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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/64Impedance arrangements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Extended via semiconductor structure and device
- Patent number 12,199,033
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method
- Patent number 12,199,051
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area metal process for improved metallurgical bonding of...
- Patent number 12,191,346
- Issue date Jan 7, 2025
- SARAS MICRO DEVICES, INC.
- Bartlet DeProspo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid glass core for wafer level and panel level packaging applica...
- Patent number 12,191,240
- Issue date Jan 7, 2025
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing silicon oxide films
- Patent number 12,188,121
- Issue date Jan 7, 2025
- ASM Genitech Korea Ltd.
- Tae Ho Yoon
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Embedded inductors and integrated voltage regulators for packaged s...
- Patent number 12,183,692
- Issue date Dec 31, 2024
- SARAS MICRO DEVICES, INC.
- Carlos Riera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with FEOL resistor
- Patent number 12,183,775
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tien-Chien Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Configurable metal—insulator—metal capacitor and devices
- Patent number 12,183,669
- Issue date Dec 31, 2024
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly with conductive field plates
- Patent number 12,183,693
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical circuit of semiconductor channel resistor and apparatus...
- Patent number 12,176,306
- Issue date Dec 24, 2024
- Electronics and Telecommunications Research Institute
- Sang Heung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to voltage compensated switch stack
- Patent number 12,176,304
- Issue date Dec 24, 2024
- Skyworks Solutions, Inc.
- Hanching Fuh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated voltage regulator device and...
- Patent number 12,176,305
- Issue date Dec 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for enhancing quality factor of inductor and m...
- Patent number 12,176,385
- Issue date Dec 24, 2024
- Richwave Technology Corp.
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,993
- Issue date Dec 10, 2024
- Renesas Electronics Corporation
- Tohru Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation device and method of transmitting a signal across an isol...
- Patent number 12,166,146
- Issue date Dec 10, 2024
- MPICS INNOVATIONS PTE. LTD
- Kok Keong Richard Lum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,159,820
- Issue date Dec 3, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded inductors
- Patent number 12,159,844
- Issue date Dec 3, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of fabricating the same
- Patent number 12,154,875
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor devices and stacked power supply topologies
- Patent number 12,154,937
- Issue date Nov 26, 2024
- Infineon Technologies Austria AG
- Danny Clavette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wafer trench isolation between transistors in an integrated...
- Patent number 12,148,717
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including a dual-layer inductor structure and me...
- Patent number 12,142,582
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with interposer between integrated circuit dies
- Patent number 12,136,615
- Issue date Nov 5, 2024
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-sided embeddable capacitors for packaged semiconductor devices
- Patent number 12,136,601
- Issue date Nov 5, 2024
- SARAS MICRO DEVICES, INC.
- Carlos Andres Riera Cercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package embedded magnetic inductor structures and manufacturing tec...
- Patent number 12,132,015
- Issue date Oct 29, 2024
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with capacitance die
- Patent number 12,132,028
- Issue date Oct 29, 2024
- Amazon Technologies, Inc.
- Bassam Abdel-Dayem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor built-in substrate
- Patent number 12,125,626
- Issue date Oct 22, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-scale planar-coil transformer with shield
- Patent number 12,125,630
- Issue date Oct 22, 2024
- Analog Devices International Unlimited Company
- Baoxing Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE EMBEDDED MAGNETIC INDUCTOR STRUCTURES AND MANUFACTURING TEC...
- Publication number 20250022814
- Publication date Jan 16, 2025
- Intel Corporation
- William J. LAMBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGE WITH CAPACITOR...
- Publication number 20250015018
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Capacitors
- Publication number 20250015019
- Publication date Jan 9, 2025
- Chipletz, Inc.
- Michael SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20250014799
- Publication date Jan 9, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...
- Publication number 20250015123
- Publication date Jan 9, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...
- Publication number 20250006611
- Publication date Jan 2, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20250006566
- Publication date Jan 2, 2025
- Hitachi Astemo, Ltd.
- Nobutake TSUYUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR
- Publication number 20250006777
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...
- Publication number 20250006612
- Publication date Jan 2, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...
- Publication number 20250006665
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240429213
- Publication date Dec 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Structures and Assemblies
- Publication number 20240429182
- Publication date Dec 26, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240421106
- Publication date Dec 19, 2024
- Hyundai Motor Company
- Jin Myeong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240413120
- Publication date Dec 12, 2024
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVING SIZE AND EFFICIENCY OF DIES
- Publication number 20240413089
- Publication date Dec 12, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR COMPONENT
- Publication number 20240413056
- Publication date Dec 12, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SI...
- Publication number 20240405077
- Publication date Dec 5, 2024
- Mitsubishi Electric Corporation
- Naoyuki KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240405122
- Publication date Dec 5, 2024
- Fuji Electric Co., Ltd.
- Yosuke SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA PROCESSING DEVICE
- Publication number 20240404915
- Publication date Dec 5, 2024
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Pengkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTING ON CHIP INDUCTORS FOR MONOLITHIC VOLTAGE REGULATION
- Publication number 20240404966
- Publication date Dec 5, 2024
- Oracle International Corporation
- Michael Henry Soltau Dayringer
- G05 - CONTROLLING REGULATING
Information Patent Application
TRANSFORMER-BASED ISOLATOR WITH SENSE COIL
- Publication number 20240395736
- Publication date Nov 28, 2024
- ALLEGRO MICROSYSTEMS, LLC
- John Horan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240395735
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES
- Publication number 20240395769
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240387415
- Publication date Nov 21, 2024
- ROHM CO., LTD.
- Keita SHIKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240387751
- Publication date Nov 21, 2024
- ROHM CO., LTD.
- Akira SAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE, FABRICATION METHOD OF ARRAY SUBSTRATE, ARRAY SUBSTRATE AN...
- Publication number 20240387631
- Publication date Nov 21, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Hao WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL TESTING OF SEMICONDUCTOR PACKAGES
- Publication number 20240387296
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya Huei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240387414
- Publication date Nov 21, 2024
- DENSO CORPORATION
- Masakazu SHIGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS
- Publication number 20240379573
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- MICHAEL ENDRES
- H01 - BASIC ELECTRIC ELEMENTS

Impedance arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Extended via semiconductor structure and device

Integrated circuit structure and method

Methods of forming microelectronic device assemblies and packages

Selective area metal process for improved metallurgical bonding of...

Hybrid glass core for wafer level and panel level packaging applica...

Method of depositing silicon oxide films

Embedded inductors and integrated voltage regulators for packaged s...

Integrated circuit with FEOL resistor

Configurable metal—insulator—metal capacitor and devices

Integrated magnetic assembly with conductive field plates

Electrical circuit of semiconductor channel resistor and apparatus...

Devices and methods related to voltage compensated switch stack

Semiconductor package with integrated voltage regulator device and...

Semiconductor device for enhancing quality factor of inductor and m...

Semiconductor device

Semiconductor device

Isolation device and method of transmitting a signal across an isol...

Flat no-lead package with surface mounted structure

Electronic substrates having embedded inductors

Package and method of fabricating the same

Inductor devices and stacked power supply topologies

Through wafer trench isolation between transistors in an integrated...

Gallium nitride (GAN) three-dimensional integrated circuit technology

Organic interposer including a dual-layer inductor structure and me...

Electronic package with interposer between integrated circuit dies

Single-sided embeddable capacitors for packaged semiconductor devices

Package embedded magnetic inductor structures and manufacturing tec...

Semiconductor package with capacitance die

Inductor built-in substrate

Micro-scale planar-coil transformer with shield

Patents Applicationslast 30 patents

PACKAGE EMBEDDED MAGNETIC INDUCTOR STRUCTURES AND MANUFACTURING TEC...

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGE WITH CAPACITOR...

Semiconductor Package with Integrated Capacitors

INSULATING CHIP AND SIGNAL TRANSMISSION DEVICE

ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...

Multi-Die Fine Grain Integrated Voltage Regulation

METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...

SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

THIN FILM RESISTOR

METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...

METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...

ELECTRONIC DEVICE

Multilayer Structures and Assemblies

POWER MODULE

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

IMPROVING SIZE AND EFFICIENCY OF DIES

CAPACITOR COMPONENT

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SI...

SEMICONDUCTOR DEVICE

DATA PROCESSING DEVICE

DISTRIBUTING ON CHIP INDUCTORS FOR MONOLITHIC VOLTAGE REGULATION

TRANSFORMER-BASED ISOLATOR WITH SENSE COIL

ELECTRONIC DEVICE

BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES

NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

NANOWIRE, FABRICATION METHOD OF ARRAY SUBSTRATE, ARRAY SUBSTRATE AN...

ELECTRICAL TESTING OF SEMICONDUCTOR PACKAGES

POWER MODULE

SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS