Gold [Au] as principal constituent

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H01L2224/37144

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/37144Gold [Au] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Optical module
- Patent number 11,736,197
- Issue date Aug 22, 2023
- CIG PHOTONICS JAPAN LIMITED
- Daisuke Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Packaged semiconductor device having a shielding against electromag...
- Patent number 10,455,692
- Issue date Oct 22, 2019
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,199,347
- Issue date Feb 5, 2019
- Fuji Electric Co., Ltd.
- Tomohiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having a shielding against electromag...
- Patent number 9,736,925
- Issue date Aug 15, 2017
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,633,967
- Issue date Apr 25, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array based fabrication of power semiconductor package with integra...
- Patent number 9,620,475
- Issue date Apr 11, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,609,775
- Issue date Mar 28, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 9,443,760
- Issue date Sep 13, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 9,379,046
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device
- Patent number 9,362,240
- Issue date Jun 7, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrophoretically depositing a film on an electronic a...
- Patent number 9,313,897
- Issue date Apr 12, 2016
- Infineon Technologies AG
- Joachim Mahler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nitride semiconductor device
- Patent number 9,177,915
- Issue date Nov 3, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuhiro Kaibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,171,817
- Issue date Oct 27, 2015
- Kabushiki Kaisha Toshiba
- Takeshi Miyakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 8,916,968
- Issue date Dec 23, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangements, a chip package and a method for manufacturing a...
- Patent number 8,853,835
- Issue date Oct 7, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 8,633,102
- Issue date Jan 21, 2014
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-spring chip attachment using ribbon bonds
- Patent number 8,614,514
- Issue date Dec 24, 2013
- Palo Alto Research Center Incorporated
- Vernon Powers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor component and structure th...
- Patent number 8,582,317
- Issue date Nov 12, 2013
- Semiconductor Components Industries, LLC
- Yenting Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 8,237,268
- Issue date Aug 7, 2012
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure having enhanced thermal dissipation...
- Patent number 7,944,044
- Issue date May 17, 2011
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA
- Publication number 20250183221
- Publication date Jun 5, 2025
- Infineon Technologies Austria AG
- Yi Ting Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387455
- Publication date Nov 21, 2024
- NHINC Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20220103262
- Publication date Mar 31, 2022
- CIG Photonics Japan Limited
- Daisuke NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING A SHIELDING AGAINST ELECTROMAG...
- Publication number 20170325329
- Publication date Nov 9, 2017
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20150294926
- Publication date Oct 15, 2015
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140374926
- Publication date Dec 25, 2014
- Kabushiki Kaisha Toshiba
- Takeshi MIYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Device Comprising Non-Integer Lead Pitches and Method of M...
- Publication number 20140264798
- Publication date Sep 18, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20140110829
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20140103537
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- Kazuhiro KAIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...
- Publication number 20140097528
- Publication date Apr 10, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Electrophoretic Depositing (EPD) a Film on a System and S...
- Publication number 20140076613
- Publication date Mar 20, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Multichip Power Semiconductor Device
- Publication number 20130256856
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20120276693
- Publication date Nov 1, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...
- Publication number 20110292632
- Publication date Dec 1, 2011
- Yenting Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module comprising a semiconductor chip
- Publication number 20080230928
- Publication date Sep 25, 2008
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING ENHANCED THERMAL DISSIPATION...
- Publication number 20070278664
- Publication date Dec 6, 2007
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS

Gold [Au] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optical module

Method for electrically contacting a component by galvanic connecti...

Packaged semiconductor device having a shielding against electromag...

Semiconductor device

Packaged semiconductor device having a shielding against electromag...

Semiconductor module

Array based fabrication of power semiconductor package with integra...

Semiconductor module

Multichip power semiconductor device

Module comprising a semiconductor chip

Electronic device

Method for electrophoretically depositing a film on an electronic a...

Nitride semiconductor device

Semiconductor device

Multichip power semiconductor device

Chip arrangements, a chip package and a method for manufacturing a...

Module comprising a semiconductor chip

Micro-spring chip attachment using ribbon bonds

Method for manufacturing a semiconductor component and structure th...

Module comprising a semiconductor chip

Semiconductor package structure having enhanced thermal dissipation...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

OPTICAL MODULE

PACKAGED SEMICONDUCTOR DEVICE HAVING A SHIELDING AGAINST ELECTROMAG...

Module Comprising a Semiconductor Chip

SEMICONDUCTOR DEVICE

Packaged Device Comprising Non-Integer Lead Pitches and Method of M...

Module Comprising a Semiconductor Chip

NITRIDE SEMICONDUCTOR DEVICE

CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...

Method of Electrophoretic Depositing (EPD) a Film on a System and S...

Multichip Power Semiconductor Device

Module Comprising a Semiconductor Chip

METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...

Module comprising a semiconductor chip

SEMICONDUCTOR PACKAGE STRUCTURE HAVING ENHANCED THERMAL DISSIPATION...