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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/535including internal interconnections

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Patents Grantslast 30 patents

Information Patent Grant
Contact features of semiconductor device and method of forming same
- Patent number 12,272,600
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source resistor
- Patent number 12,272,640
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Zeng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature of a semiconductor device
- Patent number 12,272,598
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistance measuring structures of stacked devices
- Patent number 12,274,092
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked FET sidewall strap connections between gates
- Patent number 12,274,089
- Issue date Apr 8, 2025
- International Business Machines Corporation
- Chen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, a memory array comprising strings of memory c...
- Patent number 12,266,569
- Issue date Apr 1, 2025
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parasitic capacitance reduction in GaN-on-silicon devices
- Patent number 12,266,523
- Issue date Apr 1, 2025
- MACOM Technology Solutions Holdings, Inc.
- Gabriel R. Cueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source/drain contact formed using bottom-...
- Patent number 12,266,688
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contacts
- Patent number 12,266,571
- Issue date Apr 1, 2025
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) semiconductor memory device and electronic s...
- Patent number 12,261,120
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Haemin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,261,130
- Issue date Mar 25, 2025
- SK hynix Inc.
- Yeo Jin Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with a nitrided capping layer
- Patent number 12,261,082
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices by etching active fi...
- Patent number 12,261,087
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Min-Chul Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure and method for a low-k dielectric with pillar-type air-gaps
- Patent number 12,261,121
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with etch stop layers for advan...
- Patent number 12,261,122
- Issue date Mar 25, 2025
- Intel Corporation
- Atul Madhavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 12,255,141
- Issue date Mar 18, 2025
- SOCIONEXT INC.
- Hideyuki Komuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,249,578
- Issue date Mar 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having backside gate contact
- Patent number 12,243,823
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method of manufacturing the same
- Patent number 12,243,818
- Issue date Mar 4, 2025
- SK hynix Inc.
- Jin Ha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a buried metal line in a semiconductor substrate
- Patent number 12,237,207
- Issue date Feb 25, 2025
- Imec VZW
- Boon Teik Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,237,224
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co. LTD
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including middle-of-line (MOL) capacitance...
- Patent number 12,237,368
- Issue date Feb 25, 2025
- Adeia Semiconductor Solutions LLC
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal bonding pads for underfill application in semiconductor...
- Patent number 12,232,307
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing RC delay in semiconductor devices
- Patent number 12,230,574
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including a power rail and methods of fo...
- Patent number 12,230,571
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Gilhwan Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of integrated circuit semiconductor device
- Patent number 12,230,568
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jungha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and data storage system including the same
- Patent number 12,230,573
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Seyong Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,224,242
- Issue date Feb 11, 2025
- Kioxia Corporation
- Natsuki Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symmetric dual-sided MOS IC
- Patent number 12,224,286
- Issue date Feb 11, 2025
- QUALCOMM Incorporated
- Ravi Pramod Kumar Vedula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array contact structures
- Patent number 12,225,731
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Yu Chang
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
CONTACT STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...
- Publication number 20250112159
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...
- Publication number 20250112158
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250105057
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buffer and Inverter Transistors Embedded in Interconnect Metal Layers
- Publication number 20250105134
- Publication date Mar 27, 2025
- Apple Inc.
- Xin Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES, METHODS FOR FABRICATING THE SAME AND...
- Publication number 20250105155
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Geun Won Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACT FOR FIELD EFFECT TRANSISTORS
- Publication number 20250105061
- Publication date Mar 27, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE INCLUDING WIRING CONTACT PLUGS
- Publication number 20250096141
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Yonghyeok SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION
- Publication number 20250096041
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250096038
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays and Methods Used in Forming a Memory Array Comprising...
- Publication number 20250096042
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER WAFER WITH LOW OVERLAY RESIDUAL BACKSIDE PATTERNING
- Publication number 20250087527
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Prabudhya Roy Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP HAVING A BURIED POWER RAIL
- Publication number 20250079318
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Marcus Johannes Henricus VAN DAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...
- Publication number 20250070029
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...
- Publication number 20250062193
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Jeonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
- Publication number 20250056808
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Giyong CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE BOTTOM-UP METAL FILL/CAP ON JUNCTION SILICIDE BY SELECTIV...
- Publication number 20250054812
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Qihao ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR DEVICE WITH V2V RAIL
- Publication number 20250046719
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH BACKSIDE GATE CONTACTS AND METHODS OF FA...
- Publication number 20250046718
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY WITH NEGATIVE SLOPED SIDEWALL OVER GATE AND RELATED METHOD
- Publication number 20250038047
- Publication date Jan 30, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Anthony J. Villalon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TRANSISTOR LOCAL INTERCONNECTS
- Publication number 20250038111
- Publication date Jan 30, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Mahbub Rashed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BACKSIDE GATE CONTACT
- Publication number 20250029925
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...
- Publication number 20250029945
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20250031366
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...
- Publication number 20250029926
- Publication date Jan 23, 2025
- Intel Corporation
- Bernhard SELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH REDUCED CAP
- Publication number 20250022936
- Publication date Jan 16, 2025
- Intel Corporation
- Seung Hoon SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Structures Of Integrated Circuits
- Publication number 20250022802
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu Pei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250015162
- Publication date Jan 9, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONNECTION STRUCTURES FOR NANOSTRUCTURES AND METHODS OF FO...
- Publication number 20250014993
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20250015015
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- He CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250014652
- Publication date Jan 9, 2025
- KIOXIA Corporation
- Wataru MORIYAMA
- G11 - INFORMATION STORAGE

including internal interconnections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contact features of semiconductor device and method of forming same

Semiconductor device with source resistor

Conductive feature of a semiconductor device

Resistance measuring structures of stacked devices

Stacked FET sidewall strap connections between gates

Integrated circuitry, a memory array comprising strings of memory c...

Parasitic capacitance reduction in GaN-on-silicon devices

Semiconductor device with source/drain contact formed using bottom-...

Self-aligned contacts

Three-dimensional (3D) semiconductor memory device and electronic s...

Semiconductor device

Semiconductor devices with a nitrided capping layer

Methods of manufacturing semiconductor devices by etching active fi...

Structure and method for a low-k dielectric with pillar-type air-gaps

Contact over active gate structures with etch stop layers for advan...

Semiconductor integrated circuit device

Semiconductor package structure and method for manufacturing the same

Semiconductor device having backside gate contact

Memory device and method of manufacturing the same

Method for forming a buried metal line in a semiconductor substrate

Semiconductor device and method

Semiconductor structures including middle-of-line (MOL) capacitance...

Dummy metal bonding pads for underfill application in semiconductor...

Reducing RC delay in semiconductor devices

Integrated circuit devices including a power rail and methods of fo...

Interconnection structure of integrated circuit semiconductor device

Semiconductor device and data storage system including the same

Semiconductor memory device

Symmetric dual-sided MOS IC

Memory array contact structures

Patents Applicationslast 30 patents

CONTACT STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...

CONTACT STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Buffer and Inverter Transistors Embedded in Interconnect Metal Layers

SEMICONDUCTOR MEMORY DEVICES, METHODS FOR FABRICATING THE SAME AND...

SELF-ALIGNED CONTACT FOR FIELD EFFECT TRANSISTORS

SEMICONDUCTOR MEMORY DEVICE INCLUDING WIRING CONTACT PLUGS

BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Memory Arrays and Methods Used in Forming a Memory Array Comprising...

HANDLER WAFER WITH LOW OVERLAY RESIDUAL BACKSIDE PATTERNING

INTEGRATED CHIP HAVING A BURIED POWER RAIL

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...

SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME

SELECTIVE BOTTOM-UP METAL FILL/CAP ON JUNCTION SILICIDE BY SELECTIV...

METHOD OF MAKING A SEMICONDUCTOR DEVICE WITH V2V RAIL

SEMICONDUCTOR DEVICES WITH BACKSIDE GATE CONTACTS AND METHODS OF FA...

CAVITY WITH NEGATIVE SLOPED SIDEWALL OVER GATE AND RELATED METHOD

SEMICONDUCTOR DEVICE WITH TRANSISTOR LOCAL INTERCONNECTS

SEMICONDUCTOR DEVICE HAVING BACKSIDE GATE CONTACT

SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...

STAIRCASE STRUCTURE FOR MEMORY DEVICE

METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...

SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH REDUCED CAP

Conductive Structures Of Integrated Circuits

SEMICONDUCTOR DEVICE

BACKSIDE CONNECTION STRUCTURES FOR NANOSTRUCTURES AND METHODS OF FO...

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

SEMICONDUCTOR MEMORY DEVICE