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H01L2224/05644
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/05644
Gold [Au] as principal constituent
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Patents Grants
last 30 patents
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Patent Grant
Method for producing a connection between component parts, and comp...
Patent number
11,961,820
Issue date
Apr 16, 2024
OSRAM OLED GmbH
Simeon Katz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device having pixels with the same active layer and method...
Patent number
11,942,025
Issue date
Mar 26, 2024
Samsung Display Co., Ltd.
Jin Wan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon photonic interposer with two metal redistribution layers
Patent number
11,923,327
Issue date
Mar 5, 2024
Rockley Photonics Limited
Michael Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device interconnection systems and methods
Patent number
11,916,039
Issue date
Feb 27, 2024
Teledyne FLIR Commercial Systems, Inc.
Richard E. Bornfreund
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,901,251
Issue date
Feb 13, 2024
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package
Patent number
11,894,306
Issue date
Feb 6, 2024
Ping-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-metal contact structure
Patent number
11,894,326
Issue date
Feb 6, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
Patent number
11,894,330
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and method for manufacturing the same
Patent number
11,894,335
Issue date
Feb 6, 2024
Japan Display Inc.
Kazuyuki Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Temperature hierarchy solder bonding
Patent number
11,887,956
Issue date
Jan 30, 2024
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electric field control for bond pads in semiconductor device package
Patent number
11,881,461
Issue date
Jan 23, 2024
Texas Instruments Incorporated
Enis Tuncer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
Patent number
11,881,476
Issue date
Jan 23, 2024
Semtech Corporation
Changjun Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including bond pad with fixing parts fixed ont...
Patent number
11,876,061
Issue date
Jan 16, 2024
Mitsubishi Electric Corporation
Yasuki Aihara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,876,032
Issue date
Jan 16, 2024
Murata Manufacturing Co., Ltd.
Shinnosuke Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
11,869,809
Issue date
Jan 9, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding process with inhibited oxide formation
Patent number
11,869,870
Issue date
Jan 9, 2024
SiTime Corporation
Paul M. Hagelin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chip and manufacturing method thereof, and electronic device
Patent number
11,862,529
Issue date
Jan 2, 2024
Huawei Technologies Co., Ltd.
Chaojun Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device, device, and manufacturing method
Patent number
11,854,957
Issue date
Dec 26, 2023
Seiko Epson Corporation
Naoki Il
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,848,346
Issue date
Dec 19, 2023
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Satoru Wakiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making an integrated circuit package including an integra...
Patent number
11,842,955
Issue date
Dec 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with multi-layer contact and system
Patent number
11,842,975
Issue date
Dec 12, 2023
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
Patent number
11,837,562
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Chang-Pin Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module and method of manufacturing semiconductor module
Patent number
11,824,024
Issue date
Nov 21, 2023
Fuji Electric Co., Ltd.
Yasuaki Hozumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Connector structure and method of forming same
Patent number
11,824,026
Issue date
Nov 21, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Chen-Shien Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and method for fabricating the same
Patent number
11,784,177
Issue date
Oct 10, 2023
Samsung Display Co., Ltd.
Seung Geun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,769,746
Issue date
Sep 26, 2023
Samsung Electronics Co., Ltd.
Ae-nee Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Elastic wave device
Patent number
11,764,752
Issue date
Sep 19, 2023
Murata Manufacturing Co., Ltd.
Masatoshi Nakagawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal pad modification
Patent number
11,756,911
Issue date
Sep 12, 2023
International Business Machines Corporation
Krishna Tunga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Field effect transistor and semiconductor device
Patent number
11,749,622
Issue date
Sep 5, 2023
SUMITOMO DEVICE INNOVATIONS, INC.
Chihoko Akiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
11,742,310
Issue date
Aug 29, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
Publication number
20240131633
Publication date
Apr 25, 2024
Sekisui Chemical Co., Ltd.
Hidefumi YASUI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20240136327
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
AENEE JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
Publication number
20240136309
Publication date
Apr 25, 2024
Mitsubishi Electric Corporation
Yasunari HINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240136241
Publication date
Apr 25, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...
Publication number
20240128215
Publication date
Apr 18, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Takashi NOMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
Publication number
20240120207
Publication date
Apr 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Lung-Kai Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
Publication number
20240120295
Publication date
Apr 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Hsien Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...
Publication number
20240120298
Publication date
Apr 11, 2024
Dietrich Bonart
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC CHIP WITH UBM-TYPE METALLIZATION
Publication number
20240113054
Publication date
Apr 4, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Clément Lobre
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240113066
Publication date
Apr 4, 2024
Sony Semiconductor Solutions Corporation
Takashi IMAHIGASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240113089
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tian Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20240113090
Publication date
Apr 4, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Won Myoung KI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GALVANIC ISOLATION DEVICE
Publication number
20240113094
Publication date
Apr 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Jeffrey Alan West
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240105652
Publication date
Mar 28, 2024
SK HYNIX INC.
Dae Won KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION
Publication number
20240107780
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
Publication number
20240105670
Publication date
Mar 28, 2024
CYNTEC CO., LTD.
Chi-Hung Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding
Publication number
20240105545
Publication date
Mar 28, 2024
Apple Inc.
Jiongxin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOCUMENT STRUCTURE FORMATION
Publication number
20240105669
Publication date
Mar 28, 2024
INFINEON TECHNOLOGIES AG
Jens Pohl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D System and Wafer Reconstitution with Mid-layer Interposer
Publication number
20240105699
Publication date
Mar 28, 2024
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Fabricating a Power Semiconductor Device
Publication number
20240096842
Publication date
Mar 21, 2024
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates
Publication number
20240096807
Publication date
Mar 21, 2024
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR APPARATUS, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD F...
Publication number
20240088076
Publication date
Mar 14, 2024
OLYMPUS CORPORATION
Keiichi KOBAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
Publication number
20240088087
Publication date
Mar 14, 2024
INFINEON TECHNOLOGIES AG
Alexander HEINRICH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240079392
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chuei-Tang WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die Structures and Methods of Forming the Same
Publication number
20240079364
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die Structures and Methods of Forming the Same
Publication number
20240079391
Publication date
Mar 7, 2024
Taiwan Semiconductor Mqanufacturing Co., Ltd.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...
Publication number
20240071998
Publication date
Feb 29, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Li-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING DISPLAY PANEL
Publication number
20240072027
Publication date
Feb 29, 2024
SAMSUNG DISPLAY CO., LTD.
Jeong Won HAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240063178
Publication date
Feb 22, 2024
Intel Corporation
Jimin Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS AND METHOD OF MANUFAC...
Publication number
20240063186
Publication date
Feb 22, 2024
SAMSUNG ELECTRONICS CO,. LTD.
SEYONG LEE
H01 - BASIC ELECTRIC ELEMENTS