Impedance arrangements

Industry

CPC
H01L23/64

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/64Impedance arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and a method of making the same
- Patent number 12,369,304
- Issue date Jul 22, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xiaojie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,369,334
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Yeh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar magnetic radial inductors to enable VR disaggregation
- Patent number 12,362,295
- Issue date Jul 15, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including standard cells and at least one capaci...
- Patent number 12,356,725
- Issue date Jul 8, 2025
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled loop and void structure integrated in a redistribution laye...
- Patent number 12,354,978
- Issue date Jul 8, 2025
- Xilinx, Inc.
- Po-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic system formed by electrically connected and gal...
- Patent number 12,354,998
- Issue date Jul 8, 2025
- STMicroelectronics S.r.l.
- Dario Paci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable and embeddable vertical capacitors in semiconductor devic...
- Patent number 12,347,628
- Issue date Jul 1, 2025
- SARAS MICRO DEVICES, INC.
- Ryan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-core transformer package with ferrite electro-magnetic interfer...
- Patent number 12,347,789
- Issue date Jul 1, 2025
- HIGH TECHNOLOGY LIMITED
- Chik Wai (David) Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dies and devices with a coil for inductive coupling
- Patent number 12,347,796
- Issue date Jul 1, 2025
- Intel Corporation
- Martin Ostermayr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate underfill formation for an integrated circuit ass...
- Patent number 12,341,121
- Issue date Jun 24, 2025
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless double-sided embedded multi-die interconnect bridge
- Patent number 12,341,129
- Issue date Jun 24, 2025
- Intel Corporation
- Biancun Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated capacitors
- Patent number 12,334,455
- Issue date Jun 17, 2025
- Chipletz, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors on package substrates
- Patent number 12,336,196
- Issue date Jun 17, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 12,336,231
- Issue date Jun 17, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and structure with electronic component
- Patent number 12,336,085
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Kazunori Tsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 12,334,476
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically tolerant couplers
- Patent number 12,327,164
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Timothy Phung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optoelectronic semiconductor component and arrangement
- Patent number 12,327,803
- Issue date Jun 10, 2025
- Osram Opto Semiconductors GmbH
- Matthias Hien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate core having an embedded laser stop to control...
- Patent number 12,327,814
- Issue date Jun 10, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of resistance and capacitance reduction to circuit output n...
- Patent number 12,324,228
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chia Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit with guard ring
- Patent number 12,315,798
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiao-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, electronic device package and method for manufac...
- Patent number 12,315,828
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna and device configurations
- Patent number 12,315,986
- Issue date May 27, 2025
- QUALCOMM Incorporated
- Seong Heon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic device structure having an electron...
- Patent number 12,300,638
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit package
- Patent number 12,300,621
- Issue date May 13, 2025
- Infinera Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method for forming the same
- Patent number 12,295,149
- Issue date May 6, 2025
- ANHUI CAMBRICON INFORMATION TECHNOLOGY CO., LTD.
- Shuai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 12,293,973
- Issue date May 6, 2025
- HITACHI ENERGY LTD
- Slavo Kicin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated capacitors
- Patent number 12,288,756
- Issue date Apr 29, 2025
- Chipletz, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for delivering power to semiconductors
- Patent number 12,289,050
- Issue date Apr 29, 2025
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated device stack including system on chip and pow...
- Patent number 12,289,898
- Issue date Apr 29, 2025
- QUALCOMM Incorporated
- Peng Zou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSFORMER PACKAGES WITH MAGNETIC CORE SUSPENSION
- Publication number 20250239397
- Publication date Jul 24, 2025
- ALLEGRO MICROSYSTEMS, LLC
- William P. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL POWER DELIVERY IN SPACE-CONSTRAINED SYSTEM-ON-PACKAGE
- Publication number 20250233088
- Publication date Jul 17, 2025
- Intel Corporation
- Rinkle Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES
- Publication number 20250233087
- Publication date Jul 17, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INDUCTORS AND INTEGRATED VOLTAGE REGULATORS FOR PACKAGED S...
- Publication number 20250226337
- Publication date Jul 10, 2025
- SARAS MICRO DEVICES, INC.
- Carlos Andres Riera Cercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250226364
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Hung Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE CHIP, SEMICONDUCTOR PACKAGE INCLUDING BRIDGE CHIP AND METHOD...
- Publication number 20250226331
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Seokbeom YONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250226336
- Publication date Jul 10, 2025
- MEDIATEK SINGAPORE PTE LTD
- Zhigang DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR CERAMIC COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218982
- Publication date Jul 3, 2025
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATE...
- Publication number 20250219034
- Publication date Jul 3, 2025
- Celestial AI Inc.
- Matteo Staffaroni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES
- Publication number 20250218956
- Publication date Jul 3, 2025
- Intel Corporation
- Shayan Kaviani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...
- Publication number 20250218958
- Publication date Jul 3, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING ASYMMETRIC METALLIZATION STRUCTURES DISPOSED ON OP...
- Publication number 20250218966
- Publication date Jul 3, 2025
- QUALCOMM Incorporated
- Manuel ALDRETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...
- Publication number 20250218983
- Publication date Jul 3, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...
- Publication number 20250218955
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...
- Publication number 20250218960
- Publication date Jul 3, 2025
- Intel Corporation
- Clay Bradley Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218962
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE
- Publication number 20250218963
- Publication date Jul 3, 2025
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technologies for Components Embedded in a Substrate Core
- Publication number 20250219040
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218964
- Publication date Jul 3, 2025
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION TECHNIQUES FOR COMPONENTS EMBEDDED IN A CORE LAYER OF...
- Publication number 20250218984
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-GROUP PACKAGE HAVING A DEEP TRENCH DEVICE
- Publication number 20250210583
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250210549
- Publication date Jun 26, 2025
- SAMCUNG ELECTRONICS CO., LTD.
- Sangjun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND IC CARD HAVING THE SAME
- Publication number 20250210237
- Publication date Jun 26, 2025
- TDK Corporation
- Ryota UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED VOLTAGE REGULATION MODULE
- Publication number 20250210548
- Publication date Jun 26, 2025
- Chipletz, Inc.
- Siddharth Ravichandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE
- Publication number 20250201690
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250192076
- Publication date Jun 12, 2025
- Hon Young Semiconductor Corporation
- Liang-Ming LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183186
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sungoh Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES
- Publication number 20250183179
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL SCALE PACKAGING OF A PLURALITY OF TRANSFORMER DEVICES FOR RED...
- Publication number 20250183201
- Publication date Jun 5, 2025
- Danger Devices Inc.
- Nicholas SUTARDJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE
- Publication number 20250183134
- Publication date Jun 5, 2025
- BYD COMPANY LIMITED
- Chunjiang LIU
- H01 - BASIC ELECTRIC ELEMENTS

Impedance arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and a method of making the same

Method of manufacturing a semiconductor device and a semiconductor...

Planar magnetic radial inductors to enable VR disaggregation

Integrated circuit including standard cells and at least one capaci...

Coupled loop and void structure integrated in a redistribution laye...

Packaged electronic system formed by electrically connected and gal...

Stackable and embeddable vertical capacitors in semiconductor devic...

Air-core transformer package with ferrite electro-magnetic interfer...

Semiconductor dies and devices with a coil for inductive coupling

Through-substrate underfill formation for an integrated circuit ass...

Substrateless double-sided embedded multi-die interconnect bridge

Semiconductor package with integrated capacitors

Magnetic core inductors on package substrates

Inverted leads for packaged isolation devices

Structure and structure with electronic component

Semiconductor device with discrete blocks

Mechanically tolerant couplers

Optoelectronic semiconductor component and arrangement

Electronic substrate core having an embedded laser stop to control...

Methods of resistance and capacitance reduction to circuit output n...

Integrated circuit with guard ring

Package substrate, electronic device package and method for manufac...

Antenna and device configurations

Method of forming an electronic device structure having an electron...

Hybrid integrated circuit package

Capacitor structure and method for forming the same

Power semiconductor module

Semiconductor package with integrated capacitors

Method and apparatus for delivering power to semiconductors

Vertically integrated device stack including system on chip and pow...

Patents Applicationslast 30 patents

TRANSFORMER PACKAGES WITH MAGNETIC CORE SUSPENSION

VERTICAL POWER DELIVERY IN SPACE-CONSTRAINED SYSTEM-ON-PACKAGE

SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES

EMBEDDED INDUCTORS AND INTEGRATED VOLTAGE REGULATORS FOR PACKAGED S...

PACKAGE STRUCTURE

BRIDGE CHIP, SEMICONDUCTOR PACKAGE INCLUDING BRIDGE CHIP AND METHOD...

SEMICONDUCTOR PACKAGE STRUCTURE

TECHNOLOGIES FOR CERAMIC COMPONENTS EMBEDDED IN A SUBSTRATE CORE

ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATE...

METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES

PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...

SUBSTRATE HAVING ASYMMETRIC METALLIZATION STRUCTURES DISPOSED ON OP...

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...

METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...

TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE

DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE

Technologies for Components Embedded in a Substrate Core

TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE

ENCAPSULATION TECHNIQUES FOR COMPONENTS EMBEDDED IN A CORE LAYER OF...

DIE-GROUP PACKAGE HAVING A DEEP TRENCH DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

COIL COMPONENT AND IC CARD HAVING THE SAME

EMBEDDED VOLTAGE REGULATION MODULE

SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES

PANEL SCALE PACKAGING OF A PLURALITY OF TRANSFORMER DEVICES FOR RED...

SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE