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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip, circuit board and electronic device comprising polygonal pads
- Patent number 12,057,420
- Issue date Aug 6, 2024
- BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Jinfu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having polygonal bonding pad
- Patent number 11,935,851
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,862,586
- Issue date Jan 2, 2024
- Kioxia Corporation
- Mizuki Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,810,881
- Issue date Nov 7, 2023
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to stack structures including passivati...
- Patent number 11,804,460
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, redistribution layer (RDL) structure, and...
- Patent number 11,798,904
- Issue date Oct 24, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure having polygonal bo...
- Patent number 11,776,921
- Issue date Oct 3, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad modification
- Patent number 11,756,911
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and amplifier assembly
- Patent number 11,736,067
- Issue date Aug 22, 2023
- Sumitomo Electric Industries, Ltd.
- Masahiro Tanomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 11,728,296
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and apparatuses having a patterned surface...
- Patent number 11,640,948
- Issue date May 2, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip, circuit board and electronic device
- Patent number 11,600,584
- Issue date Mar 7, 2023
- BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Jinfu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,545,454
- Issue date Jan 3, 2023
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of bond pads on an integrated circuit chip
- Patent number 11,450,635
- Issue date Sep 20, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chia-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,437,334
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,410,946
- Issue date Aug 9, 2022
- Mitsubishi Electric Corporation
- Daisuke Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack structures in electronic devices including passivation layers...
- Patent number 11,257,774
- Issue date Feb 22, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 11,158,591
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for arranging through-silicon vias and pads...
- Patent number 11,081,467
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- Tomohiro Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,011,489
- Issue date May 18, 2021
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices having a patterned surfa...
- Patent number 10,950,564
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including redistribution layer pad having a void
- Patent number 10,916,484
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with non-circular via connections in two orientations
- Patent number 10,879,168
- Issue date Dec 29, 2020
- NXP USA, INC.
- Darrell Glenn Hill
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and amplifier assembly
- Patent number 10,862,433
- Issue date Dec 8, 2020
- Sumitomo Electric Industries, Ltd.
- Masahiro Tanomura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 10,847,485
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 10,811,374
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDUCED-SIZE DIE, RELATED DEVICES AND METHODS
- Publication number 20240371807
- Publication date Nov 7, 2024
- Skyworks Solutions, Inc.
- Junhyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321831
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Insup SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND APPARATUS
- Publication number 20240203972
- Publication date Jun 20, 2024
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014159
- Publication date Jan 11, 2024
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20230352351
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-LUM MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20230309351
- Publication date Sep 28, 2023
- SAMSUNG DISPLAY CO., LTD.
- Soyoung Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Shifting Contact Pad for Reducing Stress
- Publication number 20230275047
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20230215825
- Publication date Jul 6, 2023
- Rohm Co., Ltd.
- Reona TAKEOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND ELECTRIC P...
- Publication number 20230197649
- Publication date Jun 22, 2023
- Mitsubishi Electric Corporation
- Yuji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD
- Publication number 20230178503
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BO...
- Publication number 20230178501
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PARTS
- Publication number 20230102582
- Publication date Mar 30, 2023
- Rohm Co., Ltd.
- Keisuke FUKAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230102799
- Publication date Mar 30, 2023
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220406739
- Publication date Dec 22, 2022
- KIOXIA Corporation
- Mizuki TAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220392858
- Publication date Dec 8, 2022
- Fuji Electric Co., Ltd.
- Tohru SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING ELEMENT
- Publication number 20220376140
- Publication date Nov 24, 2022
- Nichia Corporation.
- Takao MISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220359448
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PADS FOR REDUCED DISHING IN LOW TEMPERATURE ANNEALING AND BONDING
- Publication number 20220352441
- Publication date Nov 3, 2022
- Meta Platforms Technologies, LLC
- Stephan LUTGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...
- Publication number 20220336396
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Jiro YOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP, CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20220013484
- Publication date Jan 13, 2022
- Beijing Xiaomi Mobile Software Co., Ltd.
- Jinfu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP, CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20210305184
- Publication date Sep 30, 2021
- Beijing Xiaomi Mobile Software Co., Ltd.
- Jinfu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, REDISTRIBUTION LAYER (RDL) STRUCTURE, AND...
- Publication number 20210242149
- Publication date Aug 5, 2021
- Changxin Memory Technologies, Inc.
- Ping-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210233882
- Publication date Jul 29, 2021
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND APPARATUSES HAVING A PATTERNED SURFACE...
- Publication number 20210202417
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT OF BOND PADS ON AN INTEGRATED CIRCUIT CHIP
- Publication number 20210167028
- Publication date Jun 3, 2021
- Changxin Memory Technologies, Inc.
- Chia-Chi HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20210066230
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND AMPLIFIER ASSEMBLY
- Publication number 20210058039
- Publication date Feb 25, 2021
- Sumitomo Electric Industries, Ltd.
- Masahiro Tanomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20210050316
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20200357762
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Chan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200235064
- Publication date Jul 23, 2020
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS

in top view

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Chip, circuit board and electronic device comprising polygonal pads

Chip package structure

Semiconductor structure having polygonal bonding pad

Semiconductor device and method of manufacturing the same

Semiconductor device

Devices and methods related to stack structures including passivati...

Semiconductor structure, redistribution layer (RDL) structure, and...

Method of manufacturing semiconductor structure having polygonal bo...

Metal pad modification

Semiconductor device and amplifier assembly

Interconnect structure and method of forming same

Microelectronic devices and apparatuses having a patterned surface...

Chip, circuit board and electronic device

Semiconductor device

Arrangement of bond pads on an integrated circuit chip

Chip package structure

Semiconductor apparatus

Semiconductor chip with patterned underbump metallization and polym...

Interconnect crack arrestor structure and methods

Stack structures in electronic devices including passivation layers...

Bond pad structure for bonding improvement

Apparatuses and methods for arranging through-silicon vias and pads...

Semiconductor device

Methods of forming microelectronic devices having a patterned surfa...

Electronic device including redistribution layer pad having a void

Transistor with non-circular via connections in two orientations

Semiconductor device and amplifier assembly

Chip package structure and method for forming the same

Interconnect structure and method of forming same

Patents Applicationslast 30 patents

REDUCED-SIZE DIE, RELATED DEVICES AND METHODS

SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT AND APPARATUS

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

DISPLAY APPARATUS

Shifting Contact Pad for Reducing Stress

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND ELECTRIC P...

SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BO...

CHIP PARTS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

LIGHT EMITTING ELEMENT

CHIP PACKAGE STRUCTURE

CU PADS FOR REDUCED DISHING IN LOW TEMPERATURE ANNEALING AND BONDING

DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...

CHIP, CIRCUIT BOARD AND ELECTRONIC DEVICE

CHIP, CIRCUIT BOARD AND ELECTRONIC DEVICE

SEMICONDUCTOR STRUCTURE, REDISTRIBUTION LAYER (RDL) STRUCTURE, AND...

SEMICONDUCTOR DEVICE

MICROELECTRONIC DEVICES AND APPARATUSES HAVING A PATTERNED SURFACE...

ARRANGEMENT OF BOND PADS ON AN INTEGRATED CIRCUIT CHIP

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND AMPLIFIER ASSEMBLY

Interconnect Structure and Method of Forming Same

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

SEMICONDUCTOR DEVICE