Heating

Industry

CPC
H01L2224/81097

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81097Heating

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Chip packaging structure and related inner lead bonding method
- Patent number 12,334,470
- Issue date Jun 17, 2025
- Sitronix Technology Corp.
- Ying-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for temporarily fastening a semiconductor chip to a surface,...
- Patent number 11,521,946
- Issue date Dec 6, 2022
- OSRAM OLED GmbH
- Klaus Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,476,291
- Issue date Oct 18, 2022
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 11,166,351
- Issue date Nov 2, 2021
- Samsung Electronics Co., Ltd.
- Sin-Yeob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 10,937,757
- Issue date Mar 2, 2021
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging through pre-formed metal pins
- Patent number 10,734,345
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 10,600,838
- Issue date Mar 24, 2020
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a solder joint between metal layers
- Patent number 10,252,363
- Issue date Apr 9, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-transfer printing with volatile adhesive layer
- Patent number 10,157,880
- Issue date Dec 18, 2018
- X-CELEPRINT LIMITED
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging through pre-formed metal pins
- Patent number 9,929,118
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device, and electronic device...
- Patent number 9,911,642
- Issue date Mar 6, 2018
- Fujitsu Limited
- Taiji Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermo-compression bonding system, subsystems, and methods of use
- Patent number 9,911,710
- Issue date Mar 6, 2018
- MRSI Systems, LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic device
- Patent number 9,761,556
- Issue date Sep 12, 2017
- Shinko Electric Industries Co., Ltd.
- Yoshitada Higashizawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,748,199
- Issue date Aug 29, 2017
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of confining conductive bump materi...
- Patent number 9,679,811
- Issue date Jun 13, 2017
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with flip chip structure and fabrication metho...
- Patent number 9,673,163
- Issue date Jun 6, 2017
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality electrical contacts between integrated circuit chips
- Patent number 9,646,882
- Issue date May 9, 2017
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for chip-to-wafer integration
- Patent number 9,613,928
- Issue date Apr 4, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality electrical contacts between integrated circuit chips
- Patent number 9,490,212
- Issue date Nov 8, 2016
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with conductive pillars having recesses or pro...
- Patent number 9,478,513
- Issue date Oct 25, 2016
- STATS ChipPAC Pte. Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 9,368,390
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong Ni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,282,650
- Issue date Mar 8, 2016
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming narrow interconnect site...
- Patent number 9,258,904
- Issue date Feb 9, 2016
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump structure and electronic packaging solder joint structure and...
- Patent number 9,024,441
- Issue date May 5, 2015
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joint reflow process for reducing packaging failure rate
- Patent number 9,010,617
- Issue date Apr 21, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-axial restraint for connectors within flip-chip packages
- Patent number 8,970,041
- Issue date Mar 3, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump, method for forming the bump, and method for mounting substrat...
- Patent number 8,962,471
- Issue date Feb 24, 2015
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive pillars havin...
- Patent number 8,741,764
- Issue date Jun 3, 2014
- STATS ChipPAC, Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fabricating integrated circuit device usin...
- Patent number 8,722,460
- Issue date May 13, 2014
- Mitsumasa Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MAN...
- Publication number 20250174596
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Sunchul KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING CHIP, CHIP PACKAGING STRUCTURE, AND TERMINAL DE...
- Publication number 20250167169
- Publication date May 22, 2025
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- ZHI-YONG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND RECORDING MEDIUM
- Publication number 20250118701
- Publication date Apr 10, 2025
- SHINKAWA LTD.
- Shinsuke Fukumoto
- G05 - CONTROLLING REGULATING
Information Patent Application
METHODS OF BONDING SEMICONDUCTOR ELEMENTS TO SUBSTRATES
- Publication number 20250096193
- Publication date Mar 20, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFERRING AND BONDING DEVICE, AND CHIP TRANSFERRING AND BON...
- Publication number 20250087626
- Publication date Mar 13, 2025
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...
- Publication number 20240186280
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240170449
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- HYOUNGJOO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR FLUXLESS BONDING USING AN ATMOSPHERIC PRESSURE PLASMA A...
- Publication number 20230378123
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268314
- Publication date Aug 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...
- Publication number 20230197666
- Publication date Jun 22, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Compensation for BGA Package
- Publication number 20230147273
- Publication date May 11, 2023
- Apple Inc.
- Brett W. Degner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES...
- Publication number 20230133526
- Publication date May 4, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230132054
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Wooram MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230005979
- Publication date Jan 5, 2023
- SONY GROUP CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Temporarily Fastening a Semiconductor Chip to a Surface,...
- Publication number 20210183800
- Publication date Jun 17, 2021
- OSRAM OLED GmbH
- Klaus Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Packaging Structure and Related Inner Lead Bonding Method
- Publication number 20200335474
- Publication date Oct 22, 2020
- SITRONIX TECHNOLOGY CORP.
- Ying-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20190326344
- Publication date Oct 24, 2019
- SONY CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging through Pre-Formed Metal Pins
- Publication number 20180204816
- Publication date Jul 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20160211238
- Publication date Jul 21, 2016
- Intel Corporation
- Hemanth Dhavaleswarapu
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT...
- Publication number 20160035694
- Publication date Feb 4, 2016
- SHINKO ELECTRIC INDUSTRIES, CO., LTD.
- Yoshitada HIGASHIZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF ATTACHING ELECTRONIC COMPONENTS
- Publication number 20160005710
- Publication date Jan 7, 2016
- NXP B.V.
- Sven Walczyk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20150173209
- Publication date Jun 18, 2015
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20140342504
- Publication date Nov 20, 2014
- FUJITSU LIMITED
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20140295619
- Publication date Oct 2, 2014
- Tanaka Kikinzoku Kogyo K.K.
- TOSHINORI OGASHIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Conductive Pillars Having Recesses or Pro...
- Publication number 20140225256
- Publication date Aug 14, 2014
- STATS ChipPAC, Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connecting Element and Method for Manufacturing the Same
- Publication number 20140217593
- Publication date Aug 7, 2014
- National Chiao Tung University
- Chih CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION
- Publication number 20140202739
- Publication date Jul 24, 2014
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
- Publication number 20140159254
- Publication date Jun 12, 2014
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Confining Conductive Bump Materi...
- Publication number 20140113446
- Publication date Apr 24, 2014
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip packaging structure and related inner lead bonding method

Semiconductor package and manufacturing method thereof

Method for temporarily fastening a semiconductor chip to a surface,...

Semiconductor device and method of manufacturing thereof

Solder reflow apparatus and method of manufacturing an electronic d...

Device packaging facility and method, and device processing apparat...

Packaging through pre-formed metal pins

Semiconductor device and method of manufacturing thereof

Forming a solder joint between metal layers

Micro-transfer printing with volatile adhesive layer

Packaging through pre-formed metal pins

Method of manufacturing an electronic device, and electronic device...

Thermo-compression bonding system, subsystems, and methods of use

Method of manufacturing electronic device

Thermal compression bonding process cooling manifold

Semiconductor device and method of confining conductive bump materi...

Semiconductor device with flip chip structure and fabrication metho...

High quality electrical contacts between integrated circuit chips

Method and apparatus for chip-to-wafer integration

High quality electrical contacts between integrated circuit chips

Semiconductor device with conductive pillars having recesses or pro...

Semiconductor apparatus

Thermal compression bonding process cooling manifold

Semiconductor device and method of forming narrow interconnect site...

Bump structure and electronic packaging solder joint structure and...

Solder joint reflow process for reducing packaging failure rate

Co-axial restraint for connectors within flip-chip packages

Bump, method for forming the bump, and method for mounting substrat...

Semiconductor device and method of forming conductive pillars havin...

Method and apparatus for fabricating integrated circuit device usin...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MAN...

METHOD OF PACKAGING CHIP, CHIP PACKAGING STRUCTURE, AND TERMINAL DE...

BONDING APPARATUS, BONDING METHOD, AND RECORDING MEDIUM

METHODS OF BONDING SEMICONDUCTOR ELEMENTS TO SUBSTRATES

CHIP TRANSFERRING AND BONDING DEVICE, AND CHIP TRANSFERRING AND BON...

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SYSTEMS FOR FLUXLESS BONDING USING AN ATMOSPHERIC PRESSURE PLASMA A...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...

Warpage Compensation for BGA Package

BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

Method for Temporarily Fastening a Semiconductor Chip to a Surface,...

Chip Packaging Structure and Related Inner Lead Bonding Method

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

Packaging through Pre-Formed Metal Pins

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT...

METHODS OF ATTACHING ELECTRONIC COMPONENTS

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

Semiconductor Device with Conductive Pillars Having Recesses or Pro...

Electrical Connecting Element and Method for Manufacturing the Same

PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE

Semiconductor Device and Method of Confining Conductive Bump Materi...