Indium [In] as principal constituent

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H01L2224/05609

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05609Indium [In] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Iterative formation of damascene interconnects
- Patent number 12,148,721
- Issue date Nov 19, 2024
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid pocket post and tailored via dielectric for 3D-integrated el...
- Patent number 12,002,773
- Issue date Jun 4, 2024
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,984,417
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming same
- Patent number 11,973,045
- Issue date Apr 30, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for production of semiconductor device
- Patent number 11,715,752
- Issue date Aug 1, 2023
- Sony Group Corporation
- Atsushi Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting substrate, display apparatus, and method of driving...
- Patent number 11,694,607
- Issue date Jul 4, 2023
- BOE Technology Group Co., Ltd.
- Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,557,641
- Issue date Jan 17, 2023
- Samsung Display Co., Ltd.
- Byeong Beom Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iterative formation of damascene interconnects
- Patent number 11,430,753
- Issue date Aug 30, 2022
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for production of semiconductor device
- Patent number 11,121,164
- Issue date Sep 14, 2021
- Sony Corporation
- Atsushi Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure in microelectronic component
- Patent number 11,088,099
- Issue date Aug 10, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,910,341
- Issue date Feb 2, 2021
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,734,567
- Issue date Aug 4, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,727,391
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system with carrier construction configuration a...
- Patent number 10,679,954
- Issue date Jun 9, 2020
- EoPlex Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive testing of integrated circuit chips
- Patent number 10,651,099
- Issue date May 12, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for production of semiconductor device
- Patent number 10,541,265
- Issue date Jan 21, 2020
- Sony Corporation
- Atsushi Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,535,626
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for assembly of semiconductor structures in...
- Patent number 10,396,269
- Issue date Aug 27, 2019
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Device having at least two wafers for detecting electromagnetic rad...
- Patent number 10,270,001
- Issue date Apr 23, 2019
- Robert Bosch GmbH
- Ingo Herrmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnect structure and semiconductor structures for assembly of...
- Patent number 10,242,968
- Issue date Mar 26, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect structures and methods for fabricating interconnect st...
- Patent number 10,121,754
- Issue date Nov 6, 2018
- Massachusetts Institute of Technology
- William D. Oliver
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379639
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Myung Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE COMPRISING UNDER BARRIER METAL AND SOLDER LAYER, AND METH...
- Publication number 20240258255
- Publication date Aug 1, 2024
- ISHIHARA CHEMICAL CO., LTD.
- Masaru HATABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240234354
- Publication date Jul 11, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20240203917
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
- Publication number 20240153908
- Publication date May 9, 2024
- HKC Corporation Limited
- YANG PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DISPLAY PANEL
- Publication number 20240072027
- Publication date Feb 29, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jeong Won HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063178
- Publication date Feb 22, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES INCLUDING RECESSES FOR FACILITATING MECHANICAL D...
- Publication number 20240047424
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, METHOD OF MANUFACTURING DISPLAY PANEL, AND DISPLAY D...
- Publication number 20240038697
- Publication date Feb 1, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Jinming Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
- Publication number 20240038723
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...
- Publication number 20230343734
- Publication date Oct 26, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS...
- Publication number 20230275076
- Publication date Aug 31, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quantum Bit Chip and Method for Fabricating Quantum Bit Chip
- Publication number 20230200263
- Publication date Jun 22, 2023
- IMEC vzw
- Jaber Derakhshandeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
- Publication number 20230154885
- Publication date May 18, 2023
- Samsung Electronics Co., LTD
- Jinyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE INTERCONNECTS AND METHODS FOR FORMING THE SAME
- Publication number 20230058704
- Publication date Feb 23, 2023
- TOKYO ELECTRON LIMITED
- Robert D. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20230005867
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005849
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temporary Chip Assembly, Display Panel, and Manufacturing Methods o...
- Publication number 20230005878
- Publication date Jan 5, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...
- Publication number 20220415853
- Publication date Dec 29, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENTS, AND MET...
- Publication number 20220406982
- Publication date Dec 22, 2022
- LG ELECTRONICS INC.
- Hwanjoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220399319
- Publication date Dec 15, 2022
- Japan Display Inc.
- Masanobu IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS
- Publication number 20220359437
- Publication date Nov 10, 2022
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY AND MANUFACTURING METHOD THEREFOR
- Publication number 20220085265
- Publication date Mar 17, 2022
- Samsung Electronics Co., Ltd.
- Byunghoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS
- Publication number 20220013478
- Publication date Jan 13, 2022
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION OF SEMICONDUCTOR DEVICE
- Publication number 20210366975
- Publication date Nov 25, 2021
- SONY GROUP CORPORATION
- Atsushi Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20210335737
- Publication date Oct 28, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210265446
- Publication date Aug 26, 2021
- SAMSUNG DISPLAY CO., LTD.
- Byeong Beom KIM
- H01 - BASIC ELECTRIC ELEMENTS

Indium [In] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Iterative formation of damascene interconnects

Structures for low temperature bonding using nanoparticles

Hybrid pocket post and tailored via dielectric for 3D-integrated el...

Semiconductor structure and manufacturing method thereof

Semiconductor structure and method for forming same

Methods for low temperature bonding using nanoparticles

Multi-metal contact structure

Bonding process with inhibited oxide formation

Semiconductor device and method for production of semiconductor device

Structures and methods for low temperature bonding using nanoparticles

Light emitting substrate, display apparatus, and method of driving...

Display device

Bonding process with inhibited oxide formation

Iterative formation of damascene interconnects

Semiconductor device and method for production of semiconductor device

Multi-metal contact structure in microelectronic component

Method and apparatus for creating a bond between objects based on f...

Bonding process with inhibited oxide formation

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Bump bonded cryogenic chip carrier

Bump bonded cryogenic chip carrier

Integrated circuit system with carrier construction configuration a...

Non-destructive testing of integrated circuit chips

Semiconductor device and method for production of semiconductor device

Structures and methods for low temperature bonding using nanoparticles

Interconnect structures for assembly of semiconductor structures in...

Device having at least two wafers for detecting electromagnetic rad...

Interconnect structure and semiconductor structures for assembly of...

Interconnect structures and methods for fabricating interconnect st...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

STRUCTURE COMPRISING UNDER BARRIER METAL AND SOLDER LAYER, AND METH...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

MULTI-METAL CONTACT STRUCTURE

DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...

METHOD OF FABRICATING DISPLAY PANEL

QUASI-MONOLITHIC DIE ARCHITECTURES

SEMICONDUCTOR DIES INCLUDING RECESSES FOR FACILITATING MECHANICAL D...

DISPLAY PANEL, METHOD OF MANUFACTURING DISPLAY PANEL, AND DISPLAY D...

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS...

Quantum Bit Chip and Method for Fabricating Quantum Bit Chip

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

PHASE CHANGE INTERCONNECTS AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Temporary Chip Assembly, Display Panel, and Manufacturing Methods o...

HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...

DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENTS, AND MET...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS

MICRO LED DISPLAY AND MANUFACTURING METHOD THEREFOR

ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION OF SEMICONDUCTOR DEVICE

MULTI-METAL CONTACT STRUCTURE

DISPLAY DEVICE