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H01L23/64

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/64Impedance arrangements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Through-substrate underfill formation for an integrated circuit ass...
- Patent number 12,341,121
- Issue date Jun 24, 2025
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless double-sided embedded multi-die interconnect bridge
- Patent number 12,341,129
- Issue date Jun 24, 2025
- Intel Corporation
- Biancun Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors on package substrates
- Patent number 12,336,196
- Issue date Jun 17, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated capacitors
- Patent number 12,334,455
- Issue date Jun 17, 2025
- Chipletz, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 12,336,231
- Issue date Jun 17, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 12,334,476
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and structure with electronic component
- Patent number 12,336,085
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Kazunori Tsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically tolerant couplers
- Patent number 12,327,164
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Timothy Phung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optoelectronic semiconductor component and arrangement
- Patent number 12,327,803
- Issue date Jun 10, 2025
- Osram Opto Semiconductors GmbH
- Matthias Hien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate core having an embedded laser stop to control...
- Patent number 12,327,814
- Issue date Jun 10, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of resistance and capacitance reduction to circuit output n...
- Patent number 12,324,228
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chia Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit with guard ring
- Patent number 12,315,798
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiao-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, electronic device package and method for manufac...
- Patent number 12,315,828
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna and device configurations
- Patent number 12,315,986
- Issue date May 27, 2025
- QUALCOMM Incorporated
- Seong Heon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic device structure having an electron...
- Patent number 12,300,638
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit package
- Patent number 12,300,621
- Issue date May 13, 2025
- Infinera Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method for forming the same
- Patent number 12,295,149
- Issue date May 6, 2025
- ANHUI CAMBRICON INFORMATION TECHNOLOGY CO., LTD.
- Shuai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 12,293,973
- Issue date May 6, 2025
- HITACHI ENERGY LTD
- Slavo Kicin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated capacitors
- Patent number 12,288,756
- Issue date Apr 29, 2025
- Chipletz, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for delivering power to semiconductors
- Patent number 12,289,050
- Issue date Apr 29, 2025
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated device stack including system on chip and pow...
- Patent number 12,289,898
- Issue date Apr 29, 2025
- QUALCOMM Incorporated
- Peng Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a trench capacitor with wafer bow
- Patent number 12,288,648
- Issue date Apr 29, 2025
- SK keyfoundry Inc.
- Seung Mo Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Band-pass filter for stacked sensor
- Patent number 12,278,254
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package board
- Patent number 12,278,197
- Issue date Apr 15, 2025
- Murata Manufacturing Co., Ltd.
- Kenji Nishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 12,272,637
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 12,272,673
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding passive devices on active dies to form 3D packages
- Patent number 12,255,174
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package-on-package including the same
- Patent number 12,255,160
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Juyoun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device with integrated inductor and manufactu...
- Patent number 12,255,157
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,255,224
- Issue date Mar 18, 2025
- Murata Manufacturing Co., Ltd.
- Takafumi Kusuyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE-GROUP PACKAGE HAVING A DEEP TRENCH DEVICE
- Publication number 20250210583
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250210549
- Publication date Jun 26, 2025
- SAMCUNG ELECTRONICS CO., LTD.
- Sangjun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND IC CARD HAVING THE SAME
- Publication number 20250210237
- Publication date Jun 26, 2025
- TDK Corporation
- Ryota UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED VOLTAGE REGULATION MODULE
- Publication number 20250210548
- Publication date Jun 26, 2025
- Chipletz, Inc.
- Siddharth Ravichandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE
- Publication number 20250201690
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250192076
- Publication date Jun 12, 2025
- Hon Young Semiconductor Corporation
- Liang-Ming LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183186
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sungoh Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES
- Publication number 20250183179
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL SCALE PACKAGING OF A PLURALITY OF TRANSFORMER DEVICES FOR RED...
- Publication number 20250183201
- Publication date Jun 5, 2025
- Danger Devices Inc.
- Nicholas SUTARDJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE
- Publication number 20250183134
- Publication date Jun 5, 2025
- BYD COMPANY LIMITED
- Chunjiang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...
- Publication number 20250183202
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-SHIANG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE
- Publication number 20250172434
- Publication date May 29, 2025
- DENSO CORPORATION
- Kazuaki FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174581
- Publication date May 29, 2025
- NANYA TECHNOLOGY CORPORATION
- DA-ZEN CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250167141
- Publication date May 22, 2025
- Samsung Electronics, Co., Ltd.
- YoungJun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES INCLUDING TRENCH CAPACITORS AND METHODS OF FORMING THE SAME
- Publication number 20250157915
- Publication date May 15, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- ANTHONY JEREMY VILLALON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACERS FOR BEOL MULTI-PATTERNING
- Publication number 20250157952
- Publication date May 15, 2025
- ASM IP HOLDING B.V.
- Debanjan Jana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging module and manufacturing method therefor
- Publication number 20250157903
- Publication date May 15, 2025
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jian WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH REINFORCED ELEMENT
- Publication number 20250149469
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149471
- Publication date May 8, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA SHAPING BETWEEN METAL LAYERS FOR CONTROLLED RESISTANCE
- Publication number 20250140604
- Publication date May 1, 2025
- Applied Materials, Inc.
- Sefa Dag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250140716
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUS SYSTEM FOR A HIGH-POWER CONVERTER CIRCUIT
- Publication number 20250140706
- Publication date May 1, 2025
- Eaton Intelligent Power Limited
- Geraldo NOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250132271
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Kyojin Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT IGBT SWITCHING
- Publication number 20250132755
- Publication date Apr 24, 2025
- EHT Ventures LLC
- Timothy Ziemba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250125256
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jae Sup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMIB ARCHITECTURE WITH DEDICATED METAL LAYERS FOR IMPROVING POWER D...
- Publication number 20250125268
- Publication date Apr 17, 2025
- Intel Corporation
- Jianyong XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM-ACCESS MEMORY DEVICES AND METHODS OF MANUFACTURING T...
- Publication number 20250125287
- Publication date Apr 17, 2025
- WINBOND ELECTRONICS CORP.
- Te-Hsuan PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125286
- Publication date Apr 17, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- James Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125318
- Publication date Apr 17, 2025
- Mitsubishi Electric Corporation
- Shin Chaki
- H01 - BASIC ELECTRIC ELEMENTS

Impedance arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Through-substrate underfill formation for an integrated circuit ass...

Substrateless double-sided embedded multi-die interconnect bridge

Magnetic core inductors on package substrates

Semiconductor package with integrated capacitors

Inverted leads for packaged isolation devices

Semiconductor device with discrete blocks

Structure and structure with electronic component

Mechanically tolerant couplers

Optoelectronic semiconductor component and arrangement

Electronic substrate core having an embedded laser stop to control...

Methods of resistance and capacitance reduction to circuit output n...

Integrated circuit with guard ring

Package substrate, electronic device package and method for manufac...

Antenna and device configurations

Method of forming an electronic device structure having an electron...

Hybrid integrated circuit package

Capacitor structure and method for forming the same

Power semiconductor module

Semiconductor package with integrated capacitors

Method and apparatus for delivering power to semiconductors

Vertically integrated device stack including system on chip and pow...

Method of manufacturing a trench capacitor with wafer bow

Band-pass filter for stacked sensor

Package board

Integrated fan-out package with 3D magnetic core inductor

Capacitive coupling in a direct-bonded interface for microelectroni...

Bonding passive devices on active dies to form 3D packages

Semiconductor package and package-on-package including the same

Semiconductor package device with integrated inductor and manufactu...

Electronic component module

Patents Applicationslast 30 patents

DIE-GROUP PACKAGE HAVING A DEEP TRENCH DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

COIL COMPONENT AND IC CARD HAVING THE SAME

EMBEDDED VOLTAGE REGULATION MODULE

SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES

PANEL SCALE PACKAGING OF A PLURALITY OF TRANSFORMER DEVICES FOR RED...

SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE

SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...

TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

STRUCTURES INCLUDING TRENCH CAPACITORS AND METHODS OF FORMING THE SAME

SPACERS FOR BEOL MULTI-PATTERNING

Packaging module and manufacturing method therefor

PACKAGE STRUCTURE WITH REINFORCED ELEMENT

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Multi-Die Fine Grain Integrated Voltage Regulation

VIA SHAPING BETWEEN METAL LAYERS FOR CONTROLLED RESISTANCE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

BUS SYSTEM FOR A HIGH-POWER CONVERTER CIRCUIT

SEMICONDUCTOR PACKAGE

EFFICIENT IGBT SWITCHING

SEMICONDUCTOR PACKAGE

EMIB ARCHITECTURE WITH DEDICATED METAL LAYERS FOR IMPROVING POWER D...

DYNAMIC RANDOM-ACCESS MEMORY DEVICES AND METHODS OF MANUFACTURING T...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE