Grinding, lapping

Industry

CPC
H01L21/02013

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02013Grinding, lapping

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Silicon carbide wafers and grinding method thereof
- Patent number 12,308,224
- Issue date May 20, 2025
- GlobalWafers Co., Ltd.
- Chin Chen Chiu
- C30 - CRYSTAL GROWTH
Information Patent Grant
Manufacturing methods of wafer and chips and position adjustment me...
- Patent number 12,263,539
- Issue date Apr 1, 2025
- Disco Corporation
- Kazuki Hashimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polishing pad and method of fabricating semiconductor device using...
- Patent number 12,246,408
- Issue date Mar 11, 2025
- SK ENPULSE CO., LTD.
- Eun Sun Joeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back grinding adhesive sheet, and method for manufacturing semicond...
- Patent number 12,243,766
- Issue date Mar 4, 2025
- Disco Corporation
- Karl Heinz Priewasser
- B24 - GRINDING POLISHING
Information Patent Grant
Indium phosphide substrate
- Patent number 12,217,967
- Issue date Feb 4, 2025
- JX Advanced Metals Corporation
- Shunsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of wafer, protective sheet, and protective sheet...
- Patent number 12,217,966
- Issue date Feb 4, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating gallium nitride substrate using ion implantation
- Patent number 12,183,575
- Issue date Dec 31, 2024
- IUCF-HYU (Industry-University Cooperation Foundation Hanyang University)
- Jea Gun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method of a high-resistivity silicon handle wafer for a...
- Patent number 12,176,202
- Issue date Dec 24, 2024
- OKMETIC OY
- Päivi Sievilä
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming an adhesive layer, and related adhesive films an...
- Patent number 12,157,847
- Issue date Dec 3, 2024
- Seagate Technology LLC
- Zubair Ahmed Khan
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer and method of wafer thinning
- Patent number 12,154,783
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC wafer and manufacturing method for SiC wafer
- Patent number 12,139,813
- Issue date Nov 12, 2024
- Toyota Tsusho Corporation
- Masatake Nagaya
- C30 - CRYSTAL GROWTH
Information Patent Grant
Polishing composition
- Patent number 12,139,643
- Issue date Nov 12, 2024
- Fujimi Incorporated
- Yuichiro Nakagai
- B24 - GRINDING POLISHING
Information Patent Grant
Method of printing laser mark and method of producing laser-marked...
- Patent number 12,083,624
- Issue date Sep 10, 2024
- Sumco Corporation
- Yoichiro Hirakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processed inorganic wafer and processing wafer stack with abrasive...
- Patent number 12,062,534
- Issue date Aug 13, 2024
- MOSAIC MICROSYSTEMS LLC
- Shelby Forrester Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a substrate and system for producing a substrate
- Patent number 12,062,533
- Issue date Aug 13, 2024
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monolayer graphene on non-polar face SiC substrate and control meth...
- Patent number 12,051,585
- Issue date Jul 30, 2024
- Tianjin University
- Lei Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,973,036
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having processor and static random-acc...
- Patent number 11,950,399
- Issue date Apr 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer production method
- Patent number 11,948,789
- Issue date Apr 2, 2024
- Sumco Corporation
- Toshiyuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing silicon substrate and polishing composition set
- Patent number 11,897,081
- Issue date Feb 13, 2024
- FUJIMI INCORPORATED
- Shinichiro Takami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonded semiconductor devices having processor and NAND flash memory...
- Patent number 11,864,367
- Issue date Jan 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning semiconductor wafer
- Patent number 11,862,456
- Issue date Jan 2, 2024
- Shin-Etsu Handotai Co., Ltd.
- Kensaku Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,850,697
- Issue date Dec 26, 2023
- Tokyo Electron Limited
- Osamu Miyahara
- B24 - GRINDING POLISHING
Information Patent Grant
Laser-assisted method for parting crystalline material
- Patent number 11,826,846
- Issue date Nov 28, 2023
- Wolfspeed, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Workpiece processing apparatus including a resin coater and a resin...
- Patent number 11,819,975
- Issue date Nov 21, 2023
- Disco Corporation
- Shinya Watanabe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Wafer processing with a protective film and peripheral adhesive
- Patent number 11,784,138
- Issue date Oct 10, 2023
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seed crystal for single crystal 4H—SiC growth and method for proces...
- Patent number 11,781,244
- Issue date Oct 10, 2023
- Resonac Corporation
- Takanori Kido
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing system for removing peripheral portion of subs...
- Patent number 11,752,576
- Issue date Sep 12, 2023
- Tokyo Electron Limited
- Hayato Tanoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for creating cavities in silicon carbide and other semicondu...
- Patent number 11,756,783
- Issue date Sep 12, 2023
- HRL Laboratories, LLC
- Eric Prophet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for manufacturing semiconductor device
- Patent number 11,735,411
- Issue date Aug 22, 2023
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi Yamamoto
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING A NON-DEFORMABLE P-SIC WAFER
- Publication number 20250125140
- Publication date Apr 17, 2025
- SOITEC
- Andrea Quintero-Colmenares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR PACKA...
- Publication number 20250125216
- Publication date Apr 17, 2025
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- YUEH-MING TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20250125197
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20250073820
- Publication date Mar 6, 2025
- Disco Corporation
- Masaru Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250073821
- Publication date Mar 6, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
- Publication number 20250062114
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250050462
- Publication date Feb 13, 2025
- EBARA CORPORATION
- Makoto KASHIWAGI
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE
- Publication number 20250018486
- Publication date Jan 16, 2025
- COMPTAKE TECHNOLOGY INC.
- YAO-GUANG YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20250014888
- Publication date Jan 9, 2025
- Disco Corporation
- Akira MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250014889
- Publication date Jan 9, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250014949
- Publication date Jan 9, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250006484
- Publication date Jan 2, 2025
- Disco Corporation
- Akira MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240379584
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR GRINDING SEMICONDUCTOR WAFERS
- Publication number 20240379342
- Publication date Nov 14, 2024
- Siltronic AG
- Stephan OBERHANS
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20240331998
- Publication date Oct 3, 2024
- TOKYO ELECTRON LIMITED
- Susumu HAYAKAWA
- B24 - GRINDING POLISHING
Information Patent Application
MANUFACTURING METHOD FOR MANUFACTURING SUBSTRATE OF NITRIDE CRYSTAL...
- Publication number 20240293912
- Publication date Sep 5, 2024
- KYOCERA CORPORATION
- Mari YOSHIMORI HIGUCHI
- C30 - CRYSTAL GROWTH
Information Patent Application
METHODS OF PROCESSING SEMICONDUCTOR WAFERS USING DOUBLE SIDE GRINDI...
- Publication number 20240253173
- Publication date Aug 1, 2024
- GLOBALWAFERS CO., LTD.
- Tsunehiro Muronoi
- B24 - GRINDING POLISHING
Information Patent Application
BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACC...
- Publication number 20240251538
- Publication date Jul 25, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET FOR BACKGRINDING, SEMICONDUCTOR WAFER MANUFACTURING...
- Publication number 20240243000
- Publication date Jul 18, 2024
- Disco Corporation
- Shingo Motoike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION
- Publication number 20240199915
- Publication date Jun 20, 2024
- Yuichiro Nakagai
- B24 - GRINDING POLISHING
Information Patent Application
PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...
- Publication number 20240186285
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING GAAS WAFER, AND GAAS WAFER GROUP
- Publication number 20240162031
- Publication date May 16, 2024
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Junji SUGIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIMMING METHOD
- Publication number 20240112928
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- An-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR FORMING OHMIC CONTACTS TO N FACE BULK GAN...
- Publication number 20240097072
- Publication date Mar 21, 2024
- Palo Alto Research Center Incorporated
- Max Batres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD FOR FABRICATING SEMICONDUCTOR ARTICLES AND SYSTEM THEREOF
- Publication number 20240038525
- Publication date Feb 1, 2024
- Inari Technology Sdn Bhd
- BOON SENG TEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
- Publication number 20240030021
- Publication date Jan 25, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER STRUCTURAL OBJECT
- Publication number 20230343578
- Publication date Oct 26, 2023
- Rohm Co., Ltd.
- Minoru NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING GALLIUM NITRIDE SUBSTRATE
- Publication number 20230238281
- Publication date Jul 27, 2023
- DENSO CORPORATION
- MASATAKE NAGAYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUTOMATIC ABRASION COMPENSATION SYSTEM OF LOWER PLATE AND WAFER LAP...
- Publication number 20230211457
- Publication date Jul 6, 2023
- SK SILTRON CO., LTD.
- Jae Pyo LEE
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PADS AND SYSTEMS FOR AND METHODS OF USING SAME
- Publication number 20230211455
- Publication date Jul 6, 2023
- 3M Innovative Properties Company
- Joseph D. RULE
- B24 - GRINDING POLISHING

Grinding, lapping

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Silicon carbide wafers and grinding method thereof

Manufacturing methods of wafer and chips and position adjustment me...

Polishing pad and method of fabricating semiconductor device using...

Back grinding adhesive sheet, and method for manufacturing semicond...

Indium phosphide substrate

Processing method of wafer, protective sheet, and protective sheet...

Method of fabricating gallium nitride substrate using ion implantation

Manufacture method of a high-resistivity silicon handle wafer for a...

Methods of forming an adhesive layer, and related adhesive films an...

Semiconductor wafer and method of wafer thinning

SiC wafer and manufacturing method for SiC wafer

Polishing composition

Method of printing laser mark and method of producing laser-marked...

Processed inorganic wafer and processing wafer stack with abrasive...

Method of producing a substrate and system for producing a substrate

Monolayer graphene on non-polar face SiC substrate and control meth...

Semiconductor package structure and method of manufacturing the same

Bonded semiconductor devices having processor and static random-acc...

Wafer production method

Method for polishing silicon substrate and polishing composition set

Bonded semiconductor devices having processor and NAND flash memory...

Method for cleaning semiconductor wafer

Substrate processing apparatus and substrate processing method

Laser-assisted method for parting crystalline material

Workpiece processing apparatus including a resin coater and a resin...

Wafer processing with a protective film and peripheral adhesive

Seed crystal for single crystal 4H—SiC growth and method for proces...

Substrate processing system for removing peripheral portion of subs...

Method for creating cavities in silicon carbide and other semicondu...

Method and apparatus for manufacturing semiconductor device

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING A NON-DEFORMABLE P-SIC WAFER

DIE AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR PACKA...

SEMICONDUCTOR CHIP

WAFER PROCESSING METHOD

PROCESSING METHOD OF WAFER

SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE

WAFER PROCESSING METHOD

PROCESSING METHOD OF WAFER

PROCESSING METHOD OF WAFER

PROCESSING METHOD OF WAFER

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

METHOD FOR GRINDING SEMICONDUCTOR WAFERS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

MANUFACTURING METHOD FOR MANUFACTURING SUBSTRATE OF NITRIDE CRYSTAL...

METHODS OF PROCESSING SEMICONDUCTOR WAFERS USING DOUBLE SIDE GRINDI...

BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACC...

ADHESIVE SHEET FOR BACKGRINDING, SEMICONDUCTOR WAFER MANUFACTURING...

POLISHING COMPOSITION

PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...

METHOD OF PRODUCING GAAS WAFER, AND GAAS WAFER GROUP

TRIMMING METHOD

STRUCTURE AND METHOD FOR FORMING OHMIC CONTACTS TO N FACE BULK GAN...

A METHOD FOR FABRICATING SEMICONDUCTOR ARTICLES AND SYSTEM THEREOF

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER STRUCTURAL OBJECT

METHOD OF MANUFACTURING GALLIUM NITRIDE SUBSTRATE

AUTOMATIC ABRASION COMPENSATION SYSTEM OF LOWER PLATE AND WAFER LAP...

POLISHING PADS AND SYSTEMS FOR AND METHODS OF USING SAME