Gold [Au] as principal constituent

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H01L2224/83444

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83444Gold [Au] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding sheet and bonded structure
- Patent number 12,046,572
- Issue date Jul 23, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for fabricating silicon die stacks for electron...
- Patent number 12,027,489
- Issue date Jul 2, 2024
- Ukyo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing a light-emitting device and a method for manuf...
- Patent number 11,916,041
- Issue date Feb 27, 2024
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,735,689
- Issue date Aug 22, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 11,594,509
- Issue date Feb 28, 2023
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Employing deformable contacts and pre-applied underfill for bonding...
- Patent number 11,575,069
- Issue date Feb 7, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- G02 - OPTICS
Information Patent Grant
Curing pre-applied and plasma-etched underfill via a laser
- Patent number 11,563,142
- Issue date Jan 24, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively bonding light-emitting devices via a pulsed laser
- Patent number 11,557,692
- Issue date Jan 17, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 11,508,635
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-attach method to compensate for thermal expansion
- Patent number 11,430,744
- Issue date Aug 30, 2022
- Cree, Inc.
- David Seebacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting an electrical component in which a hood is used...
- Patent number 11,424,170
- Issue date Aug 23, 2022
- Siemens Aktiengesellschaft
- Nora Busche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and its process for curing post-applied underfill ma...
- Patent number 11,404,600
- Issue date Aug 2, 2022
- Meta Platforms Technologies, LLC
- Jeb Wu
- G02 - OPTICS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,374,148
- Issue date Jun 28, 2022
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 11,227,776
- Issue date Jan 18, 2022
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package, an electronic circuit package, and methods for enc...
- Patent number 11,189,537
- Issue date Nov 30, 2021
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-eutectic bonding
- Patent number 11,141,810
- Issue date Oct 12, 2021
- TECHNI HOLDING AS
- Andreas Larsson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having chips attached to support members throu...
- Patent number 11,101,246
- Issue date Aug 24, 2021
- Denso Corporation
- Tomohito Iwashige
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 10,923,449
- Issue date Feb 16, 2021
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having semiconductor chips disposed in openi...
- Patent number 10,825,776
- Issue date Nov 3, 2020
- Samsung Electronics Co., Ltd.
- Yoonha Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device
- Patent number 10,818,580
- Issue date Oct 27, 2020
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a silver sintering agent having silver oxide s...
- Patent number 10,785,877
- Issue date Sep 22, 2020
- Heraeus Deutschland GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
- Publication number 20240371819
- Publication date Nov 7, 2024
- NANO-X IMAGING LTD.
- Ukyo JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lid Structure With Openings To Alleviate Leakage Of Thermal Interfa...
- Publication number 20240332113
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE
- Publication number 20240149340
- Publication date May 9, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Shinichi YAMAUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Method for Fabricating a Power Semiconductor Device
- Publication number 20240096842
- Publication date Mar 21, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
- Publication number 20240047415
- Publication date Feb 8, 2024
- NANO-X IMAGING LTD
- Ukyo JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
- Publication number 20230230950
- Publication date Jul 20, 2023
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Yuechen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SHEET AND BONDED STRUCTURE
- Publication number 20230005871
- Publication date Jan 5, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...
- Publication number 20220181293
- Publication date Jun 9, 2022
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Method for Fabricating a Power Semic...
- Publication number 20210225795
- Publication date Jul 22, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Process and Structure of Fine Pitch Traces for a Solid...
- Publication number 20210159203
- Publication date May 27, 2021
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...
- Publication number 20200395520
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20200312818
- Publication date Oct 1, 2020
- DENSO CORPORATION
- Tomohito IWASHIGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORAT...
- Publication number 20190306976
- Publication date Oct 3, 2019
- OSRAM SYLVANIA INC.
- Sridharan Venk
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...
- Publication number 20190139899
- Publication date May 9, 2019
- Samsung Electronics Co., Ltd.
- Yoonha JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180358319
- Publication date Dec 13, 2018
- Mitsubishi Electric Corporation
- Daisuke MURATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...
- Publication number 20180286831
- Publication date Oct 4, 2018
- Heraeus Deutschland GmbH & Co. KG
- Andreas HINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF FORMING SEMICONDUCTOR APPARATUS MOUNTING ON SUBSTRATE
- Publication number 20180240765
- Publication date Aug 23, 2018
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Masaomi Emori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Paste For Bonding
- Publication number 20180102341
- Publication date Apr 12, 2018
- E I DU PONT DE NEMOURS AND COMPANY
- Takuya Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-TRANSFER PRINTING WITH VOLATILE ADHESIVE LAYER
- Publication number 20180096964
- Publication date Apr 5, 2018
- X-Celeprint Limited
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20170365578
- Publication date Dec 21, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20170117246
- Publication date Apr 27, 2017
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS

Gold [Au] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connection structure and manufacturing method therefor

Leadframe package with pre-applied filler material

Semiconductor package having routable encapsulated conductive subst...

Bonding sheet and bonded structure

Systems and methods for fabricating silicon die stacks for electron...

Method for repairing a light-emitting device and a method for manuf...

Electronic device with multi-layer contact and system

Dielectric-dielectric and metallization bonding via plasma activati...

Fabrication process and structure of fine pitch traces for a solid...

Employing deformable contacts and pre-applied underfill for bonding...

Curing pre-applied and plasma-etched underfill via a laser

Selectively bonding light-emitting devices via a pulsed laser

Chip assembly

Semiconductor package having routable encapsulated conductive subst...

Die-attach method to compensate for thermal expansion

Method for mounting an electrical component in which a hood is used...

Soldering a conductor to an aluminum layer

Display device and its process for curing post-applied underfill ma...

Sintering materials and attachment methods using same

Dielectric-dielectric and metallization bonding via plasma activati...

Leadframe package with pre-applied filler material

Circuit package, an electronic circuit package, and methods for enc...

Non-eutectic bonding

Semiconductor device having chips attached to support members throu...

Method for electrically contacting a component by galvanic connecti...

Fabrication process and structure of fine pitch traces for a solid...

Method and apparatus for creating a bond between objects based on f...

Semiconductor packages having semiconductor chips disposed in openi...

Electronic component device

Method for producing a silver sintering agent having silver oxide s...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

Lid Structure With Openings To Alleviate Leakage Of Thermal Interfa...

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

JOINT STRUCTURE

Method for Fabricating a Power Semiconductor Device

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

BONDING SHEET AND BONDED STRUCTURE

METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...

Power Semiconductor Device and Method for Fabricating a Power Semic...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

Fabrication Process and Structure of Fine Pitch Traces for a Solid...

DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

DIE BONDING APPARATUS AND DIE BONDING METHOD

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

Electronic Device with Multi-Layer Contact and System

CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORAT...

SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...

Method for Producing Electronic Device With Multi-Layer Contact

SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...

PROCESS OF FORMING SEMICONDUCTOR APPARATUS MOUNTING ON SUBSTRATE

Conductive Paste For Bonding

MICRO-TRANSFER PRINTING WITH VOLATILE ADHESIVE LAYER

DIE BONDING APPARATUS AND DIE BONDING METHOD

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...