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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/02013
Grinding, lapping
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package structure and method of manufacturing the same
Patent number
11,973,036
Issue date
Apr 30, 2024
Advanced Semiconductor Engineering, Inc.
Ting-Yang Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded semiconductor devices having processor and static random-acc...
Patent number
11,950,399
Issue date
Apr 2, 2024
Yangtze Memory Technologies Co., Ltd.
Jun Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer production method
Patent number
11,948,789
Issue date
Apr 2, 2024
Sumco Corporation
Toshiyuki Tanaka
B24 - GRINDING POLISHING
Information
Patent Grant
Method for polishing silicon substrate and polishing composition set
Patent number
11,897,081
Issue date
Feb 13, 2024
FUJIMI INCORPORATED
Shinichiro Takami
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Bonded semiconductor devices having processor and NAND flash memory...
Patent number
11,864,367
Issue date
Jan 2, 2024
Yangtze Memory Technologies Co., Ltd.
Weihua Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for cleaning semiconductor wafer
Patent number
11,862,456
Issue date
Jan 2, 2024
Shin-Etsu Handotai Co., Ltd.
Kensaku Igarashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate processing apparatus and substrate processing method
Patent number
11,850,697
Issue date
Dec 26, 2023
Tokyo Electron Limited
Osamu Miyahara
B24 - GRINDING POLISHING
Information
Patent Grant
Laser-assisted method for parting crystalline material
Patent number
11,826,846
Issue date
Nov 28, 2023
Wolfspeed, Inc.
Matthew Donofrio
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Workpiece processing apparatus including a resin coater and a resin...
Patent number
11,819,975
Issue date
Nov 21, 2023
Disco Corporation
Shinya Watanabe
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Wafer processing with a protective film and peripheral adhesive
Patent number
11,784,138
Issue date
Oct 10, 2023
Disco Corporation
Karl Heinz Priewasser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Seed crystal for single crystal 4H—SiC growth and method for proces...
Patent number
11,781,244
Issue date
Oct 10, 2023
Resonac Corporation
Takanori Kido
B24 - GRINDING POLISHING
Information
Patent Grant
Substrate processing system for removing peripheral portion of subs...
Patent number
11,752,576
Issue date
Sep 12, 2023
Tokyo Electron Limited
Hayato Tanoue
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for creating cavities in silicon carbide and other semicondu...
Patent number
11,756,783
Issue date
Sep 12, 2023
HRL Laboratories, LLC
Eric Prophet
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for manufacturing semiconductor device
Patent number
11,735,411
Issue date
Aug 22, 2023
OKAMOTO MACHINE TOOL WORKS, LTD.
Eiichi Yamamoto
B24 - GRINDING POLISHING
Information
Patent Grant
Polishing apparatus including polishing pad conditioner, non-contac...
Patent number
11,735,427
Issue date
Aug 22, 2023
Samsung Electronics Co., Ltd.
Jin Shin
B24 - GRINDING POLISHING
Information
Patent Grant
Manufacturing method of chip package and chip package
Patent number
11,705,368
Issue date
Jul 18, 2023
Xintec Inc.
Chia-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded semiconductor devices having processor and static random-acc...
Patent number
11,659,702
Issue date
May 23, 2023
Yangtze Memory Technologies Co., Ltd.
Jun Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for polishing silicon substrate and polishing composition set
Patent number
11,648,641
Issue date
May 16, 2023
FUJIMI INCORPORATED
Makoto Tabata
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Method of processing wafer
Patent number
11,637,074
Issue date
Apr 25, 2023
Disco Corporation
Karl Heinz Priewasser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded unified semiconductor chips and fabrication and operation me...
Patent number
11,631,688
Issue date
Apr 18, 2023
Yangtze Memory Technologies Co., Ltd.
Jun Liu
G11 - INFORMATION STORAGE
Information
Patent Grant
Method of evaluating silicon wafer manufacturing process and method...
Patent number
11,626,331
Issue date
Apr 11, 2023
Sumco Corporation
Shigeru Daigo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of processing a wafer
Patent number
11,626,324
Issue date
Apr 11, 2023
Disco Corporation
Karl Heinz Priewasser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Grinding control method and device for wafer, and grinding device
Patent number
11,587,838
Issue date
Feb 21, 2023
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Hongsheng Yi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Workpiece processing and resin grinding apparatus
Patent number
11,574,804
Issue date
Feb 7, 2023
Disco Corporation
Shinya Watanabe
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Method of polishing silicon wafer including notch polishing process...
Patent number
11,551,922
Issue date
Jan 10, 2023
Sumco Corporation
Tsuyoshi Morita
B24 - GRINDING POLISHING
Information
Patent Grant
Surface protectant for semiconductor wafer
Patent number
11,542,406
Issue date
Jan 3, 2023
Daicel Corporation
Yuichi Sakanishi
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Wafer grinding method
Patent number
11,482,407
Issue date
Oct 25, 2022
Disco Corporation
Yohei Gokita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing wafer
Patent number
11,469,094
Issue date
Oct 11, 2022
Disco Corporation
Kazuya Hirata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of lapping semiconductor wafer and semiconductor wafer
Patent number
11,456,168
Issue date
Sep 27, 2022
Sumco Corporation
Daisuke Hashimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Grinding apparatus
Patent number
11,383,351
Issue date
Jul 12, 2022
Disco Corporation
Kenji Takenouchi
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
Information
Patent Application
TRIMMING METHOD
Publication number
20240112928
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
An-Hsuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD FOR FORMING OHMIC CONTACTS TO N FACE BULK GAN...
Publication number
20240097072
Publication date
Mar 21, 2024
Palo Alto Research Center Incorporated
Max Batres
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
A METHOD FOR FABRICATING SEMICONDUCTOR ARTICLES AND SYSTEM THEREOF
Publication number
20240038525
Publication date
Feb 1, 2024
Inari Technology Sdn Bhd
BOON SENG TEOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
Publication number
20240030021
Publication date
Jan 25, 2024
TOKYO ELECTRON LIMITED
Yohei YAMASHITA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER STRUCTURAL OBJECT
Publication number
20230343578
Publication date
Oct 26, 2023
Rohm Co., Ltd.
Minoru NAKAGAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING GALLIUM NITRIDE SUBSTRATE
Publication number
20230238281
Publication date
Jul 27, 2023
DENSO CORPORATION
MASATAKE NAGAYA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
AUTOMATIC ABRASION COMPENSATION SYSTEM OF LOWER PLATE AND WAFER LAP...
Publication number
20230211457
Publication date
Jul 6, 2023
SK SILTRON CO., LTD.
Jae Pyo LEE
B24 - GRINDING POLISHING
Information
Patent Application
POLISHING PADS AND SYSTEMS FOR AND METHODS OF USING SAME
Publication number
20230211455
Publication date
Jul 6, 2023
3M Innovative Properties Company
Joseph D. RULE
B24 - GRINDING POLISHING
Information
Patent Application
WAFER PRODUCTION METHOD AND WAFER PRODUCTION MACHINE
Publication number
20230178358
Publication date
Jun 8, 2023
Disco Corporation
Masaru NAGAMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER MANUFACTURING METHOD AND GRINDING APPARATUS
Publication number
20230178359
Publication date
Jun 8, 2023
Disco Corporation
Nobuyuki FUKUSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR GRINDING SEMICONDUCTOR WAFERS
Publication number
20230162969
Publication date
May 25, 2023
Siltronic AG
Michael Kerstan
B24 - GRINDING POLISHING
Information
Patent Application
METHOD FOR CLEANING SEMICONDUCTOR WAFER
Publication number
20230154742
Publication date
May 18, 2023
Shin-Etsu Handotai Co., Ltd.
Kensaku IGARASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CMP PROCESS APPLIED TO A THIN SIC WAFER FOR STRESS RELEASE AND DAMA...
Publication number
20230128739
Publication date
Apr 27, 2023
STMicroelectronics S.r.l.
Agata GRASSO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
Publication number
20230005756
Publication date
Jan 5, 2023
Qorvo US, Inc.
Krishna Chetry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILICON CARBIDE SUBSTRATE AND METHOD FOR MANUFACTURING SILICON CARB...
Publication number
20220403550
Publication date
Dec 22, 2022
Sumitomo Electric Industries, Ltd.
Kyoko OKITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILICON CARBIDE WAFERS AND GRINDING METHOD THEREOF
Publication number
20220392761
Publication date
Dec 8, 2022
GLOBALWAFERS CO., LTD.
Chin Chen Chiu
C30 - CRYSTAL GROWTH
Information
Patent Application
METHOD OF AND APPARATUS FOR PROCESSING WAFER
Publication number
20220384175
Publication date
Dec 1, 2022
Disco Corporation
Yoshinobu SAITO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE FILM FOR POLISHING PAD, LAMINATED POLISHING PAD INCLUDING...
Publication number
20220380644
Publication date
Dec 1, 2022
SKC solmics Co., Ltd.
Jung Nam LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SURFACE PROCESSING APPARATUS AND SURFACE PROCESSING METHOD FOR SiC...
Publication number
20220384185
Publication date
Dec 1, 2022
DENSO CORPORATION
Kazufumi AOKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS
Publication number
20220344149
Publication date
Oct 27, 2022
Fuji Electric Co., Ltd.
Michiya KITANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PRINTING LASER MARK AND METHOD OF PRODUCING LASER-MARKED...
Publication number
20220331906
Publication date
Oct 20, 2022
SUMCO CORPORATION
Yoichiro HIRAKAWA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LAMINATION WAFERS AND METHOD OF PRODUCING BONDED WAFERS USING THE SAME
Publication number
20220319835
Publication date
Oct 6, 2022
GlobalWafers Japan Co., Ltd.
Tatsuhiko AOKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHODS OF WAFER AND CHIPS AND POSITION ADJUSTMENT ME...
Publication number
20220288722
Publication date
Sep 15, 2022
Disco Corporation
Kazuki HASHIMOTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WAFER THINNING METHOD
Publication number
20220285217
Publication date
Sep 8, 2022
ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
YUEH-MING TUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSED INORGANIC WAFER AND PROCESSING WAFER STACK WITH ABRASIVE...
Publication number
20220246421
Publication date
Aug 4, 2022
MOSAIC MICROSYSTEMS LLC
Shelby Forrester Nelson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INDIUM PHOSPHIDE SUBSTRATE
Publication number
20220208549
Publication date
Jun 30, 2022
JX NIPPON MINING & METALS CORPORATION
Shunsuke OKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POLISHING RECIPE DETERMINATION DEVICE
Publication number
20220168864
Publication date
Jun 2, 2022
EBARA CORPORATION
Yoshikazu Kato
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
MONOLAYER GRAPHENE ON NON-POLAR FACE SiC SUBSTRATE AND CONTROL METH...
Publication number
20220122832
Publication date
Apr 21, 2022
TIANJIN UNIVERSITY
Lei MA
C30 - CRYSTAL GROWTH
Information
Patent Application
METHOD OF FABRICATING GALLIUM NITRIDE SUBSTRATE USING ION IMPLANTATION
Publication number
20220115228
Publication date
Apr 14, 2022
IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
Jea Gun PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURE METHOD OF A HIGH-RESISTIVITY SILICON HANDLE WAFER FOR A...
Publication number
20220115226
Publication date
Apr 14, 2022
OKMETIC OY
Päivi SIEVILÄ
B24 - GRINDING POLISHING