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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
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H01L2924/01079
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Patents Grants
last 30 patents
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Patent Grant
Methods for low temperature bonding using nanoparticles
Patent number
11,973,056
Issue date
Apr 30, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Single-package wireless communication device
Patent number
11,942,676
Issue date
Mar 26, 2024
Tahoe Research, LTD.
Mohamed A. Megahed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating semiconductor device with graphene layers
Patent number
11,908,816
Issue date
Feb 20, 2024
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,901,251
Issue date
Feb 13, 2024
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked microfeature devices and associated methods
Patent number
11,887,970
Issue date
Jan 30, 2024
Micron Technology, Inc.
Mung Suan Heng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
Patent number
11,881,463
Issue date
Jan 23, 2024
Intel Corporation
Andrew J. Brown
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,876,053
Issue date
Jan 16, 2024
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic components including metal pillars secured to bond...
Patent number
11,869,862
Issue date
Jan 9, 2024
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
11,869,809
Issue date
Jan 9, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding process with inhibited oxide formation
Patent number
11,869,870
Issue date
Jan 9, 2024
SiTime Corporation
Paul M. Hagelin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging method for fan-out wafer-level packaging structure
Patent number
11,862,595
Issue date
Jan 2, 2024
SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
Hailin Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a semiconductor device having TSV formed through...
Patent number
11,854,990
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with multi-layer contact and system
Patent number
11,842,975
Issue date
Dec 12, 2023
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,824,008
Issue date
Nov 21, 2023
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
Patent number
11,817,415
Issue date
Nov 14, 2023
Nitto Denko Corporation
Satoshi Honda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having through silicon vias and manufacturing...
Patent number
11,817,427
Issue date
Nov 14, 2023
LONGITUDE LICENSING LIMITED
Ryohei Kitada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Post passivation interconnect
Patent number
11,817,404
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-An Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for fabricating a semiconductor device
Patent number
11,817,417
Issue date
Nov 14, 2023
Infineon Technologies Austria AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging structure
Patent number
11,791,310
Issue date
Oct 17, 2023
TONGFU MICROELECTRONICS CO., LTD.
Lei Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including a solder compound containing a compo...
Patent number
11,776,927
Issue date
Oct 3, 2023
Infineon Technologies AG
Thomas Behrens
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,764,131
Issue date
Sep 19, 2023
ABLIC Inc.
Koji Tsukagoshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump structure to prevent metal redeposit and to prevent bond pad c...
Patent number
11,735,550
Issue date
Aug 22, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Sheng Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing an electronic module and electronic module
Patent number
11,716,816
Issue date
Aug 1, 2023
IMBERATEK, LLC
Antti Iihola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for production of semiconductor device
Patent number
11,715,752
Issue date
Aug 1, 2023
Sony Group Corporation
Atsushi Okuyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures and methods for low temperature bonding using nanoparticles
Patent number
11,710,718
Issue date
Jul 25, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable via package and method
Patent number
11,700,692
Issue date
Jul 11, 2023
Amkor Technology Singapore Holding Pte Ltd.
Akito Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for attachment and devices produced using the methods
Patent number
11,699,632
Issue date
Jul 11, 2023
Alpha Assembly Solutions Inc.
Monnir Boureghda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device
Patent number
11,692,677
Issue date
Jul 4, 2023
Nichia Corporation
Yuichiro Tanda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Photocoupler
Patent number
11,688,823
Issue date
Jun 27, 2023
Kabushiki Kaisha Toshiba
Mami Fujihara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming interposer with opening...
Patent number
11,688,612
Issue date
Jun 27, 2023
STATS ChipPAC Pte. Ltd.
Reza A. Pagaila
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
Publication number
20240145305
Publication date
May 2, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240136241
Publication date
Apr 25, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASSEMBLY OF AN INTEGRATED CIRCUIT IN A CHIP SCALE BALL GRID ARRAY
Publication number
20240113062
Publication date
Apr 4, 2024
Azimuth Industrial Company, Inc.
David Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
Publication number
20240088087
Publication date
Mar 14, 2024
INFINEON TECHNOLOGIES AG
Alexander HEINRICH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240079392
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chuei-Tang WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die Structures and Methods of Forming the Same
Publication number
20240079364
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
Publication number
20240038714
Publication date
Feb 1, 2024
Infineon Technologies Austria AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT-EMITTING DIODE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240021593
Publication date
Jan 18, 2024
UNITED MICROELECTRONICS CORP.
ZHIBIAO ZHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20230411317
Publication date
Dec 21, 2023
Walton Advanced Engineering, Inc
HONG-CHI YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKABLE VIA PACKAGE AND METHOD
Publication number
20230354523
Publication date
Nov 2, 2023
Amkor Technology Singapore Holding Pte. Ltd.
Akito Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming RDL and Side and Back...
Publication number
20230343668
Publication date
Oct 26, 2023
UTAC Headquarters Pte. Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
Publication number
20230335531
Publication date
Oct 19, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE
Publication number
20230290750
Publication date
Sep 14, 2023
Sumitomo Electric Industries, Ltd.
Tatsuya HASHINAGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE DEVICE
Publication number
20230230965
Publication date
Jul 20, 2023
Samsung Electronics Co., Ltd.
DONGKYU KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Superconducting Bump Bonds for Quantum Computing Systems
Publication number
20230207507
Publication date
Jun 29, 2023
Google LLC
Zhimin Jamie Yao
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
Publication number
20230197679
Publication date
Jun 22, 2023
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20230187275
Publication date
Jun 15, 2023
RENESAS ELECTRONICS CORPORATION
Katsuhiko HOTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP INCLUDING ALIGN MARK PROTECTION PATTERN AND SEMI...
Publication number
20230154860
Publication date
May 18, 2023
SK HYNIX INC.
Hyun Chul SEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
Publication number
20230132060
Publication date
Apr 27, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20230111343
Publication date
Apr 13, 2023
Samsung Electronics Co., Ltd.
Choong Bin YIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD
Publication number
20230086535
Publication date
Mar 23, 2023
TEXAS INSTRUMENTS INCORPORATED
Lin Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Die Contact Structure and Method
Publication number
20230085696
Publication date
Mar 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
Publication number
20230083412
Publication date
Mar 16, 2023
Amkor Technology Singapore Holding Pte. Ltd.
Won Bae BANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
Publication number
20230060577
Publication date
Mar 2, 2023
Showa Denko Materials Co., Ltd.
Kunihiko AKAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
Publication number
20230031099
Publication date
Feb 2, 2023
ADVANCED MICRO DEVICES, INC.
BRYAN BLACK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE WITH BUMP INTERCONNEC...
Publication number
20230034877
Publication date
Feb 2, 2023
SK HYNIX INC.
Jun Yong SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
Publication number
20230023328
Publication date
Jan 26, 2023
Intel Corporation
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
Publication number
20230020310
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Christopher Wyland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230018430
Publication date
Jan 19, 2023
NIPPON MICROMETAL CORPORATION
Daizo ODA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
IMAGING DEVICE AND METHOD FOR MANUFACTURING IMAGING DEVICE
Publication number
20220415953
Publication date
Dec 29, 2022
Sony Semiconductor Solutions Corporation
MASAYA NAGATA
H01 - BASIC ELECTRIC ELEMENTS