Hardening the adhesive by cooling

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H01L2224/8388

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8388Hardening the adhesive by cooling

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacturing thereof
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Information Patent Grant
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Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
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Information Patent Grant
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Patents Applicationslast 30 patents

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Hardening the adhesive by cooling

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method of manufacturing thereof

Methods of manufacturing stacked semiconductor die assemblies with...

Light-emitting device, manufacturing method thereof and display mod...

Semiconductor device and a method of manufacturing thereof

Chip packaging apparatus and method thereof

Alignment method, method for connecting electronic component, metho...

Light-emitting device, manufacturing method thereof and display mod...

Assembly process for circuit carrier and circuit carrier

Semiconductor device and a method of manufacturing thereof

Semiconductor package

Semiconductor devices and semiconductor devices including a redistr...

Placement method for circuit carrier and circuit carrier

Light-emitting device, manufacturing method thereof and display mod...

Method of manufacturing semiconductor device

Semiconductor device and a method of manufacturing thereof

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

Anisotropic conductive film and method for manufacturing the same

A-staged thermoplastic-polyimide (TPI) adhesive compound containing...

Anisotropic conductive film, method for producing anisotropic condu...

Hybrid bonding systems and methods for semiconductor wafers

3D-joining of microelectronic components with conductively self-adj...

Semiconductor devices including conductive pillars

Electronic sub-assembly and method for the production of an electro...

Semiconductor device package having an underfill barrier

Semiconductor device and a method of manufacturing thereof

Wafer bonding structure and wafer bonding method

Hybrid bonding systems and methods for semiconductor wafers

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

Adhesive composition for semiconductor and adhesive film including...

Anisotropic conductive film, method for producing anisotropic condu...

Patents Applicationslast 30 patents

DISPLAY DEVICE

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

FEATURES FOR IMPROVING DIE SIZE AND ORIENTATION DIFFERENTIATION IN...

METHOD OF MANUFACTURING ELECTRIC DEVICE

DISPLAY DEVICE USING MICRO-LEDS AND METHOD FOR MANUFACTURING SAME

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY MOD...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

Method For Manufacturing Led Display

LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY MOD...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

Hybrid Bonding Systems and Methods for Semiconductor Wafers

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...

SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...

WAFER BONDING STRUCTURE AND WAFER BONDING METHOD

Hybrid Bonding Systems and Methods for Semiconductor Wafers

SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS

ANISOTROPIC CONDUCTIVE FILM (ACF), BONDING STRUCTURE, AND DISPLAY P...

BONDING PROCESS USING TEMPERATURE CONTROLLED CURVATURE CHANGE

Hybrid Bonding Systems and Methods for Semiconductor Wafers

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...