including internal interconnections

Industry

CPC
H01L23/535

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/535including internal interconnections

Industries

Patents Grantslast 30 patents

Information Patent Grant
Through array contact structure of three-dimensional memory device
- Patent number 12,185,550
- Issue date Dec 31, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including wiring contact plugs
- Patent number 12,183,680
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Yonghyeok Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through-silicon via and method of fo...
- Patent number 12,183,660
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Jeonil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having dummy structures in a peripheral region...
- Patent number 12,185,548
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Giyong Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming fin field effect transistor (FinFET) device stru...
- Patent number 12,176,435
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,290
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sungyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,176,350
- Issue date Dec 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kui Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method thereof
- Patent number 12,167,603
- Issue date Dec 10, 2024
- SK hynix Inc.
- Sung Wook Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon on insulator semiconductor device with mixed doped regions
- Patent number 12,166,130
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jack Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor device including a through-via stru...
- Patent number 12,165,976
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including epitaxial patterns with plurality o...
- Patent number 12,166,093
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Sun Ki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and method for forming the same
- Patent number 12,165,947
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangements for integrated lateral diffusion field effe...
- Patent number 12,159,815
- Issue date Dec 3, 2024
- Silanna Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiered-profile contact for semiconductor
- Patent number 12,148,663
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a trench having a high aspect rat...
- Patent number 12,148,654
- Issue date Nov 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with transistor local interconnects
- Patent number 12,148,702
- Issue date Nov 19, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Mahbub Rashed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked trench contacts and structures formed the...
- Patent number 12,142,566
- Issue date Nov 12, 2024
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure having air gap and method of...
- Patent number 12,142,520
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Different via configurations for different via interface requirements
- Patent number 12,142,565
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Che Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating pedestal based memory devices using pocket in...
- Patent number 12,142,310
- Issue date Nov 12, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned buried power rail
- Patent number 12,142,516
- Issue date Nov 12, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas V. Licausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure for memory device
- Patent number 12,137,558
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 12,136,599
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,132,000
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,132,001
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Yong Kong Siew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor device
- Patent number 12,127,402
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Sung Min Hwang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and forming method thereof
- Patent number 12,125,896
- Issue date Oct 22, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and electronic systems including the same
- Patent number 12,125,791
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Jeeyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,125,542
- Issue date Oct 22, 2024
- Kioxia Corporation
- Wataru Moriyama
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250006641
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Yoon Hee KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...
- Publication number 20250006665
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429163
- Publication date Dec 26, 2024
- SK HYNIX INC.
- Dong Hyuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTION LINERS AND AIR GAPS AND METHOD...
- Publication number 20240429171
- Publication date Dec 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Te-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED SELF-ALIGNED BACKSIDE CONTACT
- Publication number 20240429098
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Albert M. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACKSIDE CONTACT
- Publication number 20240429097
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Apparatus And Oscillator
- Publication number 20240421091
- Publication date Dec 19, 2024
- SEIKO EPSON CORPORATION
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION WITH BACKSIDE POWER PLANES
- Publication number 20240421088
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF
- Publication number 20240421090
- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Seo Woo Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYERS FOR WORD LINE CONTACTS IN A THREE-DIMENSIONAL NAND M...
- Publication number 20240413009
- Publication date Dec 12, 2024
- Yangtze Memory Technologies Co., Ltd.
- Ling XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Publication number 20240413016
- Publication date Dec 12, 2024
- Intel Corporation
- Sridhar GOVINDARAJU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELF-ALIGNED BACKSIDE CONTACT WITH PROTRUDING SOURCE/DRAIN
- Publication number 20240413201
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240405020
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ARRAY CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20240407172
- Publication date Dec 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240404876
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kan-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE
- Publication number 20240395622
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jerry Chang-Jui KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND...
- Publication number 20240395618
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...
- Publication number 20240387658
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
- Publication number 20240387372
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387265
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240387495
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Minwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387268
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED CIRCUIT DIES
- Publication number 20240379462
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Shyang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...
- Publication number 20240379433
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...
- Publication number 20240381605
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih YEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION METHOD AND RELATED STRUCTURE
- Publication number 20240379432
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Che LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20240379562
- Publication date Nov 14, 2024
- Macronix International Co., Ltd.
- Ya-Chun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR AN INTERCONNECT STRUCTURE
- Publication number 20240379423
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379431
- Publication date Nov 14, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chia-Hao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING RC DELAY IN SEMICONDUCTOR DEVICES
- Publication number 20240379563
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS

including internal interconnections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Through array contact structure of three-dimensional memory device

Semiconductor memory device including wiring contact plugs

Semiconductor device including through-silicon via and method of fo...

Bottom lateral expansion of contact plugs through implantation

Semiconductor device having dummy structures in a peripheral region...

Method for forming fin field effect transistor (FinFET) device stru...

Semiconductor device

Semiconductor structure and manufacturing method thereof

Semiconductor memory device and manufacturing method thereof

Silicon on insulator semiconductor device with mixed doped regions

Three-dimensional semiconductor device including a through-via stru...

Semiconductor devices including epitaxial patterns with plurality o...

Semiconductor devices and method for forming the same

Connection arrangements for integrated lateral diffusion field effe...

Tiered-profile contact for semiconductor

Semiconductor structure including a trench having a high aspect rat...

Semiconductor device with transistor local interconnects

Method of forming stacked trench contacts and structures formed the...

Middle-of-line interconnect structure having air gap and method of...

Different via configurations for different via interface requirements

Method of fabricating pedestal based memory devices using pocket in...

Self aligned buried power rail

Staircase structure for memory device

Three-dimensional memory devices and fabricating methods thereof

Semiconductor device structure and methods of forming the same

Semiconductor devices and methods of manufacturing semiconductor de...

Three-dimensional semiconductor device

Semiconductor device and forming method thereof

Semiconductor devices and electronic systems including the same

Semiconductor memory device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH PROTECTION LINERS AND AIR GAPS AND METHOD...

MERGED SELF-ALIGNED BACKSIDE CONTACT

SELF-ALIGNED BACKSIDE CONTACT

Integrated Circuit Apparatus And Oscillator

POWER DISTRIBUTION WITH BACKSIDE POWER PLANES

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF

BARRIER LAYERS FOR WORD LINE CONTACTS IN A THREE-DIMENSIONAL NAND M...

TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS

SELF-ALIGNED BACKSIDE CONTACT WITH PROTRUDING SOURCE/DRAIN

SEMICONDUCTOR DEVICES

THROUGH ARRAY CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE

ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND...

BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD

HYBRID INTEGRATED CIRCUIT DIES

CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...

DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...

CONTACT FORMATION METHOD AND RELATED STRUCTURE

MEMORY DEVICE

BARRIER LAYER FOR AN INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE

REDUCING RC DELAY IN SEMICONDUCTOR DEVICES