johnson Matthey Inc.
- Raymond L. Dietz
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL QUANTITY MEASUREMENT DEVICE AND METHOD FOR MANUFACTURING S...
- Publication number 20190371759
- Publication date Dec 5, 2019
- Hitachi Automotive Systems, Ltd.
- Takuya AOYAGI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE, MECHANICAL QUANTITY MEASURING DEVICE, AND SEM...
- Publication number 20180202883
- Publication date Jul 19, 2018
- Hitachi Automotive Systems, Ltd.
- Hanae SHIMOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joint Material, and Jointed Body
- Publication number 20140287227
- Publication date Sep 25, 2014
- Hitachi, Ltd
- Motomune KODAMA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
SEMICONDUCTOR POWER MODULE, PRODUCTION METHOD OF SEMICONDUCTOR POWE...
- Publication number 20140138850
- Publication date May 22, 2014
- NGK Spark Plug Co., Ltd.
- Yasushi Takayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20100148364
- Publication date Jun 17, 2010
- Masahiro OKITA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Reduction of package height in a stacked die configuration
- Publication number 20090115033
- Publication date May 7, 2009
- Spansion LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DIE
- Publication number 20090085181
- Publication date Apr 2, 2009
- Abelardo Hadap Advincula, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual die bonder for a semiconductor device and a method thereof
- Publication number 20030145939
- Publication date Aug 7, 2003
- Seung Chul Ahn
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device, mechanical quantity measuring device, and sem...

Joint material, and jointed body

Adhesive applications using alkali silicate glass for electronics

Method for providing near-hermetically coated integrated circuit as...

Integrated circuit package system with multiple die

Reduction of package height in a stacked die configuration

Double-sided chip mount package

Silver-glass pastes

Silver-glass pastes

Silver phosphate glass die-attach composition

Semiconductor die attach system

Silver-filled glass

Patents Applicationslast 30 patents

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

PHYSICAL QUANTITY MEASUREMENT DEVICE AND METHOD FOR MANUFACTURING S...

SEMICONDUCTOR DEVICE, MECHANICAL QUANTITY MEASURING DEVICE, AND SEM...

Joint Material, and Jointed Body

SEMICONDUCTOR POWER MODULE, PRODUCTION METHOD OF SEMICONDUCTOR POWE...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Reduction of package height in a stacked die configuration

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DIE

Dual die bonder for a semiconductor device and a method thereof