High-frequency electrical connections

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H01L2223/6605

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/6605High-frequency electrical connections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High performance semiconductor device
- Patent number 12,159,817
- Issue date Dec 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component modules (MCMs) including configurable electromagnet...
- Patent number 12,100,669
- Issue date Sep 24, 2024
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency packages containing multilevel power substrates and...
- Patent number 12,040,291
- Issue date Jul 16, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch capacitance cancellation circuit
- Patent number 12,028,060
- Issue date Jul 2, 2024
- Murata Manufacturing Co., Ltd.
- David Kovac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting device having a plurality of thermal sink layers an...
- Patent number 12,027,437
- Issue date Jul 2, 2024
- Northrop Grumman Systems Corporation
- Aaron Ashley Hathaway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch barrier for microelectronic packaging conductive structures
- Patent number 11,948,898
- Issue date Apr 2, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for providing a scalable ball grid array (BGA)...
- Patent number 11,817,378
- Issue date Nov 14, 2023
- QUALCOMM Incorporated
- Nelly Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of radio frequency transistor chiplets ha...
- Patent number 11,810,876
- Issue date Nov 7, 2023
- PseudolithIC, Inc.
- James Buckwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,784,134
- Issue date Oct 10, 2023
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package including substrate having through hole and redistribu...
- Patent number 11,749,618
- Issue date Sep 5, 2023
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component modules (MCMs) including configurable electro-magne...
- Patent number 11,721,639
- Issue date Aug 8, 2023
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,658,102
- Issue date May 23, 2023
- Advanced Semiconductor Engineering, Inc.
- Yuanhao Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including electrically insulated load electrodes
- Patent number 11,646,258
- Issue date May 9, 2023
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switches in bulk substrate
- Patent number 11,605,649
- Issue date Mar 14, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Mark D. Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible impedance network system
- Patent number 11,581,299
- Issue date Feb 14, 2023
- BAE Systems Information and Electronic Systems Integration Inc.
- Carlton T. Creamer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package including substrate inclined sidewall and redistributi...
- Patent number 11,521,938
- Issue date Dec 6, 2022
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having front end under embedded radio fr...
- Patent number 11,424,195
- Issue date Aug 23, 2022
- Intel Corporation
- Eliav Shaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for hermetic RF chip package embedded with impedance mat...
- Patent number 11,342,250
- Issue date May 24, 2022
- WAVEPIA CO., LTD.
- Sang-Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring electrode
- Patent number 11,228,128
- Issue date Jan 18, 2022
- Mitsubishi Electric Corporation
- Shigeto Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and electronic device having the electronic package
- Patent number 11,223,117
- Issue date Jan 11, 2022
- Siliconware Precision Industries Co., Ltd.
- Bo-Siang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer circuit
- Patent number 11,152,308
- Issue date Oct 19, 2021
- II-VI DELAWARE, INC.
- Norbert Schlepple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module
- Patent number 11,153,967
- Issue date Oct 19, 2021
- Murata Manufacturing Co., Ltd.
- Shinichiro Banba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of self-biased magnetic circulators with microwave devices
- Patent number 11,152,677
- Issue date Oct 19, 2021
- Qorvo US, Inc.
- Yongjie Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,037,879
- Issue date Jun 15, 2021
- TOSHIBA MEMORY CORPORATION
- Yasuo Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting device with multiple thermal sinks
- Patent number 11,004,763
- Issue date May 11, 2021
- Northrop Grumman Systems Corporation
- Aaron Ashley Hathaway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device
- Patent number 10,971,448
- Issue date Apr 6, 2021
- Murata Manufacturing Co., Ltd.
- Kenta Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compensation network for high speed integrated circuits
- Patent number 10,971,458
- Issue date Apr 6, 2021
- CREDO TECHNOLOGY GROUP LIMITED
- Xike Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device and method for packagin...
- Patent number 10,867,882
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scattering parameter calibration to a semiconductor layer
- Patent number 10,725,138
- Issue date Jul 28, 2020
- Infineon Technologies AG
- Christoph Wagner
- G01 - MEASURING TESTING
Information Patent Grant
Resistance and capacitance balancing systems and methods
- Patent number 10,685,925
- Issue date Jun 16, 2020
- NVIDIA Corporation
- Jim Dobbins
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
HETEROGENEOUS INTEGRATION OF RADIO FREQUENCY TRANSISTOR CHIPLETS HA...
- Publication number 20240413103
- Publication date Dec 12, 2024
- PseudolithIC, Inc.
- James BUCKWALTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING DEVICE WITH MULTIPLE THERMAL SINKS
- Publication number 20240355701
- Publication date Oct 24, 2024
- AARON ASHLEY HATHAWAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE INTEGRATED CIRCUIT AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240347485
- Publication date Oct 17, 2024
- XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
- Shenghou LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCH CAPACITANCE CANCELLATION CIRCUIT
- Publication number 20240313772
- Publication date Sep 19, 2024
- Murata Manufacturing Co., Ltd.
- David KOVAC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER AMPLIFIER INCLUDING THE SAME
- Publication number 20240312932
- Publication date Sep 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Suyeon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A R...
- Publication number 20240290733
- Publication date Aug 29, 2024
- INFINEON TECHNOLOGIES AG
- Simon KORNPROBST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIOFREQUENCY FILTER AND MANUFACTURING METHOD THEREOF
- Publication number 20240186271
- Publication date Jun 6, 2024
- UNITED MICROELECTRONICS CORP.
- Chien-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038693
- Publication date Feb 1, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNET...
- Publication number 20240021538
- Publication date Jan 18, 2024
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230420387
- Publication date Dec 28, 2023
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE-CHANGE MATERIAL (PCM) RADIO FREQUENCY (RF) SWITCHING DEVICE W...
- Publication number 20230422642
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT DEVICE
- Publication number 20230354593
- Publication date Nov 2, 2023
- MURATA MANUFACTURING CO., LTD.
- Keiichi HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230298985
- Publication date Sep 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Yuanhao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY PACKAGES CONTAINING MULTILEVEL POWER SUBSTRATES AND...
- Publication number 20230197645
- Publication date Jun 22, 2023
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE TO TRANSITION BETWEEN A TRANSMISSION LINE CONDUCTOR AND A...
- Publication number 20230197588
- Publication date Jun 22, 2023
- Intel Corporation
- Ariel GREENBAUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHES IN BULK SUBSTRATE
- Publication number 20230187449
- Publication date Jun 15, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Mark D. LEVY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ELECTROMAGNETIC SHIELD STRUCTURE
- Publication number 20230114892
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- JONGWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230093818
- Publication date Mar 30, 2023
- Kabushiki Kaisha Toshiba
- Takeshi MURASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FINGER RF nFET HAVING BURIED STRESSOR LAYER AND ISOLATION TRE...
- Publication number 20230093111
- Publication date Mar 23, 2023
- Acorn Semi, LLC
- Paul A. Clifton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230084360
- Publication date Mar 16, 2023
- InnoLux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE
- Publication number 20230080979
- Publication date Mar 16, 2023
- SES RFID Solutions GmbH
- SHAO-LUN LIAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20230049126
- Publication date Feb 16, 2023
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Performance Semiconductor Device
- Publication number 20230010770
- Publication date Jan 12, 2023
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220415831
- Publication date Dec 29, 2022
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCH CAPACITANCE CANCELLATION CIRCUIT
- Publication number 20220407512
- Publication date Dec 22, 2022
- pSemi Corporation
- David Kovac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHES IN BULK SUBSTRATE
- Publication number 20220352210
- Publication date Nov 3, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Mark D. LEVY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR INSERTION LOSS REDUCTION IN SIGNAL TRANS...
- Publication number 20220319865
- Publication date Oct 6, 2022
- YUAN ZE UNIVERSITY
- Cheng EN HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY MODULE
- Publication number 20220157748
- Publication date May 19, 2022
- MURATA MANUFACTURING CO., LTD.
- Mayuka ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PROVIDING A SCALABLE BALL GRID ARRAY (BGA)...
- Publication number 20220013442
- Publication date Jan 13, 2022
- QUALCOMM Incorporated
- Nelly CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTRO-MAGNE...
- Publication number 20210407927
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS

High-frequency electrical connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High performance semiconductor device

Multi-component modules (MCMs) including configurable electromagnet...

Radio frequency packages containing multilevel power substrates and...

Switch capacitance cancellation circuit

Superconducting device having a plurality of thermal sink layers an...

Etch barrier for microelectronic packaging conductive structures

Apparatus and method for providing a scalable ball grid array (BGA)...

Heterogeneous integration of radio frequency transistor chiplets ha...

Chip package and manufacturing method thereof

Chip package including substrate having through hole and redistribu...

Multi-component modules (MCMs) including configurable electro-magne...

Semiconductor device package and method of manufacturing the same

Electronic devices including electrically insulated load electrodes

Switches in bulk substrate

Flexible impedance network system

Chip package including substrate inclined sidewall and redistributi...

Microelectronic assemblies having front end under embedded radio fr...

Lead frame for hermetic RF chip package embedded with impedance mat...

Spring electrode

Electronic package and electronic device having the electronic package

Interposer circuit

High-frequency module

Integration of self-biased magnetic circulators with microwave devices

Semiconductor device

Superconducting device with multiple thermal sinks

Switching device

Compensation network for high speed integrated circuits

Semiconductor package, semiconductor device and method for packagin...

Scattering parameter calibration to a semiconductor layer

Resistance and capacitance balancing systems and methods

Patents Applicationslast 30 patents

HETEROGENEOUS INTEGRATION OF RADIO FREQUENCY TRANSISTOR CHIPLETS HA...

SUPERCONDUCTING DEVICE WITH MULTIPLE THERMAL SINKS

MICROWAVE INTEGRATED CIRCUIT AND MANUFACTURING METHOD OF THE SAME

SWITCH CAPACITANCE CANCELLATION CIRCUIT

SEMICONDUCTOR DEVICE AND POWER AMPLIFIER INCLUDING THE SAME

RADIO FREQUENCY SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A R...

RADIOFREQUENCY FILTER AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNET...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

PHASE-CHANGE MATERIAL (PCM) RADIO FREQUENCY (RF) SWITCHING DEVICE W...

ELECTRONIC CIRCUIT DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

RADIO FREQUENCY PACKAGES CONTAINING MULTILEVEL POWER SUBSTRATES AND...

STRUCTURE TO TRANSITION BETWEEN A TRANSMISSION LINE CONDUCTOR AND A...

SWITCHES IN BULK SUBSTRATE

SEMICONDUCTOR PACKAGE INCLUDING ELECTROMAGNETIC SHIELD STRUCTURE

SEMICONDUCTOR DEVICE

MULTI-FINGER RF nFET HAVING BURIED STRESSOR LAYER AND ISOLATION TRE...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGING STRUCTURE

CHIP PACKAGE

High Performance Semiconductor Device

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SWITCH CAPACITANCE CANCELLATION CIRCUIT

SWITCHES IN BULK SUBSTRATE

INTERCONNECT STRUCTURE FOR INSERTION LOSS REDUCTION IN SIGNAL TRANS...

RADIO FREQUENCY MODULE

APPARATUS AND METHOD FOR PROVIDING A SCALABLE BALL GRID ARRAY (BGA)...

MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTRO-MAGNE...