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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

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Patents Grantslast 30 patents

Information Patent Grant
Guard ring and manufacturing method thereof
- Patent number 12,087,709
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming an apparatus including laminate spacer structures
- Patent number 11,729,964
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Silvia Borsari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide thin film transistor and manufacturing method thereof
- Patent number 11,171,247
- Issue date Nov 9, 2021
- Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including laminate spacer structures, and related memor...
- Patent number 11,164,873
- Issue date Nov 2, 2021
- Micron Technology, Inc.
- Silvia Borsari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-damascene formation with dielectric spacer and thin liner
- Patent number 10,629,478
- Issue date Apr 21, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with dual trench isolation structures at different iso...
- Patent number 10,566,380
- Issue date Feb 18, 2020
- OmniVision Technologies, Inc.
- Young Woo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 10,505,039
- Issue date Dec 10, 2019
- United Microelectronics Corp.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 10,431,679
- Issue date Oct 1, 2019
- United Microelectronics Corp.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via in substrate with deposited layer
- Patent number 9,412,646
- Issue date Aug 9, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure for integrated circuit with reduced intralevel cap...
- Patent number 7,329,602
- Issue date Feb 12, 2008
- International Business Machines Corporation
- Richard S. Wise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning substrate surface
- Patent number 7,111,629
- Issue date Sep 26, 2006
- APL Co., Ltd.
- Jeong-Ho Kim
- B08 - CLEANING
Information Patent Grant
Method for forming a contact in a semiconductor process
- Patent number 6,815,335
- Issue date Nov 9, 2004
- Samsung Electronics Co., Ltd.
- Jae-Seung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for protecting sidewalls of etched openings to prevent via p...
- Patent number 6,602,780
- Issue date Aug 5, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damascene anti-fuse with slot via
- Patent number 6,380,003
- Issue date Apr 30, 2002
- International Business Machines Corporation
- Christopher V. Jahnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing liner insulating layer
- Patent number 6,156,664
- Issue date Dec 5, 2000
- United Semiconductor Corp.
- Jing-Horng Gau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method for forming hole in masked silicon dioxide
- Patent number 6,136,722
- Issue date Oct 24, 2000
- NEC Corporation
- Hidetaka Nambu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capped reflow process to avoid contact autodoping and supress tungs...
- Patent number 5,492,868
- Issue date Feb 20, 1996
- Taiwan Semiconductor Manufacturing Corp. Ltd.
- Ting H. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240429093
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING AND MANUFACTURING METHOD THEREOF
- Publication number 20240379586
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATING METHOD
- Publication number 20240371784
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Ji Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING AND MANUFACTURING METHOD THEREOF
- Publication number 20220344284
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING AN APPARATUS INCLUDING LAMINATE SPACER STRUCTURES
- Publication number 20220020748
- Publication date Jan 20, 2022
- Micron Technology, Inc.
- Silvia Borsari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF
- Publication number 20210184017
- Publication date Jun 17, 2021
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Wei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench Isolation for Image Sensors
- Publication number 20190115388
- Publication date Apr 18, 2019
- OMNIVISION TECHNOLOGIES, INC.
- Young Woo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-DAMASCENE FORMATION WITH DIELECTRIC SPACER AND THIN LINER
- Publication number 20190067087
- Publication date Feb 28, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20180342613
- Publication date Nov 29, 2018
- UNITED MICROELECTRONICS CORP.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA IN SUBSTRATE WITH DEPOSITED LAYER
- Publication number 20150140815
- Publication date May 21, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA IN SUBSTRATE WITH DEPOSITED LAYER
- Publication number 20140027922
- Publication date Jan 30, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacture thereof
- Publication number 20070181954
- Publication date Aug 9, 2007
- Kota Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming metal wiring in a semiconductor device
- Publication number 20070077755
- Publication date Apr 5, 2007
- Ji Ho Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a semiconductor device having a stepped co...
- Publication number 20070077774
- Publication date Apr 5, 2007
- Elpida Memory, Inc.
- Kazuyoshi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing an integrated semiconductor device
- Publication number 20070069327
- Publication date Mar 29, 2007
- Infineon Technologies AG
- Stefan Tegen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming contact hole in semiconductor device
- Publication number 20070015356
- Publication date Jan 18, 2007
- Min-Suk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for cleaning substrate surface
- Publication number 20060157079
- Publication date Jul 20, 2006
- Jeong-Ho Kim
- B08 - CLEANING
Information Patent Application
Wiring structure for integrated circuit with reduced intralevel cap...
- Publication number 20060035460
- Publication date Feb 16, 2006
- Richard S. Wise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dry etching method using polymer mask selectively formed by CO gas
- Publication number 20060024971
- Publication date Feb 2, 2006
- SAMSUNG ELECTRONICS CO., LTD.
- Wan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE FOR INTEGRATED CIRCUIT WITH REDUCED INTRALEVEL CAP...
- Publication number 20050239284
- Publication date Oct 27, 2005
- International Business Machines Corporation
- Richard S. Wise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for cleaning substrate surface
- Publication number 20050014375
- Publication date Jan 20, 2005
- Jeong-Ho Kim
- B08 - CLEANING
Information Patent Application
Method for forming a contact in a semiconductor process
- Publication number 20040038524
- Publication date Feb 26, 2004
- Samsung Electronics Co., Ltd.
- Jae-Seung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for protecting sidewalls of etched openings to prevent via p...
- Publication number 20030045124
- Publication date Mar 6, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsu Shih
- H01 - BASIC ELECTRIC ELEMENTS

in via holes or trenches

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Guard ring and manufacturing method thereof

Methods of forming an apparatus including laminate spacer structures

Metal oxide thin film transistor and manufacturing method thereof

Apparatuses including laminate spacer structures, and related memor...

Dual-damascene formation with dielectric spacer and thin liner

Image sensor with dual trench isolation structures at different iso...

Semiconductor device and method for forming the same

Semiconductor device and method for forming the same

Via in substrate with deposited layer

Wiring structure for integrated circuit with reduced intralevel cap...

Method for cleaning substrate surface

Method for forming a contact in a semiconductor process

Method for protecting sidewalls of etched openings to prevent via p...

Damascene anti-fuse with slot via

Method of manufacturing liner insulating layer

Plasma etching method for forming hole in masked silicon dioxide

Capped reflow process to avoid contact autodoping and supress tungs...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

GUARD RING AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE FABRICATING METHOD

GUARD RING AND MANUFACTURING METHOD THEREOF

METHODS OF FORMING AN APPARATUS INCLUDING LAMINATE SPACER STRUCTURES

METAL OXIDE THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF

Trench Isolation for Image Sensors

DUAL-DAMASCENE FORMATION WITH DIELECTRIC SPACER AND THIN LINER

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

VIA IN SUBSTRATE WITH DEPOSITED LAYER

VIA IN SUBSTRATE WITH DEPOSITED LAYER

Semiconductor device and method of manufacture thereof

Method of forming metal wiring in a semiconductor device

Method for manufacturing a semiconductor device having a stepped co...

Method for manufacturing an integrated semiconductor device

Method for forming contact hole in semiconductor device

Method for cleaning substrate surface

Wiring structure for integrated circuit with reduced intralevel cap...

Dry etching method using polymer mask selectively formed by CO gas

WIRING STRUCTURE FOR INTEGRATED CIRCUIT WITH REDUCED INTRALEVEL CAP...

Method for cleaning substrate surface

Method for forming a contact in a semiconductor process

Method for protecting sidewalls of etched openings to prevent via p...