Immersion coating

Industry

CPC
H01L2224/03823

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03823Immersion coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having cobalt coated aluminum contact pads
- Patent number 10,714,439
- Issue date Jul 14, 2020
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure comprising fine pitch backside metal redistr...
- Patent number 9,716,066
- Issue date Jul 25, 2017
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package interconnect structure
- Patent number 9,607,921
- Issue date Mar 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bowl-shaped solder structure
- Patent number 9,455,237
- Issue date Sep 27, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for package reinforcement using molding underfill
- Patent number 9,287,143
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die edge contacts for semiconductor devices
- Patent number 9,190,347
- Issue date Nov 17, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die edge contacts for semiconductor devices
- Patent number 8,541,262
- Issue date Sep 24, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Power Semiconductor Chip, Method for Producing a Power Semiconducto...
- Publication number 20190148318
- Publication date May 16, 2019
- SEMIKRON Elektronik GmbH & Co., KG
- Wolfgang-Michael SCHULZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING COATED CONTACT PADS
- Publication number 20190109104
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- NAZILLA DADVAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...
- Publication number 20170040276
- Publication date Feb 9, 2017
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Package Reinforcement
- Publication number 20140159223
- Publication date Jun 12, 2014
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Edge Contacts for Semiconductor Devices
- Publication number 20130328215
- Publication date Dec 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Package Interconnect Structure
- Publication number 20130181338
- Publication date Jul 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Edge Contacts for Semiconductor Devices
- Publication number 20120056328
- Publication date Mar 8, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS

Immersion coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor chip, method for producing a power semiconducto...

Electronic device having cobalt coated aluminum contact pads

Interconnect structure comprising fine pitch backside metal redistr...

Package on package interconnect structure

Bowl-shaped solder structure

Apparatus for package reinforcement using molding underfill

Die edge contacts for semiconductor devices

Die edge contacts for semiconductor devices

Patents Applicationslast 30 patents

Power Semiconductor Chip, Method for Producing a Power Semiconducto...

ELECTRONIC DEVICE HAVING COATED CONTACT PADS

SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...

Apparatus and Method for Package Reinforcement

Die Edge Contacts for Semiconductor Devices

Package on Package Interconnect Structure

Die Edge Contacts for Semiconductor Devices