Impedance arrangements

Industry

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H01L23/64

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/64Impedance arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,230,590
- Issue date Feb 18, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate embedded magnetic core inductors and method of making
- Patent number 12,230,430
- Issue date Feb 18, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,230,560
- Issue date Feb 18, 2025
- Mediatek Inc.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor device and method
- Patent number 12,224,253
- Issue date Feb 11, 2025
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors in interposer
- Patent number 12,224,252
- Issue date Feb 11, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna boards and communication devices
- Patent number 12,218,408
- Issue date Feb 4, 2025
- Intel Corporation
- Trang Thai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with reinforced element
- Patent number 12,218,080
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMIB architecture with dedicated metal layers for improving power d...
- Patent number 12,218,063
- Issue date Feb 4, 2025
- Intel Corporation
- Jianyong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a resistor structure with more refined...
- Patent number 12,211,887
- Issue date Jan 28, 2025
- MediaTek Singapore Pte Ltd.
- Lanxiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor doped region with biased isolated members
- Patent number 12,211,807
- Issue date Jan 28, 2025
- Texas Instruments Incorporated
- Alexei Sadovnikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply system and power supply module
- Patent number 12,211,827
- Issue date Jan 28, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming semiconductor package wi...
- Patent number 12,211,803
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended via semiconductor structure and device
- Patent number 12,199,033
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method
- Patent number 12,199,051
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area metal process for improved metallurgical bonding of...
- Patent number 12,191,346
- Issue date Jan 7, 2025
- SARAS MICRO DEVICES, INC.
- Bartlet DeProspo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid glass core for wafer level and panel level packaging applica...
- Patent number 12,191,240
- Issue date Jan 7, 2025
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing silicon oxide films
- Patent number 12,188,121
- Issue date Jan 7, 2025
- ASM Genitech Korea Ltd.
- Tae Ho Yoon
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Embedded inductors and integrated voltage regulators for packaged s...
- Patent number 12,183,692
- Issue date Dec 31, 2024
- SARAS MICRO DEVICES, INC.
- Carlos Riera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with FEOL resistor
- Patent number 12,183,775
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tien-Chien Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Configurable metal—insulator—metal capacitor and devices
- Patent number 12,183,669
- Issue date Dec 31, 2024
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly with conductive field plates
- Patent number 12,183,693
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical circuit of semiconductor channel resistor and apparatus...
- Patent number 12,176,306
- Issue date Dec 24, 2024
- Electronics and Telecommunications Research Institute
- Sang Heung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to voltage compensated switch stack
- Patent number 12,176,304
- Issue date Dec 24, 2024
- Skyworks Solutions, Inc.
- Hanching Fuh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated voltage regulator device and...
- Patent number 12,176,305
- Issue date Dec 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for enhancing quality factor of inductor and m...
- Patent number 12,176,385
- Issue date Dec 24, 2024
- Richwave Technology Corp.
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,993
- Issue date Dec 10, 2024
- Renesas Electronics Corporation
- Tohru Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation device and method of transmitting a signal across an isol...
- Patent number 12,166,146
- Issue date Dec 10, 2024
- MPICS INNOVATIONS PTE. LTD
- Kok Keong Richard Lum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded inductors
- Patent number 12,159,844
- Issue date Dec 3, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE
- Publication number 20250062296
- Publication date Feb 20, 2025
- DELTA ELECTRONICS (SHANGHAI) CO.,LTD.
- Pengkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062186
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Junghoo Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ASSEMBLY INCLUDING THE SAME
- Publication number 20250054825
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jaehyun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND FABRICATION THEREOF
- Publication number 20250054883
- Publication date Feb 13, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250054884
- Publication date Feb 13, 2025
- RENESAS ELECTRONICS CORPORATION
- Tohru KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250046663
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250046738
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-SHORT CHANNEL LENGTHS IN SIC MOS-BASED POWER DEVICES AND METH...
- Publication number 20250048700
- Publication date Feb 6, 2025
- Purdue Research Foundation
- James Albert Cooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMAPPING LAYERS FOR PHOTONIC INTERPOSERS
- Publication number 20250046775
- Publication date Feb 6, 2025
- Lightmatter, Inc
- Chian-min Richard Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046755
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY
- Publication number 20250040231
- Publication date Jan 30, 2025
- Intel Corporation
- Han Wui THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20250029885
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Donggyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20250029939
- Publication date Jan 23, 2025
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250029938
- Publication date Jan 23, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yifan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE EMBEDDED MAGNETIC INDUCTOR STRUCTURES AND MANUFACTURING TEC...
- Publication number 20250022814
- Publication date Jan 16, 2025
- Intel Corporation
- William J. LAMBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGE WITH CAPACITOR...
- Publication number 20250015018
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Capacitors
- Publication number 20250015019
- Publication date Jan 9, 2025
- Chipletz, Inc.
- Michael SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20250014799
- Publication date Jan 9, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...
- Publication number 20250015123
- Publication date Jan 9, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...
- Publication number 20250006611
- Publication date Jan 2, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20250006566
- Publication date Jan 2, 2025
- Hitachi Astemo, Ltd.
- Nobutake TSUYUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR
- Publication number 20250006777
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...
- Publication number 20250006612
- Publication date Jan 2, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...
- Publication number 20250006665
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240429213
- Publication date Dec 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Structures and Assemblies
- Publication number 20240429182
- Publication date Dec 26, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240421106
- Publication date Dec 19, 2024
- Hyundai Motor Company
- Jin Myeong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240413120
- Publication date Dec 12, 2024
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS

Impedance arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package and manufacturing method thereof

Substrate embedded magnetic core inductors and method of making

Semiconductor package structure

Magnetic inductor device and method

Magnetic core inductors in interposer

Antenna boards and communication devices

Package structure with reinforced element

EMIB architecture with dedicated metal layers for improving power d...

Semiconductor devices having a resistor structure with more refined...

Semiconductor doped region with biased isolated members

Power supply system and power supply module

Semiconductor device and method of forming semiconductor package wi...

Extended via semiconductor structure and device

Integrated circuit structure and method

Methods of forming microelectronic device assemblies and packages

Selective area metal process for improved metallurgical bonding of...

Hybrid glass core for wafer level and panel level packaging applica...

Method of depositing silicon oxide films

Embedded inductors and integrated voltage regulators for packaged s...

Integrated circuit with FEOL resistor

Configurable metal—insulator—metal capacitor and devices

Integrated magnetic assembly with conductive field plates

Electrical circuit of semiconductor channel resistor and apparatus...

Devices and methods related to voltage compensated switch stack

Semiconductor package with integrated voltage regulator device and...

Semiconductor device for enhancing quality factor of inductor and m...

Semiconductor device

Semiconductor device

Isolation device and method of transmitting a signal across an isol...

Electronic substrates having embedded inductors

Patents Applicationslast 30 patents

POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ASSEMBLY INCLUDING THE SAME

INTERPOSER AND FABRICATION THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE AND METHOD OF FABRICATING THE SAME

ULTRA-SHORT CHANNEL LENGTHS IN SIC MOS-BASED POWER DEVICES AND METH...

REMAPPING LAYERS FOR PHOTONIC INTERPOSERS

SEMICONDUCTOR PACKAGE

GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY

SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME

PACKAGE EMBEDDED MAGNETIC INDUCTOR STRUCTURES AND MANUFACTURING TEC...

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGE WITH CAPACITOR...

Semiconductor Package with Integrated Capacitors

INSULATING CHIP AND SIGNAL TRANSMISSION DEVICE

ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...

Multi-Die Fine Grain Integrated Voltage Regulation

METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...

SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

THIN FILM RESISTOR

METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...

METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...

ELECTRONIC DEVICE

Multilayer Structures and Assemblies

POWER MODULE

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE