in the lower part of the bonding apparatus

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/75744in the lower part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,362,314
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Yuhei Matsuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 12,144,065
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing method and bon...
- Patent number 11,804,466
- Issue date Oct 31, 2023
- Tokyo Electron Limited
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass transfer device and mass transfer method
- Patent number 11,784,159
- Issue date Oct 10, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Jan-hsiang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 11,742,321
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus, bonding system, bonding method, and recording me...
- Patent number 11,658,146
- Issue date May 23, 2023
- Tokyo Electron Limited
- Takashi Nakamitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for bonding semiconductor substrate
- Patent number 11,631,652
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding tools for bonding machines, bonding machines for bonding se...
- Patent number 11,608,453
- Issue date Mar 21, 2023
- Kulicke and Soffa Industries, Inc.
- Urban Ernst
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Component joining apparatus, component joining method and mounted s...
- Patent number 11,574,888
- Issue date Feb 7, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Ryo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 11,521,950
- Issue date Dec 6, 2022
- Kioxia Corporation
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip integration module, chip package structure, and chip integrati...
- Patent number 11,462,520
- Issue date Oct 4, 2022
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mechanism, chuck device, and bonder
- Patent number 11,462,428
- Issue date Oct 4, 2022
- Tazmo Co., Ltd.
- Masaaki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding apparatuses
- Patent number 11,443,965
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Kyeongbin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 11,432,372
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding substrates
- Patent number 11,315,901
- Issue date Apr 26, 2022
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 11,295,996
- Issue date Apr 5, 2022
- Kulicke and Soffa Industries, Inc.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,195,819
- Issue date Dec 7, 2021
- LONGITUDE LICENSING LIMITED
- Daisuke Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 11,164,843
- Issue date Nov 2, 2021
- Kioxia Corporation
- Hironobu Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for positioning first object in relation to secon...
- Patent number 11,139,193
- Issue date Oct 5, 2021
- Shinkawa Ltd.
- Tetsuya Utano
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Bonding apparatus, bonding system, bonding method, and recording me...
- Patent number 11,094,667
- Issue date Aug 17, 2021
- Tokyo Electron Limited
- Takashi Nakamitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 11,031,369
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,985,132
- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for bonding wafers and bonding tool
- Patent number 10,872,873
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer to wafer bonding method and wafer to wafer bonding system
- Patent number 10,811,381
- Issue date Oct 20, 2020
- Samsung Electronics Co., Ltd.
- Joon-Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas-controlled bonding platform for edge defect reduction during wa...
- Patent number 10,777,433
- Issue date Sep 15, 2020
- ELPIS TECHNOLOGIES INC.
- Wei Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,756,046
- Issue date Aug 25, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus and method for packaging components
- Patent number 10,734,349
- Issue date Aug 4, 2020
- CAPCON LIMITED
- Feng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,692,783
- Issue date Jun 23, 2020
- KULICKE AND SOFFA, INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS, CHUCK EXCHANGE APPARATUS, AND ARTICLE MANUFACTUR...
- Publication number 20250219013
- Publication date Jul 3, 2025
- Canon Kabushiki Kaisha
- KAI TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MAN...
- Publication number 20250174596
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Sunchul KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING PRESS AND PRESSURE SINTERING METHOD FOR PRODUCING A SINTE...
- Publication number 20250065400
- Publication date Feb 27, 2025
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- DOMINIC BIRKICHT
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SUBSTRATE HOLDER AND BONDING SYSTEM
- Publication number 20240014167
- Publication date Jan 11, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20230378121
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Yuhei Matsuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROCESSES AND APPLICATIONS FOR CATALYST INFLUENCED CHEMICAL ETCHING
- Publication number 20230230954
- Publication date Jul 20, 2023
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20230054378
- Publication date Feb 23, 2023
- KIOXIA Corporation
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20220173068
- Publication date Jun 2, 2022
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mass transfer device and mass transfer method
- Publication number 20210351154
- Publication date Nov 11, 2021
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Jan-hsiang YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
- Publication number 20210343678
- Publication date Nov 4, 2021
- TOKYO ELECTRON LIMITED
- Takashi Nakamitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR BOND WAVE PROPAGATION CONTROL
- Publication number 20210272928
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERING PRESS AND PRESSURE SINTERING METHOD FOR PRODUCING A SINTE...
- Publication number 20210121962
- Publication date Apr 29, 2021
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- DOMINIC BIRKICHT
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20210082863
- Publication date Mar 18, 2021
- Kioxia Corporation
- Hironobu TAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TO WAFER BONDING METHODS AND WAFER TO WAFER BONDING APPARATUSES
- Publication number 20210005475
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Kyeongbin LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20200273759
- Publication date Aug 27, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND BON...
- Publication number 20200273835
- Publication date Aug 27, 2020
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20200168580
- Publication date May 28, 2020
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BOND WAVE PROPAGATION CONTROL
- Publication number 20200051950
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALIGNMENT MECHANISM, CHUCK DEVICE, AND BONDER
- Publication number 20190333798
- Publication date Oct 31, 2019
- TAZMO CO., LTD.
- Masaaki TANABE
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
- Publication number 20190312006
- Publication date Oct 10, 2019
- TOKYO ELECTRON LIMITED
- Takashi Nakamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT JOINING APPARATUS, COMPONENT JOINING METHOD AND MOUNTED S...
- Publication number 20190189586
- Publication date Jun 20, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- RYO FUJITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BONDING WAFERS AND BONDING TOOL
- Publication number 20190148333
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING RESIN LAYER FORMING APPARATUS
- Publication number 20190139928
- Publication date May 9, 2019
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATING STRUCTURE OF ELECTRONIC DEVICE USING TRANSFERRING ELEMEN...
- Publication number 20190103532
- Publication date Apr 4, 2019
- CENTER FOR INTEGRATED SMART SENSORS FOUNDATION
- Keon Jae Lee
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20190027462
- Publication date Jan 24, 2019
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HANDLING UNIT
- Publication number 20190006211
- Publication date Jan 3, 2019
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM SUCTION PAD AND SUBSTRATE HOLDER
- Publication number 20180286772
- Publication date Oct 4, 2018
- EBARA CORPORATION
- Satoru YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATI...
- Publication number 20180204825
- Publication date Jul 19, 2018
- Huawei Technologies Co., Ltd
- Huili FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180182733
- Publication date Jun 28, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS

in the lower part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and bonding method

Warpage control in the packaging of integrated circuits

Low warpage curing methodology by inducing curvature

Substrate processing apparatus, substrate processing method and bon...

Mass transfer device and mass transfer method

Apparatus for bond wave propagation control

Bonding apparatus, bonding system, bonding method, and recording me...

Method and apparatus for bonding semiconductor substrate

Bonding tools for bonding machines, bonding machines for bonding se...

Component joining apparatus, component joining method and mounted s...

Semiconductor manufacturing apparatus and method of manufacturing s...

Chip integration module, chip package structure, and chip integrati...

Alignment mechanism, chuck device, and bonder

Wafer to wafer bonding apparatuses

Warpage control in the packaging of integrated circuits

Method for bonding substrates

Systems and methods for bonding semiconductor elements

Semiconductor device

Substrate bonding apparatus

Device and method for positioning first object in relation to secon...

Bonding apparatus, bonding system, bonding method, and recording me...

Apparatus for bond wave propagation control

Bonding apparatus, bonding system, bonding method and storage medium

Method for bonding wafers and bonding tool

Bonding system

Wafer to wafer bonding method and wafer to wafer bonding system

Gas-controlled bonding platform for edge defect reduction during wa...

Bonding apparatus, bonding system, bonding method and storage medium

Apparatus and method for packaging components

Systems and methods for bonding semiconductor elements

Patents Applicationslast 30 patents

BONDING APPARATUS, CHUCK EXCHANGE APPARATUS, AND ARTICLE MANUFACTUR...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MAN...

SINTERING PRESS AND PRESSURE SINTERING METHOD FOR PRODUCING A SINTE...

SUBSTRATE HOLDER AND BONDING SYSTEM

BONDING APPARATUS AND BONDING METHOD

PROCESSES AND APPLICATIONS FOR CATALYST INFLUENCED CHEMICAL ETCHING

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

APPARATUS AND METHOD FOR BONDING SUBSTRATES

Mass transfer device and mass transfer method

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...

APPARATUS FOR BOND WAVE PROPAGATION CONTROL

SINTERING PRESS AND PRESSURE SINTERING METHOD FOR PRODUCING A SINTE...

SUBSTRATE BONDING APPARATUS

WAFER TO WAFER BONDING METHODS AND WAFER TO WAFER BONDING APPARATUSES

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND BON...

DIE BONDING APPARATUS AND DIE BONDING METHOD

APPARATUS AND METHOD FOR BONDING SUBSTRATES

APPARATUS FOR BOND WAVE PROPAGATION CONTROL

ALIGNMENT MECHANISM, CHUCK DEVICE, AND BONDER

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...

COMPONENT JOINING APPARATUS, COMPONENT JOINING METHOD AND MOUNTED S...

METHOD FOR BONDING WAFERS AND BONDING TOOL

DIE BONDING RESIN LAYER FORMING APPARATUS

LAMINATING STRUCTURE OF ELECTRONIC DEVICE USING TRANSFERRING ELEMEN...

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

ELECTRONIC COMPONENT HANDLING UNIT

VACUUM SUCTION PAD AND SUBSTRATE HOLDER

CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATI...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS