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H01L2224/13012

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13012in top view

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a barrier layer
- Patent number 11,984,419
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 11,631,648
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and fabrication method thereof, display panel and d...
- Patent number 11,563,036
- Issue date Jan 24, 2023
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Shuai Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with a barrier layer
- Patent number 11,469,203
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shaped interconnect bumps in semiconductor devices
- Patent number 11,444,048
- Issue date Sep 13, 2022
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,437,334
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit (3DIC) with support structures
- Patent number 11,424,194
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conical-shaped or tier-shaped pillar connections
- Patent number 11,315,896
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including embedded conductive elements
- Patent number 11,282,817
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,239,192
- Issue date Feb 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 11,152,322
- Issue date Oct 19, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure including a metal post encapsulated by a...
- Patent number 10,971,463
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 10,957,666
- Issue date Mar 23, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 10,847,485
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 10,833,033
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Hollow metal pillar packaging scheme
- Patent number 10,825,804
- Issue date Nov 3, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a barrier layer and method for forming the same
- Patent number 10,811,377
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,790,250
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongated bump structures in package structure
- Patent number 10,784,223
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with rigid under bump metallurgy (UBM) stack
- Patent number 10,756,040
- Issue date Aug 25, 2020
- Mediatek Inc.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having metal posts for stress relief at flatn...
- Patent number 10,748,863
- Issue date Aug 18, 2020
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor package and related methods
- Patent number 10,748,864
- Issue date Aug 18, 2020
- Semiconductor Components Industries, LLC
- Thomas Fairfax Long
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20240297138
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240282736
- Publication date Aug 22, 2024
- Japan Display Inc.
- Yoichi KAMIJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO BUMP, INTERPOSER FOR ELECTRICAL CONNECTION HAVING SAME, SEMIC...
- Publication number 20240274564
- Publication date Aug 15, 2024
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230378114
- Publication date Nov 23, 2023
- Sony Semiconductor Solutions Corporation
- YUICHI MIYAMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20230253355
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY PANEL
- Publication number 20230112423
- Publication date Apr 13, 2023
- PlayNitride Display Co., Ltd.
- Shiang-Ning YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES
- Publication number 20230012200
- Publication date Jan 12, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PRINTED INTERCONNECTS AND RESONATORS FOR SEMICONDUCTOR DEVICES
- Publication number 20230005870
- Publication date Jan 5, 2023
- MACOM Technology Solutions Holdings, Inc.
- Rathnait Long
- B22 - CASTING POWDER METALLURGY
Information Patent Application
LIGHT EMITTING ELEMENT
- Publication number 20220376140
- Publication date Nov 24, 2022
- Nichia Corporation.
- Takao MISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...
- Publication number 20220367398
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220359448
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20220157755
- Publication date May 19, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframes in Semiconductor Devices
- Publication number 20220037277
- Publication date Feb 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20210313287
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210450
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Molded Leadframes in Semiconductor Devices
- Publication number 20210210453
- Publication date Jul 8, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20210066230
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20210035937
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20210035938
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
ARRAY SUBSTRATE AND FABRICATION METHOD THEREOF, DISPLAY PANEL AND D...
- Publication number 20200411562
- Publication date Dec 31, 2020
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Shuai HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20200357763
- Publication date Nov 12, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20200350271
- Publication date Nov 5, 2020
- Semiconductor Components Industries, LLC
- Thomas Fairfax LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200203300
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hollow Metal Pillar Packaging Scheme
- Publication number 20190341377
- Publication date Nov 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20190326228
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20190326240
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20190295971
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES
- Publication number 20190148326
- Publication date May 16, 2019
- Advanced Semiconductor Engineering, Inc.
- Chih-Pin HUNG
- H01 - BASIC ELECTRIC ELEMENTS

in top view

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bump structure having a side recess and semiconductor structure inc...

Chip package structure

Package structure with a barrier layer

Solderless interconnection structure and method of forming same

Method and system for packing optimization of semiconductor devices

Methods of manufacturing a semiconductor device including a joint a...

Industrial chip scale package for microelectronic device

Bump structure having a side recess and semiconductor structure inc...

Array substrate and fabrication method thereof, display panel and d...

Method for forming package structure with a barrier layer

Shaped interconnect bumps in semiconductor devices

Chip package structure

Three dimensional integrated circuit (3DIC) with support structures

Conical-shaped or tier-shaped pillar connections

Semiconductor device package including embedded conductive elements

Interconnect crack arrestor structure and methods

Method and system for packing optimization of semiconductor devices

Leadframes in semiconductor devices

Solderless interconnection structure and method of forming same

Interconnection structure including a metal post encapsulated by a...

Pre-molded leadframes in semiconductor devices

Chip package structure and method for forming the same

Bump structure having a side recess and semiconductor structure inc...

Hollow metal pillar packaging scheme

Package structure with a barrier layer and method for forming the same

Method for manufacturing semiconductor device

Elongated bump structures in package structure

Semiconductor package with rigid under bump metallurgy (UBM) stack

Semiconductor devices having metal posts for stress relief at flatn...

Bonded semiconductor package and related methods

Patents Applicationslast 30 patents

PACKAGE STRUCTURE WITH A BARRIER LAYER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MICRO BUMP, INTERPOSER FOR ELECTRICAL CONNECTION HAVING SAME, SEMIC...

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

DISPLAY DEVICE

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

MICRO LED DISPLAY PANEL

SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES

3D PRINTED INTERCONNECTS AND RESONATORS FOR SEMICONDUCTOR DEVICES

LIGHT EMITTING ELEMENT

PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...

CHIP PACKAGE STRUCTURE

Method and System for Packing Optimization of Semiconductor Devices

Leadframes in Semiconductor Devices

Solderless Interconnection Structure and Method of Forming Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Pre-Molded Leadframes in Semiconductor Devices

CHIP PACKAGE STRUCTURE

METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

ARRAY SUBSTRATE AND FABRICATION METHOD THEREOF, DISPLAY PANEL AND D...

Method and System for Packing Optimization of Semiconductor Devices

BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Hollow Metal Pillar Packaging Scheme

Interconnect Crack Arrestor Structure and Methods

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

Solderless Interconnection Structure and Method of Forming Same

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES