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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/535including internal interconnections

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit in hybrid row height structure
- Patent number 12,369,389
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jerry Chang-Jui Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device and electronic system...
- Patent number 12,369,324
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Seung Yoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial layers in source/drain contacts and methods of forming th...
- Patent number 12,369,386
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ding-Kang Shih
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for depositing a Group IV semiconductor and related semicond...
- Patent number 12,363,960
- Issue date Jul 15, 2025
- ASM IP Holding B.V.
- Joe Margetis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
- Patent number 12,362,281
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device and electronic system...
- Patent number 12,363,904
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Giyong Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,280
- Issue date Jul 15, 2025
- Renesas Electronics Corporation
- Takeshi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate process and related structure
- Patent number 12,362,238
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Lun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier free interface between BEOL interconnects
- Patent number 12,362,235
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of performing chemical-mechanical polishing process in semi...
- Patent number 12,362,233
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,356,611
- Issue date Jul 8, 2025
- SK Hynix Inc.
- Sung Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor with contact via structures that are latera...
- Patent number 12,356,704
- Issue date Jul 8, 2025
- SanDisk Technologies, Inc.
- Kouta Onogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-doped trenches for memory
- Patent number 12,354,912
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structures
- Patent number 12,354,953
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,354,961
- Issue date Jul 8, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout for reducing loading at line sockets and/or for increasing o...
- Patent number 12,354,951
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard cell layout for better routability
- Patent number 12,354,962
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tigran Zohrabyan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices including capacitor electrodes
- Patent number 12,356,626
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Seungmin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device including separation...
- Patent number 12,354,960
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Haemin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a data storage system including the same
- Patent number 12,347,777
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Jaeshin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing variable thickness word...
- Patent number 12,347,773
- Issue date Jul 1, 2025
- SanDisk Technologies, Inc.
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device including source/drain...
- Patent number 12,349,437
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Byungeun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic system including the same
- Patent number 12,347,778
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Kyunghwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gates of transistors having reduced resistivity
- Patent number 12,347,729
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with source line isolation and meth...
- Patent number 12,347,779
- Issue date Jul 1, 2025
- SanDisk Technologies, Inc.
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and manufacturing method thereof
- Patent number 12,341,102
- Issue date Jun 24, 2025
- Kioxia Corporation
- Yusuke Oshiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of manufacturing same
- Patent number 12,341,103
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pochun Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,341,013
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric gate structures and contacts for stacked transistors
- Patent number 12,342,614
- Issue date Jun 24, 2025
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method for forming the same
- Patent number 12,342,541
- Issue date Jun 24, 2025
- Macronix International Co., Ltd.
- Erh-Kun Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250240972
- Publication date Jul 24, 2025
- KIOXIA Corporation
- Hidenobu NAGASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACTS
- Publication number 20250239486
- Publication date Jul 24, 2025
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250240969
- Publication date Jul 24, 2025
- SK HYNIX INC.
- Jae Seok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING SELF-ALIGNED CONDUCTIVE CONTACTS
- Publication number 20250239485
- Publication date Jul 24, 2025
- Micron Technology, Inc.
- Kar Wui Thong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Different Via Configurations for Different Via Interface Requirements
- Publication number 20250239527
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Che Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250234642
- Publication date Jul 17, 2025
- KIOXIA Corporation
- Tomoya INDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCT...
- Publication number 20250220912
- Publication date Jul 3, 2025
- SK HYNIX INC.
- Jang Won KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCT...
- Publication number 20250220911
- Publication date Jul 3, 2025
- SK HYNIX INC.
- Jang Won KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250218950
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Jongsoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20250218951
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Seungjun SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSTRUCTURE FIELD-EFFECT TRANSISTOR DEVICE AND METHODS OF FORMING
- Publication number 20250212437
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Ging Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP INCLUDING GATE ELECTRODE WITH OBLIQUE CUT S...
- Publication number 20250210526
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Inyeal LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH BURIED ELECTRICAL INTERCONNECTIONS
- Publication number 20250210463
- Publication date Jun 26, 2025
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT FORMED USING BOTTOM-...
- Publication number 20250203976
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOURCE RESISTOR
- Publication number 20250201704
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Zeng KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH A NITRIDED CAPPING LAYER
- Publication number 20250201630
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND PACKAGE INCLUDING INDUCTOR AND VERTICAL INTE...
- Publication number 20250201702
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sangwook HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS THEREOF WITH SELECTIVELY FORMED I...
- Publication number 20250201719
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE OF A SEMICONDUCTOR DEVICE
- Publication number 20250201627
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC VIA BAR UNDER POWER RAIL
- Publication number 20250192046
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192073
- Publication date Jun 12, 2025
- SK HYNIX INC.
- Yeo Jin JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192058
- Publication date Jun 12, 2025
- Fuji Electric Co., Ltd.
- Atsushi ONOGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...
- Publication number 20250183196
- Publication date Jun 5, 2025
- Lodestar Licensing Group LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES FOR THREE-DIMENSIONAL MEMORY
- Publication number 20250183177
- Publication date Jun 5, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhongwang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20250169072
- Publication date May 22, 2025
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250167124
- Publication date May 22, 2025
- WINBOND ELECTRONICS CORP.
- Meng-Wei Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Forming Backside Power Rails
- Publication number 20250157851
- Publication date May 15, 2025
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Loss Prevention In Conductive Structures
- Publication number 20250157919
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE HAVING WORD LINES SURROUNDED BY MEMORY...
- Publication number 20250149453
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENGINEERED SUBSTRATE STRUCTURES FOR POWER AND RF APPLICATIONS
- Publication number 20250149332
- Publication date May 8, 2025
- QROMIS, Inc.
- Vladimir Odnoblyudov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

including internal interconnections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit in hybrid row height structure

Three-dimensional semiconductor memory device and electronic system...

Epitaxial layers in source/drain contacts and methods of forming th...

Method for depositing a Group IV semiconductor and related semicond...

Partial barrier free vias for cobalt-based interconnects and method...

Three-dimensional semiconductor memory device and electronic system...

Semiconductor device and method of manufacturing the same

Metal gate process and related structure

Barrier free interface between BEOL interconnects

Methods of performing chemical-mechanical polishing process in semi...

Semiconductor device and method for fabricating the same

Field effect transistor with contact via structures that are latera...

Plasma-doped trenches for memory

Via structures

Semiconductor structure and manufacturing method thereof

Layout for reducing loading at line sockets and/or for increasing o...

Standard cell layout for better routability

Semiconductor devices including capacitor electrodes

Three-dimensional semiconductor memory device including separation...

Semiconductor device and a data storage system including the same

Three-dimensional memory device containing variable thickness word...

Method of fabricating a semiconductor device including source/drain...

Semiconductor device and electronic system including the same

Metal gates of transistors having reduced resistivity

Three-dimensional memory device with source line isolation and meth...

Semiconductor storage device and manufacturing method thereof

Integrated circuit and method of manufacturing same

Method and structure for barrier-less plug

Asymmetric gate structures and contacts for stacked transistors

Memory device and method for forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR MEMORY DEVICE

SELF-ALIGNED CONTACTS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MEMORY DEVICE INCLUDING SELF-ALIGNED CONDUCTIVE CONTACTS

Different Via Configurations for Different Via Interface Requirements

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCT...

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCT...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Semiconductor Device

NANOSTRUCTURE FIELD-EFFECT TRANSISTOR DEVICE AND METHODS OF FORMING

INTEGRATED CIRCUIT CHIP INCLUDING GATE ELECTRODE WITH OBLIQUE CUT S...

SEMICONDUCTOR DIE WITH BURIED ELECTRICAL INTERCONNECTIONS

SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT FORMED USING BOTTOM-...

SEMICONDUCTOR DEVICE WITH SOURCE RESISTOR

SEMICONDUCTOR DEVICES WITH A NITRIDED CAPPING LAYER

INTEGRATED CIRCUIT AND PACKAGE INCLUDING INDUCTOR AND VERTICAL INTE...

SEMICONDUCTOR DEVICES AND METHODS THEREOF WITH SELECTIVELY FORMED I...

CONDUCTIVE FEATURE OF A SEMICONDUCTOR DEVICE

ASYMMETRIC VIA BAR UNDER POWER RAIL

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...

CONTACT STRUCTURES FOR THREE-DIMENSIONAL MEMORY

Integrated Assemblies, and Methods of Forming Integrated Assemblies

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Method and Apparatus for Forming Backside Power Rails

Metal Loss Prevention In Conductive Structures

SEMICONDUCTOR MEMORY DEVICE HAVING WORD LINES SURROUNDED BY MEMORY...

ENGINEERED SUBSTRATE STRUCTURES FOR POWER AND RF APPLICATIONS