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H01L2224/83097

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83097Heating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,173,207
- Issue date Dec 24, 2024
- Celanese Mercury Holdings Inc.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering press for sintering electronic components on a substrate
- Patent number 11,820,095
- Issue date Nov 21, 2023
- AMX—AUTOMATRIX S.R.L.
- Nicola Schivalocchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming backside power rails
- Patent number 11,777,016
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jointing material, fabrication method for semiconductor device usin...
- Patent number 11,476,399
- Issue date Oct 18, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidetoshi Kitaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chemical bonding method and joined structure
- Patent number 11,450,643
- Issue date Sep 20, 2022
- Tohoku University
- Takehito Shimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-attach method to compensate for thermal expansion
- Patent number 11,430,744
- Issue date Aug 30, 2022
- Cree, Inc.
- David Seebacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming backside power rails
- Patent number 11,411,100
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 11,309,278
- Issue date Apr 19, 2022
- Applied Materials, Inc.
- Prayudi Lianto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip bonding method and bonding device
- Patent number 11,239,198
- Issue date Feb 1, 2022
- BOE Technology Group Co., Ltd.
- Lili Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for setting conditions for heating semiconductor chip during...
- Patent number 11,201,132
- Issue date Dec 14, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder alloy and junction structure using same
- Patent number 11,135,683
- Issue date Oct 5, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidetoshi Kitaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transferring micro device
- Patent number 10,937,674
- Issue date Mar 2, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered composite bonding materials and power electronics ass...
- Patent number 10,886,251
- Issue date Jan 5, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass transfer method for micro-LEDs with a temperature-controlled a...
- Patent number 10,784,400
- Issue date Sep 22, 2020
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for improved delamination characteristics in a...
- Patent number 10,763,130
- Issue date Sep 1, 2020
- Microchip Technology Incorporated
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method for manufacturing power semic...
- Patent number 10,727,167
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Takayuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste for bonding
- Patent number 10,696,875
- Issue date Jun 30, 2020
- E. I. Du Pont de Nemours and Company
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of transferring micro devices
- Patent number 10,431,569
- Issue date Oct 1, 2019
- PlayNitride Inc.
- Yun-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting die (LED) packages and related methods
- Patent number 10,256,385
- Issue date Apr 9, 2019
- Cree, Inc.
- Jeffrey Carl Britt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-transfer printing with volatile adhesive layer
- Patent number 10,157,880
- Issue date Dec 18, 2018
- X-CELEPRINT LIMITED
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding a substrate to a semiconductor light emitting device
- Patent number 10,158,049
- Issue date Dec 18, 2018
- Lumileds LLC
- Grigoriy Basin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress bonding of silicon or germanium parts
- Patent number 9,892,920
- Issue date Feb 13, 2018
- Lam Research Corporation
- Jihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with flip chip structure and fabrication metho...
- Patent number 9,673,163
- Issue date Jun 6, 2017
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for chip-to-wafer integration
- Patent number 9,613,928
- Issue date Apr 4, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,530,744
- Issue date Dec 27, 2016
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure and process
- Patent number 9,502,370
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to achieve ultra-high chip-to-chip alignment accuracy for wa...
- Patent number 9,466,538
- Issue date Oct 11, 2016
- GLOBALFOUNDRIES Inc.
- Spyridon Skordas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coating and bonding substrates
- Patent number 9,358,765
- Issue date Jun 7, 2016
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for ultrasonic bonding having at least one first and second...
- Patent number 9,296,065
- Issue date Mar 29, 2016
- Hesse GmbH
- Hans-Juergen Hesse
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240258267
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240170449
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- HYOUNGJOO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ONTO A SUBSTRATE BY MEA...
- Publication number 20240170450
- Publication date May 23, 2024
- SAFRAN ELECTRONICS & DEFENSE
- Jean-Christophe RIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20240128211
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240063096
- Publication date Feb 22, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Shigeki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Liquid Metal as Heat-Dissipation Media and Method For...
- Publication number 20240038627
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME
- Publication number 20240030180
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230245969
- Publication date Aug 3, 2023
- Mitsubishi Electric Corporation
- Masaya IMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SU...
- Publication number 20230178509
- Publication date Jun 8, 2023
- AMOSENSE CO., LTD.
- Younghwan JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING COMPOSITION
- Publication number 20220371089
- Publication date Nov 24, 2022
- Alpha Assembly Solutions Inc.
- Shamik GHOSHAL
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Method of Forming Backside Power Rails
- Publication number 20220336641
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL BONDING METHOD AND JOINED STRUCTURE
- Publication number 20220199569
- Publication date Jun 23, 2022
- TOHOKU UNIVERSITY
- Takehito SHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Backside Power Rails
- Publication number 20220102535
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINED STRUCTURE
- Publication number 20220093553
- Publication date Mar 24, 2022
- MITSUBISHI MATERIALS CORPORATION
- Fumiaki Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING PRESS FOR SINTERING ELECTRONIC COMPONENTS ON A SUBSTRATE
- Publication number 20220001637
- Publication date Jan 6, 2022
- AMX - AUTOMATRIX S.R.L
- Nicola SCHIVALOCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SETTING CONDITIONS FOR HEATING SEMICONDUCTOR CHIP DURING...
- Publication number 20200286854
- Publication date Sep 10, 2020
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20200248040
- Publication date Aug 6, 2020
- DUPONT ELECTRONICS, INC.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MASS TRANSFER METHOD FOR MICRO-LEDS WITH A TEMPERATURE-CONTROLLED A...
- Publication number 20200203558
- Publication date Jun 25, 2020
- Guangdong University of Technology
- Yun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING SUBSTRATES
- Publication number 20200135690
- Publication date Apr 30, 2020
- Applied Materials, Inc.
- PRAYUDI LIANTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED COMPOSITE BONDING MATERIALS AND POWER ELECTRONICS ASS...
- Publication number 20180308820
- Publication date Oct 25, 2018
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20170033076
- Publication date Feb 2, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...
- Publication number 20140335657
- Publication date Nov 13, 2014
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR BONDING
- Publication number 20140312285
- Publication date Oct 23, 2014
- BANDO CHEMICAL INDUSTRIES, LTD.
- Masafumi Takesue
- B82 - NANO-TECHNOLOGY
Information Patent Application
Electrical Connecting Element and Method for Manufacturing the Same
- Publication number 20140217593
- Publication date Aug 7, 2014
- National Chiao Tung University
- Chih CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF BONDING A SUBSTRATE TO A SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20140193931
- Publication date Jul 10, 2014
- Koninklijke Philips N.V.
- Grigoriy Basin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ULTRASONIC BONDING HAVING AT LEAST ONE FIRST AND SECOND...
- Publication number 20140151439
- Publication date Jun 5, 2014
- Hesse GmbH
- Hans-Juergen Hesse
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
Semiconductor Bonding Structure and Process
- Publication number 20140117510
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD USING METAL FOAM, METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20140111956
- Publication date Apr 24, 2014
- Fuji Electric Co., Ltd.
- Katsumi TANIGUCHI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD OF DIE BONDING AND APPARATUS THEREOF
- Publication number 20140102616
- Publication date Apr 17, 2014
- Industrial Technology Research Institute
- Weng-Jung LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-PHASE INTERMETALLIC INTERCONNECTION STRUCTURE AND METHOD OF FA...
- Publication number 20140097534
- Publication date Apr 10, 2014
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing an electronic device

Sintering press for sintering electronic components on a substrate

Method of forming backside power rails

Jointing material, fabrication method for semiconductor device usin...

Chemical bonding method and joined structure

Die-attach method to compensate for thermal expansion

Method of forming backside power rails

Methods for bonding substrates

Chip bonding method and bonding device

Method for setting conditions for heating semiconductor chip during...

Solder alloy and junction structure using same

Bonded structure and method of manufacturing the same

Method for transferring micro device

Multi-layered composite bonding materials and power electronics ass...

Mass transfer method for micro-LEDs with a temperature-controlled a...

Systems and methods for improved delamination characteristics in a...

Power semiconductor device and method for manufacturing power semic...

Conductive paste for bonding

Method of transferring micro devices

Light emitting die (LED) packages and related methods

Micro-transfer printing with volatile adhesive layer

Method of bonding a substrate to a semiconductor light emitting device

Low stress bonding of silicon or germanium parts

Semiconductor device with flip chip structure and fabrication metho...

Method and apparatus for chip-to-wafer integration

Semiconductor device and method of manufacturing the same

Semiconductor bonding structure and process

Method to achieve ultra-high chip-to-chip alignment accuracy for wa...

Method for coating and bonding substrates

Method for ultrasonic bonding having at least one first and second...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ONTO A SUBSTRATE BY MEA...

SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

Packages with Liquid Metal as Heat-Dissipation Media and Method For...

WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME

SEMICONDUCTOR APPARATUS

ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SU...

SINTERING COMPOSITION

Method of Forming Backside Power Rails

CHEMICAL BONDING METHOD AND JOINED STRUCTURE

Method of Forming Backside Power Rails

JOINED STRUCTURE

SINTERING PRESS FOR SINTERING ELECTRONIC COMPONENTS ON A SUBSTRATE

METHOD FOR SETTING CONDITIONS FOR HEATING SEMICONDUCTOR CHIP DURING...

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

MASS TRANSFER METHOD FOR MICRO-LEDS WITH A TEMPERATURE-CONTROLLED A...

METHODS FOR BONDING SUBSTRATES

MULTI-LAYERED COMPOSITE BONDING MATERIALS AND POWER ELECTRONICS ASS...

PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE

STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...

COMPOSITION FOR BONDING

Electrical Connecting Element and Method for Manufacturing the Same

METHOD OF BONDING A SUBSTRATE TO A SEMICONDUCTOR LIGHT EMITTING DEVICE

METHOD FOR ULTRASONIC BONDING HAVING AT LEAST ONE FIRST AND SECOND...

Semiconductor Bonding Structure and Process

JOINING METHOD USING METAL FOAM, METHOD OF MANUFACTURING SEMICONDUC...

METHOD OF DIE BONDING AND APPARATUS THEREOF

DUAL-PHASE INTERMETALLIC INTERCONNECTION STRUCTURE AND METHOD OF FA...