Membership
Tour
Register
Log in
Heat curing
Follow
Industry
CPC
H01L2224/83862
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/83862
Heat curing
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Adhesive composition, film-like adhesive and production method ther...
Patent number
11,952,513
Issue date
Apr 9, 2024
Furukawa Electric Co., Ltd.
Minoru Morita
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Structures and methods for electrically connecting printed horizont...
Patent number
11,916,179
Issue date
Feb 27, 2024
X Display Company Technology Limited
Christopher Andrew Bower
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and method of manufacturing the same
Patent number
11,856,828
Issue date
Dec 26, 2023
Samsung Display Co., Ltd.
Joo-nyung Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and method of transferring electronic element usi...
Patent number
11,848,303
Issue date
Dec 19, 2023
Seoul National University R&DB Foundation
Yongtaek Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe, semiconductor device, and method for manufacturing semic...
Patent number
11,823,985
Issue date
Nov 21, 2023
Kabushiki Kaisha Toshiba
Koji Araki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip scale package semiconductor device and method of manufacture
Patent number
11,817,360
Issue date
Nov 14, 2023
Nexperia B.V.
Loh Choong Keat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermosetting resin composition, semiconductor device, and electric...
Patent number
11,784,153
Issue date
Oct 10, 2023
Kyocera Corporation
Masakazu Fujiwara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing display panel, display panel, and display...
Patent number
11,776,942
Issue date
Oct 3, 2023
Shanghai Tianma Micro-Electronics Co., Ltd.
Canyuan Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,735,545
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,735,547
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,735,546
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,728,302
Issue date
Aug 15, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,728,306
Issue date
Aug 15, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
Patent number
11,710,812
Issue date
Jul 25, 2023
Epistar Corporation
Min-Hsun Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bond tips and related apparatus and methods
Patent number
11,705,425
Issue date
Jul 18, 2023
Micron Technology, Inc.
Benjamin L. McClain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film and display device using the same
Patent number
11,683,963
Issue date
Jun 20, 2023
SAMSUNG DISPLAY CO., LTD.
Chungseok Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of LED filament and manufacturing method of bulb
Patent number
11,662,065
Issue date
May 30, 2023
Hangzhou Hangke Optoelectronics Co., Ltd.
Qianjun Yan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor package and apparatus for p...
Patent number
11,646,294
Issue date
May 9, 2023
Samsung Electronics Co., Ltd.
Ungkeol Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device, heat-curable resin c...
Patent number
11,634,614
Issue date
Apr 25, 2023
Kazuhiro Yamamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sawing underfill in packaging processes
Patent number
11,637,086
Issue date
Apr 25, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Wei Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sawing underfill in packaging processes
Patent number
11,631,654
Issue date
Apr 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Wei Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding tools for bonding machines, bonding machines for bonding se...
Patent number
11,608,453
Issue date
Mar 21, 2023
Kulicke and Soffa Industries, Inc.
Urban Ernst
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Adhesive for semiconductor device, and high productivity method for...
Patent number
11,608,455
Issue date
Mar 21, 2023
SHOWA DENKO MATERIALS CO., LTD.
Kazutaka Honda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Flexible three-dimensional electronic device
Patent number
11,545,436
Issue date
Jan 3, 2023
King Abdullah University of Science and Technology
Muhammad Mustafa Hussain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite semiconductor component having projecting elements projec...
Patent number
11,527,521
Issue date
Dec 13, 2022
OSRAM OLED GmbH
Lutz Hoeppel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip assembly
Patent number
11,508,694
Issue date
Nov 22, 2022
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic-part-reinforcing thermosetting resin composition, semico...
Patent number
11,495,564
Issue date
Nov 8, 2022
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Jin Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,476,216
Issue date
Oct 18, 2022
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-die package with bridge layer
Patent number
11,476,125
Issue date
Oct 18, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei Sen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and a method of manufacturing thereof
Patent number
11,450,639
Issue date
Sep 20, 2022
Epistar Corporation
Shih-An Liao
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
Publication number
20240131633
Publication date
Apr 25, 2024
Sekisui Chemical Co., Ltd.
Hidefumi YASUI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
COMPOSITE COMPONENT
Publication number
20240136268
Publication date
Apr 25, 2024
Murata Manufacturing Co., Ltd.
Yoshiaki SATAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
Publication number
20240136322
Publication date
Apr 25, 2024
LG Innotek Co., Ltd.
Tae Sup CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240120354
Publication date
Apr 11, 2024
SAMSUNG ELECTRONICS CO,. LTD.
Kyong Soon CHO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOCUMENT STRUCTURE FORMATION
Publication number
20240105669
Publication date
Mar 28, 2024
INFINEON TECHNOLOGIES AG
Jens Pohl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICO...
Publication number
20240087941
Publication date
Mar 14, 2024
Dow Toray Co., Ltd.
Nohno TODA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Publication number
20240055385
Publication date
Feb 15, 2024
WISTRON NEWEB CORPORATION
KUO-HUA HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED EMBEDDED DIE PACKAGE
Publication number
20240038619
Publication date
Feb 1, 2024
TEXAS INSTRUMENTS INCORPORATED
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED CHIP SCALE OPTICAL SENSOR PACKAGE
Publication number
20240030265
Publication date
Jan 25, 2024
Semiconductor Components Industries, LLC
Weng-Jin WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE
Publication number
20240014164
Publication date
Jan 11, 2024
Samsung Electronics Co., Ltd.
Jooyoung OH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF
Publication number
20230420406
Publication date
Dec 28, 2023
KULICKE AND SOFFA HI-TECH CO., LTD.
Lu-Min Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
Publication number
20230402442
Publication date
Dec 14, 2023
SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
Canyuan ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230378032
Publication date
Nov 23, 2023
RENESAS ELECTRONICS CORPORATION
Kosuke KITAICHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ARRANGEMENT
Publication number
20230361076
Publication date
Nov 9, 2023
INFINEON TECHNOLOGIES AG
Hermann Bechert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE AGENT FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND MET...
Publication number
20230348764
Publication date
Nov 2, 2023
Resonac Corporation
Toshiyasu AKIYOSHI
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
ADHESIVE FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND METHOD FO...
Publication number
20230352436
Publication date
Nov 2, 2023
Resonac Corporation
Toshiyasu AKIYOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INSULATING PASTE-BASED CONDUCTIVE DEVICE AND MANUFACTURING METHOD T...
Publication number
20230307408
Publication date
Sep 28, 2023
Shenzhen Guangshe Zhaoming Technology Co., LTD
Jianwei CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
Publication number
20230290751
Publication date
Sep 14, 2023
SAMSUNG DISPLAY CO., LTD.
Joo Nyung JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...
Publication number
20230282607
Publication date
Sep 7, 2023
Micron Technology, Inc.
Ting Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20230268310
Publication date
Aug 24, 2023
KIOXIA Corporation
Satoru ITAKURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME
Publication number
20230231087
Publication date
Jul 20, 2023
Unimicron Technology Corp.
Hao-Wei TSENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
Publication number
20230117132
Publication date
Apr 20, 2023
SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
Canyuan ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
Publication number
20230060577
Publication date
Mar 2, 2023
Showa Denko Materials Co., Ltd.
Kunihiko AKAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
Publication number
20230057934
Publication date
Feb 23, 2023
SAMSUNG DISPLAY CO., LTD.
SANGDUK LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSPARENT DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND T...
Publication number
20230037241
Publication date
Feb 2, 2023
Kateeva Display Technology (Shaoxing) Limited
Erdong WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
Publication number
20230017939
Publication date
Jan 19, 2023
EPISTAR CORPORATION
Shih-An LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...
Publication number
20220367234
Publication date
Nov 17, 2022
FURUKAWA ELECTRIC CO., LTD.
Yota OTANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANEL AND METHOD OF MANUFACTURING SAME
Publication number
20220367770
Publication date
Nov 17, 2022
HON HAI PRECISION INDUSTRY CO., LTD.
YI-HSIANG LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INHIBITING VISCOUS MATERIAL SPREAD
Publication number
20220344297
Publication date
Oct 27, 2022
INPHI CORPORATION
Choong Kooi CHEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
Publication number
20220271004
Publication date
Aug 25, 2022
Seoul National University R&DB Foundation
Yongtaek HONG
H01 - BASIC ELECTRIC ELEMENTS