Indium [In] as principal constituent

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H01L2224/05109

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05109Indium [In] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-temperature superconducting striated tape combinations
- Patent number 11,711,983
- Issue date Jul 25, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of high-temperature superconducting striated tape combi...
- Patent number 11,600,762
- Issue date Mar 7, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor contact structure having stress buffer layer formed b...
- Patent number 11,476,212
- Issue date Oct 18, 2022
- United Microelectronics Corporation
- Yu-Jie Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure in microelectronic component
- Patent number 11,088,099
- Issue date Aug 10, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor contact structure having stress buffer layer formed b...
- Patent number 10,903,179
- Issue date Jan 26, 2021
- United Microelectronics Corporation
- Yu-Jie Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system with carrier construction configuration a...
- Patent number 10,679,954
- Issue date Jun 9, 2020
- EoPlex Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure
- Patent number 10,515,913
- Issue date Dec 24, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed MEMS device and its fabrication
- Patent number 10,427,932
- Issue date Oct 1, 2019
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bond rings in semiconductor devices and methods of forming same
- Patent number 10,351,418
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bond rings in semiconductor devices and methods of forming same
- Patent number 9,957,156
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of fabricating semiconductor devices
- Patent number 9,793,165
- Issue date Oct 17, 2017
- Samsung Electronics Co., Ltd.
- Seyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bump structure
- Patent number 9,269,682
- Issue date Feb 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and mounting structure manufacturing method
- Patent number 9,099,315
- Issue date Aug 4, 2015
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices
- Patent number 9,087,833
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip heat spreader
- Patent number 8,779,572
- Issue date Jul 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring in an integrated circuit die
- Patent number 8,742,583
- Issue date Jun 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip heat spreader
- Patent number 8,609,506
- Issue date Dec 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip heat spreader
- Patent number 8,314,483
- Issue date Nov 20, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming seal ring in an integrated circuit die
- Patent number 8,168,529
- Issue date May 1, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microcap wafer-level package with vias
- Patent number 6,228,675
- Issue date May 8, 2001
- Agilent Technologies, Inc.
- Richard C. Ruby
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Barrier-free, low-resistant electrical contact on III-V semiconduct...
- Patent number 4,395,727
- Issue date Jul 26, 1983
- Siemens Aktiengesellschaft
- Christl Lauterbach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20240203917
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...
- Publication number 20240153897
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...
- Publication number 20230343734
- Publication date Oct 26, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005866
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20210335737
- Publication date Oct 28, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONTACT STRUCTURE HAVING STRESS BUFFER LAYER FORMED B...
- Publication number 20210104478
- Publication date Apr 8, 2021
- UNITED MICROELECTRONICS CORPORATION
- YU-JIE LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20200251432
- Publication date Aug 6, 2020
- UNITED MICROELECTRONICS CORPORATION
- YU-JIE LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20200105692
- Publication date Apr 2, 2020
- INVENSAS BONDING TECHNOLOGIES INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Precise Alignment and Decal Bonding of a Pattern of Solder Preforms...
- Publication number 20190184480
- Publication date Jun 20, 2019
- The Government of the United States of America, as represented by the Secreta...
- Raymond C.Y. Auyeung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION A...
- Publication number 20180374809
- Publication date Dec 27, 2018
- EoPlex Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-metal contact structure
- Publication number 20180269172
- Publication date Sep 20, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Rings in Semiconductor Devices and Methods of Forming Same
- Publication number 20180230003
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF BONDING A FIRST SUBSTRATE AND A SECOND SUBSTRATE
- Publication number 20170309584
- Publication date Oct 26, 2017
- Agency for Science, Technology and Research
- Ling Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND RINGS IN SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME
- Publication number 20170275153
- Publication date Sep 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160233181
- Publication date Aug 11, 2016
- FUJITSU LIMITED
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND MOUNTING STRUCTURE MANUFACTURING METHOD
- Publication number 20150021777
- Publication date Jan 22, 2015
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING BUMP STRUCTURE
- Publication number 20140242791
- Publication date Aug 28, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20140151744
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip Heat Spreader
- Publication number 20140054761
- Publication date Feb 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip Heat Spreader
- Publication number 20130078765
- Publication date Mar 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20120214302
- Publication date Aug 23, 2012
- SEYOUNG JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring in an Integrated Circuit Die
- Publication number 20120112322
- Publication date May 10, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE
- Publication number 20100252855
- Publication date Oct 7, 2010
- Hidenori Kamei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Seal Ring in an Integrated Circuit Die
- Publication number 20100187671
- Publication date Jul 29, 2010
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip Heat Spreader
- Publication number 20100187670
- Publication date Jul 29, 2010
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Indium [In] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-metal contact structure

High-temperature superconducting striated tape combinations

Fabrication of high-temperature superconducting striated tape combi...

Semiconductor contact structure having stress buffer layer formed b...

Multi-metal contact structure in microelectronic component

Semiconductor contact structure having stress buffer layer formed b...

Integrated circuit system with carrier construction configuration a...

Multi-metal contact structure

Hermetically sealed MEMS device and its fabrication

Bond rings in semiconductor devices and methods of forming same

Bond rings in semiconductor devices and methods of forming same

Methods of fabricating semiconductor devices

Method of forming bump structure

Mounting structure and mounting structure manufacturing method

Power semiconductor devices

On-chip heat spreader

Seal ring in an integrated circuit die

On-chip heat spreader

On-chip heat spreader

Forming seal ring in an integrated circuit die

Microcap wafer-level package with vias

Barrier-free, low-resistant electrical contact on III-V semiconduct...

Patents Applicationslast 30 patents

MULTI-METAL CONTACT STRUCTURE

SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...

EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTI-METAL CONTACT STRUCTURE

SEMICONDUCTOR CONTACT STRUCTURE HAVING STRESS BUFFER LAYER FORMED B...

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

MULTI-METAL CONTACT STRUCTURE

Precise Alignment and Decal Bonding of a Pattern of Solder Preforms...

INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION A...

Multi-metal contact structure

Bond Rings in Semiconductor Devices and Methods of Forming Same

METHOD OF BONDING A FIRST SUBSTRATE AND A SECOND SUBSTRATE

BOND RINGS IN SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

MOUNTING STRUCTURE AND MOUNTING STRUCTURE MANUFACTURING METHOD

METHOD OF FORMING BUMP STRUCTURE

POWER SEMICONDUCTOR DEVICES

On-Chip Heat Spreader

On-Chip Heat Spreader

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Seal Ring in an Integrated Circuit Die

SEMICONDUCTOR LIGHT-EMITTING DEVICE

Forming Seal Ring in an Integrated Circuit Die

On-Chip Heat Spreader