Heat curing

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CPC
H01L2224/83862

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83862Heat curing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed structure with electrical contact having reflowable polymer...
- Patent number 12,170,349
- Issue date Dec 17, 2024
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method of the same
- Patent number 12,062,742
- Issue date Aug 13, 2024
- Unimicron Technology Corp.
- Hao-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including connection pad part and electronic compone...
- Patent number 12,057,430
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Jungyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for attaching detectors to electronic readout s...
- Patent number 12,043,016
- Issue date Jul 23, 2024
- Rapiscan Systems, Inc.
- Evgeniy Kuksin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material, an integrated circuit formed therewith,...
- Patent number 12,027,442
- Issue date Jul 2, 2024
- ARIECA INC.
- Jeffrey Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 12,009,339
- Issue date Jun 11, 2024
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating paste-based conductive device and manufacturing method t...
- Patent number 12,009,334
- Issue date Jun 11, 2024
- Shenzhen Guangshe Zhaoming Technology Co., LTD
- Jianwei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electronic device comprising solar cell struct...
- Patent number 11,990,459
- Issue date May 21, 2024
- Shin-Etsu Handotai Co., Ltd.
- Junya Ishizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, film-like adhesive and production method ther...
- Patent number 11,952,513
- Issue date Apr 9, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Structures and methods for electrically connecting printed horizont...
- Patent number 11,916,179
- Issue date Feb 27, 2024
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,856,828
- Issue date Dec 26, 2023
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 11,848,303
- Issue date Dec 19, 2023
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, semiconductor device, and method for manufacturing semic...
- Patent number 11,823,985
- Issue date Nov 21, 2023
- Kabushiki Kaisha Toshiba
- Koji Araki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package semiconductor device and method of manufacture
- Patent number 11,817,360
- Issue date Nov 14, 2023
- Nexperia B.V.
- Loh Choong Keat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition, semiconductor device, and electric...
- Patent number 11,784,153
- Issue date Oct 10, 2023
- Kyocera Corporation
- Masakazu Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
- Patent number 11,776,942
- Issue date Oct 3, 2023
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
- Patent number 11,710,812
- Issue date Jul 25, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of LED filament and manufacturing method of bulb
- Patent number 11,662,065
- Issue date May 30, 2023
- Hangzhou Hangke Optoelectronics Co., Ltd.
- Qianjun Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package and apparatus for p...
- Patent number 11,646,294
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Ungkeol Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...
- Publication number 20240421116
- Publication date Dec 19, 2024
- Donald Cunningham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LI...
- Publication number 20240395759
- Publication date Nov 28, 2024
- Resonac Corporation
- Hiroyuki ISHIGE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...
- Publication number 20240379571
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240355805
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240355794
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Systems for Attaching Detectors to Electronic Readout S...
- Publication number 20240336051
- Publication date Oct 10, 2024
- Rapiscan Systems, Inc.
- Evgeniy Kuksin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321851
- Publication date Sep 26, 2024
- SAMSUNG ELECTERONICS CO., LTD.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240312976
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20240304639
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL IN...
- Publication number 20240243033
- Publication date Jul 18, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240234364
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240227089
- Publication date Jul 11, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SOLDER MASK
- Publication number 20240170438
- Publication date May 23, 2024
- NXP USA, Inc.
- Aznita Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE COMPONENT
- Publication number 20240136268
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshiaki SATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240131633
- Publication date Apr 25, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240136322
- Publication date Apr 25, 2024
- LG Innotek Co., Ltd.
- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120354
- Publication date Apr 11, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICO...
- Publication number 20240087941
- Publication date Mar 14, 2024
- Dow Toray Co., Ltd.
- Nohno TODA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED EMBEDDED DIE PACKAGE
- Publication number 20240038619
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP SCALE OPTICAL SENSOR PACKAGE
- Publication number 20240030265
- Publication date Jan 25, 2024
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE
- Publication number 20240014164
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Jooyoung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF
- Publication number 20230420406
- Publication date Dec 28, 2023
- KULICKE AND SOFFA HI-TECH CO., LTD.
- Lu-Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
- Publication number 20230402442
- Publication date Dec 14, 2023
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Canyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230378032
- Publication date Nov 23, 2023
- RENESAS ELECTRONICS CORPORATION
- Kosuke KITAICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT
- Publication number 20230361076
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Hermann Bechert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE AGENT FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND MET...
- Publication number 20230348764
- Publication date Nov 2, 2023
- Resonac Corporation
- Toshiyasu AKIYOSHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Heat curing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed structure with electrical contact having reflowable polymer...

Semiconductor device and a method of manufacturing thereof

Connection structure and manufacturing method therefor

Methods and devices for fabricating and assembling printable semico...

Selective transfer of micro devices

Package structure and manufacturing method of the same

Display device including connection pad part and electronic compone...

Methods and systems for attaching detectors to electronic readout s...

Thermal interface material, an integrated circuit formed therewith,...

Electronic device and method of transferring electronic element usi...

Insulating paste-based conductive device and manufacturing method t...

Method for producing electronic device comprising solar cell struct...

Adhesive composition, film-like adhesive and production method ther...

Structures and methods for electrically connecting printed horizont...

Display device and method of manufacturing the same

Electronic device and method of transferring electronic element usi...

Leadframe, semiconductor device, and method for manufacturing semic...

Chip scale package semiconductor device and method of manufacture

Thermosetting resin composition, semiconductor device, and electric...

Method for manufacturing display panel, display panel, and display...

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Light-emitting device, manufacturing method thereof and display mod...

Thermocompression bond tips and related apparatus and methods

Anisotropic conductive film and display device using the same

Manufacturing method of LED filament and manufacturing method of bulb

Method of manufacturing a semiconductor package and apparatus for p...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...

FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LI...

SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...

SELECTIVE TRANSFER OF MICRO DEVICES

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Methods and Systems for Attaching Detectors to Electronic Readout S...

SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

OPTICAL SENSOR PACKAGE

METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL IN...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

PACKAGE WITH SOLDER MASK

COMPOSITE COMPONENT

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE

DOCUMENT STRUCTURE FORMATION

INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICO...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

THERMALLY ENHANCED EMBEDDED DIE PACKAGE

STACKED CHIP SCALE OPTICAL SENSOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE

INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CHIP ARRANGEMENT

ADHESIVE AGENT FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND MET...