Groups of the periodic table

Industry

CPC
H01L2924/011

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/011Groups of the periodic table

Industries

Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,051,674
- Issue date Jul 30, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,967,583
- Issue date Apr 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,961,827
- Issue date Apr 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,916,045
- Issue date Feb 27, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,784,169
- Issue date Oct 10, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,676,945
- Issue date Jun 13, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,605,616
- Issue date Mar 14, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,532,599
- Issue date Dec 20, 2022
- Monolitic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal chalcogenide pillars
- Patent number 11,515,207
- Issue date Nov 29, 2022
- Applied Materials, Inc.
- Amrita B. Mullick
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,450,646
- Issue date Sep 20, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,424,222
- Issue date Aug 23, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,309,292
- Issue date Apr 19, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form a 3D semiconductor device and structure
- Patent number 11,217,565
- Issue date Jan 4, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal chalcogenide pillars
- Patent number 11,189,529
- Issue date Nov 30, 2021
- Applied Materials, Inc.
- Amrita B. Mullick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form a 3D semiconductor device and structure
- Patent number 11,063,024
- Issue date Jul 13, 2021
- MONLITHIC 3D INC.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form a 3D semiconductor device and structure
- Patent number 11,018,116
- Issue date May 25, 2021
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial metal oxide as buffer for epitaxial III-V layers
- Patent number 10,923,345
- Issue date Feb 16, 2021
- IQE PLC
- Rytis Dargis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form a 3D semiconductor device and structure
- Patent number 10,811,395
- Issue date Oct 20, 2020
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure
- Patent number 10,515,935
- Issue date Dec 24, 2019
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure
- Patent number 10,297,580
- Issue date May 21, 2019
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and electronic component
- Patent number 10,109,609
- Issue date Oct 23, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic particle paste, cured product using same, and semiconducto...
- Patent number 10,086,478
- Issue date Oct 2, 2018
- Kabushiki Kaisha Toshiba
- Daisuke Hiratsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D semiconductor device and structure
- Patent number 10,014,282
- Issue date Jul 3, 2018
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and structure
- Patent number 9,786,636
- Issue date Oct 10, 2017
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alkali silicate glass based coating and method for applying
- Patent number 9,565,758
- Issue date Feb 7, 2017
- Rockwell Collins, Inc.
- Nathan P. Lower
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 9,355,952
- Issue date May 31, 2016
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Leadless semiconductor package with optical inspection feature
- Patent number 9,287,238
- Issue date Mar 15, 2016
- Infineon Technologies AG
- Soon Lock Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and structure
- Patent number 9,252,134
- Issue date Feb 2, 2016
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 9,214,617
- Issue date Dec 15, 2015
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240321832
- Publication date Sep 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240222333
- Publication date Jul 4, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FORM A 3D SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20200083196
- Publication date Mar 12, 2020
- MonolithIC 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20190273069
- Publication date Sep 5, 2019
- MonolithIC 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE...
- Publication number 20180348259
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20180277521
- Publication date Sep 27, 2018
- MonolithIC 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20180236609
- Publication date Aug 23, 2018
- Intel Corporation
- Rajen S. SIDHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-Free Solder Alloy
- Publication number 20160074971
- Publication date Mar 17, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Ken Tachibana
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Connection Structure and Electronic Component
- Publication number 20150200178
- Publication date Jul 16, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless Semiconductor Package with Optical Inspection Feature
- Publication number 20150155229
- Publication date Jun 4, 2015
- INFINEON TECHNOLOGIES AG
- Soon Lock Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150108648
- Publication date Apr 23, 2015
- Kabushiki Kaisha Toshiba
- Kazumichi TSUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING HYDROPHOBIC SURFACES ON SEMICONDUCTOR DEVICE STR...
- Publication number 20150084187
- Publication date Mar 26, 2015
- Micron Technology, Inc.
- Ian C. Laboriante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION HARDENED MICROELECTRONIC CHIP PACKAGING TECHNOLOGY
- Publication number 20150069588
- Publication date Mar 12, 2015
- National Institute of Aerospace Associates
- Jin Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20150069523
- Publication date Mar 12, 2015
- MonolithIC 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150054146
- Publication date Feb 26, 2015
- SUMITOMO BAKELITE CO., LTD.
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
- Publication number 20150008578
- Publication date Jan 8, 2015
- Intel Corporation
- Mark S. Hlad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20140295619
- Publication date Oct 2, 2014
- Tanaka Kikinzoku Kogyo K.K.
- TOSHINORI OGASHIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140141550
- Publication date May 22, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140110740
- Publication date Apr 24, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALKALI SILICATE GLASS BASED COATING AND METHOD FOR APPLYING
- Publication number 20140102776
- Publication date Apr 17, 2014
- Rockwell Collins, Inc.
- Nathan P. Lower
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035115
- Publication date Feb 6, 2014
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING HYDROPHOBIC SURFACES ON SEMICONDUCTOR DEVICE STR...
- Publication number 20130292647
- Publication date Nov 7, 2013
- Micron Technology, Inc.
- Ian C. Laboriante
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...
- Publication number 20130070428
- Publication date Mar 21, 2013
- CORELASE OY
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS
- Publication number 20130000709
- Publication date Jan 3, 2013
- E I DU PONT DE NEMOURS AND COMPANY NORTH CAROLINA STATE UNIVERSITY
- WILLIAM J. BORLAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE
- Publication number 20120305304
- Publication date Dec 6, 2012
- TOSHIBA MATERIALS CO., LTD.
- Hiromasa KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS TO COOL SEMICONDUCTOR
- Publication number 20120299175
- Publication date Nov 29, 2012
- Bao Tran
- G11 - INFORMATION STORAGE
Information Patent Application
Optoelectronic Headlight, Method for Production of an Optoelectroni...
- Publication number 20120301982
- Publication date Nov 29, 2012
- Johannes BAUR
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120292774
- Publication date Nov 22, 2012
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, CURED PROD...
- Publication number 20120261807
- Publication date Oct 18, 2012
- Shingo Itoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Light-Emitting Diode Arrangement and Method for Producing the Same
- Publication number 20120190140
- Publication date Jul 26, 2012
- Osram Opto Semiconductors GmbH
- Jörg Erich SORG
- H01 - BASIC ELECTRIC ELEMENTS

Groups of the periodic table

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D semiconductor device and structure with metal layers

3D semiconductor device and structure with metal layers

3D semiconductor device and structure with metal layers

3D semiconductor device and structure with metal layers

3D semiconductor device and structure with metal layers

3D semiconductor device and structure with metal layers

3D semiconductor device and structure with metal layers

3D semiconductor device and structure with metal layers

Methods of forming metal chalcogenide pillars

3D semiconductor device and structure with metal layers

3D semiconductor device and structure with metal layers

3D semiconductor device and structure with metal layers

Method to form a 3D semiconductor device and structure

Methods of forming metal chalcogenide pillars

Method to form a 3D semiconductor device and structure

Method to form a 3D semiconductor device and structure

Epitaxial metal oxide as buffer for epitaxial III-V layers

Method to form a 3D semiconductor device and structure

3D semiconductor device and structure

3D semiconductor device and structure

Connection structure and electronic component

Metallic particle paste, cured product using same, and semiconducto...

3D semiconductor device and structure

Semiconductor device and structure

Alkali silicate glass based coating and method for applying

Device packaging with substrates having embedded lines and metal de...

Bonding structure of bonding wire

Leadless semiconductor package with optical inspection feature

Semiconductor device and structure

Electronic component module

Patents Applicationslast 30 patents

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

METHOD TO FORM A 3D SEMICONDUCTOR DEVICE AND STRUCTURE

3D SEMICONDUCTOR DEVICE AND STRUCTURE

METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE...

3D SEMICONDUCTOR DEVICE AND STRUCTURE

HYBRID LOW METAL LOADING FLUX

Lead-Free Solder Alloy

Connection Structure and Electronic Component

Leadless Semiconductor Package with Optical Inspection Feature

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHODS OF FORMING HYDROPHOBIC SURFACES ON SEMICONDUCTOR DEVICE STR...

RADIATION HARDENED MICROELECTRONIC CHIP PACKAGING TECHNOLOGY

NOVEL SEMICONDUCTOR DEVICE AND STRUCTURE

SEMICONDUCTOR DEVICE

DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

ALKALI SILICATE GLASS BASED COATING AND METHOD FOR APPLYING

SEMICONDUCTOR DEVICE

METHODS OF FORMING HYDROPHOBIC SURFACES ON SEMICONDUCTOR DEVICE STR...

METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...

PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS

ELECTRONIC COMPONENT MODULE

SYSTEMS AND METHODS TO COOL SEMICONDUCTOR

Optoelectronic Headlight, Method for Production of an Optoelectroni...

SEMICONDUCTOR DEVICE

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, CURED PROD...

Light-Emitting Diode Arrangement and Method for Producing the Same