Indium gallium nitride [InGaN]

Industry

CPC
H01L2924/10346

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10346Indium gallium nitride [InGaN]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with a passivation layer and method for produc...
- Patent number 11,854,926
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for RF transistor amplifiers
- Patent number 11,837,457
- Issue date Dec 5, 2023
- Wolfspeed, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency transistor amplifiers having leadframes with integr...
- Patent number 11,588,448
- Issue date Feb 21, 2023
- Wolfspeed, Inc.
- Madhu Chidurala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone radio frequency transistor amplifiers
- Patent number 11,533,024
- Issue date Dec 20, 2022
- Wolfspeed, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,367,994
- Issue date Jun 21, 2022
- Nichia Corporation
- Takuya Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a passivation layer and method for produc...
- Patent number 11,158,557
- Issue date Oct 26, 2021
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 10,965,097
- Issue date Mar 30, 2021
- Nichia Corporation
- Takuya Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers
- Patent number 10,825,793
- Issue date Nov 3, 2020
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 10,608,406
- Issue date Mar 31, 2020
- Nichia Corporation
- Takuya Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancement-mode III-nitride devices
- Patent number 10,535,763
- Issue date Jan 14, 2020
- Transphorm Inc.
- Rakesh K. Lal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enhancement-mode III-nitride devices
- Patent number 10,043,898
- Issue date Aug 7, 2018
- Transphorm Inc.
- Rakesh K. Lal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer dicing
- Patent number 10,014,269
- Issue date Jul 3, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yueh-Chuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 9,967,937
- Issue date May 8, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Ivan-Christophe Robin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure and method for wafer dicing
- Patent number 9,748,187
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yueh-Chuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with conductive carr...
- Patent number 9,673,109
- Issue date Jun 6, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package for III-nitride transistor stacked with diode
- Patent number 9,530,774
- Issue date Dec 27, 2016
- Infineon Technologies Americas Corp.
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive clips
- Patent number 9,520,341
- Issue date Dec 13, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride device and FET in a package
- Patent number 9,312,245
- Issue date Apr 12, 2016
- Infineon Technologies Americas Corp.
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with conductive carr...
- Patent number 9,269,655
- Issue date Feb 23, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride transistor stacked with diode in a package
- Patent number 8,963,338
- Issue date Feb 24, 2015
- International Rectifier Corporation
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride transistor stacked with FET in a package
- Patent number 8,847,408
- Issue date Sep 30, 2014
- International Rectifier Corporation
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor package with conductive clip and flip chip...
- Patent number 8,749,034
- Issue date Jun 10, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor package with multiple conductive clips
- Patent number 8,664,754
- Issue date Mar 4, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor package with conductive clips and flip chi...
- Patent number 8,497,574
- Issue date Jul 30, 2013
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor package with conductive clip on multiple t...
- Patent number 8,497,573
- Issue date Jul 30, 2013
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS
- Publication number 20210408976
- Publication date Dec 30, 2021
- Cree, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY TRANSISTOR AMPLIFIERS HAVING LEADFRAMES WITH INTEGR...
- Publication number 20210408978
- Publication date Dec 30, 2021
- Cree, Inc.
- Madhu Chidurala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20210159665
- Publication date May 27, 2021
- Nichia Corporation.
- Takuya HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20200185881
- Publication date Jun 11, 2020
- Nichia Corporation.
- Takuya HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCEMENT-MODE III-NITRIDE DEVICES
- Publication number 20180315843
- Publication date Nov 1, 2018
- TRANSPHORM INC.
- Rakesh K. Lal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER DICING
- Publication number 20170317043
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yueh-Chuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20170229423
- Publication date Aug 10, 2017
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20160190092
- Publication date Jun 30, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER STRUCTURE AND METHOD FOR WAFER DICING
- Publication number 20160181213
- Publication date Jun 23, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yueh-Chuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Package with Conductive Carr...
- Publication number 20150348887
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Heat Spreader
- Publication number 20150348888
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING S...
- Publication number 20150200265
- Publication date Jul 16, 2015
- Sumitomo Electric Industries, Ltd.
- Tetsuya Kumano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Clips
- Publication number 20150194369
- Publication date Jul 9, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STABILIZATION STRUCTURE INCLUDING SHEAR RELEASE POSTS
- Publication number 20140340900
- Publication date Nov 20, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Stephen Bathurst
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Package with Multiple Conductive Clips
- Publication number 20140175630
- Publication date Jun 26, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Carrier Integrated Heat Spreader
- Publication number 20140110796
- Publication date Apr 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-Nitride Transistor Stacked with Diode in a Package
- Publication number 20120223322
- Publication date Sep 6, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-Nitride Transistor Stacked with FET in a Package
- Publication number 20120223321
- Publication date Sep 6, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clip
- Publication number 20120168922
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clip on Multiple T...
- Publication number 20120168923
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clips and Flip Chi...
- Publication number 20120168925
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clip and Flip Chip...
- Publication number 20120168926
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Multiple Conductive Clips
- Publication number 20120168924
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS

Indium gallium nitride [InGaN]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with a passivation layer and method for produc...

Packaging for RF transistor amplifiers

Radio frequency transistor amplifiers having leadframes with integr...

Multi-zone radio frequency transistor amplifiers

Light emitting device

Semiconductor device with a passivation layer and method for produc...

Light emitting device

Method for permanently bonding wafers

Light emitting device

Enhancement-mode III-nitride devices

Method for applying a bonding layer

Enhancement-mode III-nitride devices

Method for wafer dicing

Light-emitting device

Wafer structure and method for wafer dicing

Method for fabricating a semiconductor package with conductive carr...

Method for applying a bonding layer

Semiconductor package for III-nitride transistor stacked with diode

Semiconductor package with conductive clips

III-nitride device and FET in a package

Method for fabricating a semiconductor package with conductive carr...

III-nitride transistor stacked with diode in a package

III-nitride transistor stacked with FET in a package

High power semiconductor package with conductive clip and flip chip...

High power semiconductor package with multiple conductive clips

High power semiconductor package with conductive clips and flip chi...

High power semiconductor package with conductive clip on multiple t...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS

RADIO FREQUENCY TRANSISTOR AMPLIFIERS HAVING LEADFRAMES WITH INTEGR...

LIGHT EMITTING DEVICE

LIGHT EMITTING DEVICE

ENHANCEMENT-MODE III-NITRIDE DEVICES

METHOD FOR WAFER DICING

METHOD FOR PERMANENTLY BONDING WAFERS

METHOD FOR APPLYING A BONDING LAYER

WAFER STRUCTURE AND METHOD FOR WAFER DICING

Method for Fabricating a Semiconductor Package with Conductive Carr...

Semiconductor Package with Integrated Heat Spreader

SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING S...

Semiconductor Package with Conductive Clips

STABILIZATION STRUCTURE INCLUDING SHEAR RELEASE POSTS

Semiconductor Package with Multiple Conductive Clips

Semiconductor Package with Conductive Carrier Integrated Heat Spreader

III-Nitride Transistor Stacked with Diode in a Package

III-Nitride Transistor Stacked with FET in a Package

High Power Semiconductor Package with Conductive Clip

High Power Semiconductor Package with Conductive Clip on Multiple T...

High Power Semiconductor Package with Conductive Clips and Flip Chi...

High Power Semiconductor Package with Conductive Clip and Flip Chip...

High Power Semiconductor Package with Multiple Conductive Clips