in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Industry

CPC
H05K3/02

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit board
- Patent number 12,177,978
- Issue date Dec 24, 2024
- Toppan Printing Co., Ltd.
- Jun Onohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-treated copper foil and copper clad laminate
- Patent number 12,168,834
- Issue date Dec 17, 2024
- Chang Chun Petrochemical Co., Ltd.
- Jian-Ming Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal foil with carrier and preparation method thereof
- Patent number 12,167,533
- Issue date Dec 10, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 12,167,544
- Issue date Dec 10, 2024
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Communication cable including a mosaic tape
- Patent number 12,142,390
- Issue date Nov 12, 2024
- Panduit Corp.
- Royal O. Jenner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel mechanism and winding device for flexible copper clad laminate
- Patent number 12,120,828
- Issue date Oct 15, 2024
- AAC Technologies (Nanjing) Co., Ltd.
- Rui Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, film with resin, metal foil with resin,...
- Patent number 12,098,257
- Issue date Sep 24, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirosuke Saito
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for delivering power to semiconductors
- Patent number 12,088,208
- Issue date Sep 10, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-coated liquid-crystal polymer film
- Patent number 12,089,327
- Issue date Sep 10, 2024
- Kuraray Co., Ltd.
- Kikuo Arimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board producing apparatus
- Patent number 12,075,569
- Issue date Aug 27, 2024
- FUJIFILM Business Innovation Corp.
- Yasuo Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated film structure and method for manufacturing laminated fil...
- Patent number 12,069,809
- Issue date Aug 20, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuya Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface-treated copper foil, copper-clad laminate and printed wirin...
- Patent number 12,063,747
- Issue date Aug 13, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a metal-ceramic substrate, and metal-ceramic s...
- Patent number 12,058,816
- Issue date Aug 6, 2024
- Rogers Germany GmbH
- Andreas Meyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed circuit board
- Patent number 12,016,119
- Issue date Jun 18, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, resin sheet, laminate, and printed...
- Patent number 12,006,433
- Issue date Jun 11, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kouichi Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible interconnect circuits and methods of fabrication thereof
- Patent number 12,010,792
- Issue date Jun 11, 2024
- CelLink Corporation
- Jean-Paul Ortiz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Wiring board
- Patent number 11,979,981
- Issue date May 7, 2024
- Kyocera Corporation
- Takayuki Umemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-clad laminate
- Patent number 11,950,376
- Issue date Apr 2, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshihiro Hosoi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board for transmitting high-frequency signal and method for...
- Patent number 11,950,357
- Issue date Apr 2, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of high-resolution graphene-based flexible electronics...
- Patent number 11,938,708
- Issue date Mar 26, 2024
- lowa State University Research Foundation, Inc.
- Metin Uz
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,930,589
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yoshihiko Hayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stretchable electronics and methods of making the same
- Patent number 11,923,103
- Issue date Mar 5, 2024
- Carnegie Mellon University
- Carmel Majidi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic device housings with patterned electrolytic plating layers
- Patent number 11,910,538
- Issue date Feb 20, 2024
- Hewlett-Packard Development Company, L.P.
- Yi-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,908,768
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,903,138
- Issue date Feb 13, 2024
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optimization of high resolution digitally encoded laser scanners fo...
- Patent number 11,888,084
- Issue date Jan 30, 2024
- nLIGHT, Inc.
- Ken Gross
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for manufacturing ultrasound transducers and other components
- Patent number 11,845,108
- Issue date Dec 19, 2023
- FUJIFILM SonoSite, Inc.
- N. Christopher Chaggares
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Metal-clad laminate, printed circuit board, and method for manufact...
- Patent number 11,840,047
- Issue date Dec 12, 2023
- Taiwan Union Technology Corporation
- Shi-Ing Huang
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS
- Publication number 20240407105
- Publication date Dec 5, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...
- Publication number 20240365473
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIEN LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE AND PRINTED WIRING BOARD
- Publication number 20240349422
- Publication date Oct 17, 2024
- SONY GROUP CORPORATION
- Kenji UEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...
- Publication number 20240329525
- Publication date Oct 3, 2024
- Asahi Kasei Kabushiki Kaisha
- Tomohiro YORISUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, META...
- Publication number 20240301173
- Publication date Sep 12, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Kouichi AOKI
- B32 - LAYERED PRODUCTS
Information Patent Application
Flexible Interconnect Circuits And Methods Of Fabrication Thereof
- Publication number 20240292527
- Publication date Aug 29, 2024
- CelLink Corporation
- Jean-Paul Ortiz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD EMBEDDED WITH WAF...
- Publication number 20240292544
- Publication date Aug 29, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Seon-Kyu CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and manufacturing method thereof
- Publication number 20240274543
- Publication date Aug 15, 2024
- InnoLux Corporation
- Yan-Tang DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...
- Publication number 20240276636
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240268027
- Publication date Aug 8, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Stanley Buchert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD
- Publication number 20240260177
- Publication date Aug 1, 2024
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME
- Publication number 20240260182
- Publication date Aug 1, 2024
- Kabushiki Kaisha Toshiba
- Hiromasa KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad...
- Publication number 20240244755
- Publication date Jul 18, 2024
- Qiang GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for preparing novel material layer structure of high-frequen...
- Publication number 20240244757
- Publication date Jul 18, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRIN...
- Publication number 20240215172
- Publication date Jun 27, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROLL FILM, METHOD FOR PRODUCING ROLL FILM, METHOD FOR PRODUCING COP...
- Publication number 20240199829
- Publication date Jun 20, 2024
- AGC Inc.
- Seigo KOTERA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
TRANSPARENT CONDUCTING FILM AND METHOD FOR FORMING TRANSPARENT COND...
- Publication number 20240188220
- Publication date Jun 6, 2024
- Resonac Corporation
- Shigeru YAMAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A PROCESS FOR ELECTROCHEMICAL DEPOSITION OF COPPER WITH DIFFERENT C...
- Publication number 20240183052
- Publication date Jun 6, 2024
- Atotech Deutschland GmbH & Co. KG
- Peter HAACK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...
- Publication number 20240147629
- Publication date May 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHANG-HE ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL RESIDUE REMOVING LIQUID, METAL RESIDUE REMOVING METHOD, AND M...
- Publication number 20240117280
- Publication date Apr 11, 2024
- Tokyo Ohka Kogyo Co., Ltd.
- Ivan Ryzhii
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
AUTOMATIC PROCESSING METHOD FOR PRINTED CIRCUIT BOARD DATA AND ELEC...
- Publication number 20240114624
- Publication date Apr 4, 2024
- ISCOOLLAB CO., LTD.
- YAN-MEI JIANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBTRACTIVE METHOD FOR MANUFACTURING CIRCUIT BOARD WITH FINE INTERC...
- Publication number 20240107680
- Publication date Mar 28, 2024
- HSU-TUNG CHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PREPREG WITH METAL LAYER, METHOD FOR MANUFACTURING LAMINATE, AND ME...
- Publication number 20240090138
- Publication date Mar 14, 2024
- Beji SASAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME
- Publication number 20240090137
- Publication date Mar 14, 2024
- SKC CO., LTD.
- Il Hwan YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20240090139
- Publication date Mar 14, 2024
- LX Semicon Co., Ltd.
- Jun Ho LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MATERIAL DEPOSITION METHOD AND MATERIAL DEPOSITION APPARATUS
- Publication number 20240066550
- Publication date Feb 29, 2024
- Intel Corporation
- Fanyi ZHU
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20240057255
- Publication date Feb 15, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Stanley Buchert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCIN...
- Publication number 20240057263
- Publication date Feb 15, 2024
- Resonac Corporation
- Masaya TOBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEMS FOR COLD FORMING FEATURES ON FLEX CIRCUITS
- Publication number 20240057250
- Publication date Feb 15, 2024
- Koninklijke Philips N.V.
- FRANCIS KUSTI MAKIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board

Surface-treated copper foil and copper clad laminate

Metal foil with carrier and preparation method thereof

Wiring circuit board, producing method thereof, and wiring circuit...

Communication cable including a mosaic tape

Reel mechanism and winding device for flexible copper clad laminate

Resin composition, prepreg, film with resin, metal foil with resin,...

Method and apparatus for delivering power to semiconductors

Metal-coated liquid-crystal polymer film

Circuit board producing apparatus

Laminated film structure and method for manufacturing laminated fil...

Surface-treated copper foil, copper-clad laminate and printed wirin...

Method for producing a metal-ceramic substrate, and metal-ceramic s...

Method for manufacturing multilayer printed circuit board

Thermosetting resin composition, resin sheet, laminate, and printed...

Flexible interconnect circuits and methods of fabrication thereof

Flexible laminated board and multilayer circuit board

Wiring board

Printed circuit board structure including a closed cavity

Copper-clad laminate

Circuit board for transmitting high-frequency signal and method for...

Fabrication of high-resolution graphene-based flexible electronics...

Printed wiring board and method for manufacturing the same

Stretchable electronics and methods of making the same

Electronic device housings with patterned electrolytic plating layers

Method of manufacturing bonded body for insulation circuit substrat...

Fine feature formation techniques for printed circuit boards

Optimization of high resolution digitally encoded laser scanners fo...

Methods for manufacturing ultrasound transducers and other components

Metal-clad laminate, printed circuit board, and method for manufact...

Patents Applicationslast 30 patents

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS

METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...

COPPER CLAD LAMINATE AND PRINTED WIRING BOARD

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...

THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, META...

Flexible Interconnect Circuits And Methods Of Fabrication Thereof

METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD EMBEDDED WITH WAF...

Electronic device and manufacturing method thereof

CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...

CIRCUIT BOARD

METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD

CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME

Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad...

Method for preparing novel material layer structure of high-frequen...

SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRIN...

ROLL FILM, METHOD FOR PRODUCING ROLL FILM, METHOD FOR PRODUCING COP...

TRANSPARENT CONDUCTING FILM AND METHOD FOR FORMING TRANSPARENT COND...

A PROCESS FOR ELECTROCHEMICAL DEPOSITION OF COPPER WITH DIFFERENT C...

CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...

METAL RESIDUE REMOVING LIQUID, METAL RESIDUE REMOVING METHOD, AND M...

AUTOMATIC PROCESSING METHOD FOR PRINTED CIRCUIT BOARD DATA AND ELEC...

SUBTRACTIVE METHOD FOR MANUFACTURING CIRCUIT BOARD WITH FINE INTERC...

PREPREG WITH METAL LAYER, METHOD FOR MANUFACTURING LAMINATE, AND ME...

SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

MATERIAL DEPOSITION METHOD AND MATERIAL DEPOSITION APPARATUS

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY

METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCIN...

METHOD AND SYSTEMS FOR COLD FORMING FEATURES ON FLEX CIRCUITS