Inductive arrangements or effects of, or between, wiring layers

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H01L23/5227

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5227Inductive arrangements or effects of, or between, wiring layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Dies with integrated voltage regulators
- Patent number 11,417,593
- Issue date Aug 16, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,411,104
- Issue date Aug 9, 2022
- Kabushiki Kaisha Toshiba
- Tatsuya Nishiwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming thereof
- Patent number 11,410,927
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including inductor structures
- Patent number 11,411,068
- Issue date Aug 9, 2022
- Samsung Electronics Co., Ltd.
- Sangwook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip component
- Patent number 11,410,985
- Issue date Aug 9, 2022
- Fuji Electric Co., Ltd.
- Takuma Shimoichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer embedded magnetic inductor coil
- Patent number 11,404,364
- Issue date Aug 2, 2022
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ component fabrication of a highly efficient, high inductanc...
- Patent number 11,404,389
- Issue date Aug 2, 2022
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated multi-turn coil embedded in a package magnetic core
- Patent number 11,393,751
- Issue date Jul 19, 2022
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Band stop filter structure and method of forming
- Patent number 11,394,359
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor design for integrated magnetic devices
- Patent number 11,393,787
- Issue date Jul 19, 2022
- Texas Instruments Incorporated
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an inductor
- Patent number 11,393,782
- Issue date Jul 19, 2022
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric spiral inductor
- Patent number 11,387,034
- Issue date Jul 12, 2022
- Realtek Semiconductor Corporation
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module structure and method for manufacturing the module structure
- Patent number 11,387,182
- Issue date Jul 12, 2022
- ANHUI ANUKI TECHNOLOGIES CO., LTD.
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic component and method
- Patent number 11,380,612
- Issue date Jul 5, 2022
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiofrequency device
- Patent number 11,380,627
- Issue date Jul 5, 2022
- United Semiconductor (Xiamen) Co., Ltd.
- Hui Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound capacitor structures
- Patent number 11,380,755
- Issue date Jul 5, 2022
- Intel Corporation
- Domagoj Siprak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having one or more on-chip metal winding and enc...
- Patent number 11,367,557
- Issue date Jun 21, 2022
- International Business Machines Corporation
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with patterned ground shielding
- Patent number 11,355,432
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage isolation barrier with electric overstress integrity
- Patent number 11,348,883
- Issue date May 31, 2022
- Texas Instruments Incorporated
- Jeffrey A West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package inductor having thermal solution structures
- Patent number 11,335,620
- Issue date May 17, 2022
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated inductor with composite magnetic resin layer
- Patent number 11,335,616
- Issue date May 17, 2022
- Intel Corporation
- Malavarayan Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low impedance multi-conductor layered bus structure with shielding
- Patent number 11,335,649
- Issue date May 17, 2022
- Virginia Tech Intellectual Properties, Inc.
- Jun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,335,767
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit components with substrate cavities
- Patent number 11,335,777
- Issue date May 17, 2022
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waver-level packaging based module and method for producing the same
- Patent number 11,328,987
- Issue date May 10, 2022
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Ivan Ndip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection against electrostatic discharges and filtering
- Patent number 11,329,040
- Issue date May 10, 2022
- STMicroelectronics (Tours) SAS
- Patrick Poveda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit components with dummy structures
- Patent number 11,328,992
- Issue date May 10, 2022
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive device
- Patent number 11,322,576
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for an inductor at a first level interface
- Patent number 11,322,290
- Issue date May 3, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods of vertical integrations of semiconductor chips...
- Patent number 11,315,873
- Issue date Apr 26, 2022
- Suzhou Qing Xin Fang Electronics Technology Co., Ltd.
- Jerry Zhijun Zhai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20220262556
- Publication date Aug 18, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Tong WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE ISOLATION BARRIER WITH ELECTRIC OVERSTRESS INTEGRITY
- Publication number 20220254740
- Publication date Aug 11, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device And Manufacturing Method Therefor
- Publication number 20220254717
- Publication date Aug 11, 2022
- Huawei Technologies Co., Ltd
- Dong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER AND PACKAGE MODULE
- Publication number 20220254561
- Publication date Aug 11, 2022
- Hefei Silergy Semiconductor Technology Co., Ltd.
- Ke Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Packages Having a Die with an Enca...
- Publication number 20220246559
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING DIFFERENT METAL DENSITIES IN DIFFERENT REGIONS AND M...
- Publication number 20220246524
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION AGAINST ELECTROSTATIC DISCHARGES AND FILTERING
- Publication number 20220238507
- Publication date Jul 28, 2022
- STMicroelectronics (Tours) SAS
- Patrick POVEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER-TYPE ON-CHIP INDUCTOR STRUCTURE
- Publication number 20220238435
- Publication date Jul 28, 2022
- VIA Labs, INC.
- Sheng-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER-TYPE ON-CHIP INDUCTOR STRUCTURE
- Publication number 20220238436
- Publication date Jul 28, 2022
- VIA Labs, INC.
- Sheng-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE
- Publication number 20220230800
- Publication date Jul 21, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE DEVICE
- Publication number 20220231116
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20220223332
- Publication date Jul 14, 2022
- Mitsubishi Electric Corporation
- Toshihiro IMASAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENTS WITH DUMMY STRUCTURES
- Publication number 20220216149
- Publication date Jul 7, 2022
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING CHIP
- Publication number 20220208674
- Publication date Jun 30, 2022
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITIONS OF INFLUENZA HEMAGGLUTININ WITH HETEROLOGOUS EPITOPES...
- Publication number 20220200559
- Publication date Jun 23, 2022
- CG Discovery, Inc.
- Chun LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONANT INDUCTIVE-CAPACITIVE ISOLATED DATA CHANNEL
- Publication number 20220189873
- Publication date Jun 16, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Klaas De Haan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220189888
- Publication date Jun 16, 2022
- UNITED MICROELECTRONICS CORPORATION
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROCOIL ELEMENT, ARRAY-TYPE MICROCOIL ELEMENT AND DEVICE
- Publication number 20220189672
- Publication date Jun 16, 2022
- SOUNDS GREAT CO., LTD.
- HONG-DA ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...
- Publication number 20220173084
- Publication date Jun 2, 2022
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CORE WITH HARD FERROMAGNETIC BIASING LAYERS AND STRUCTURES...
- Publication number 20220173035
- Publication date Jun 2, 2022
- Ferric Inc.
- Michael Lekas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES WITH WIRELESS CHARGING MEANS
- Publication number 20220166254
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF
- Publication number 20220165665
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS OF VERTICAL INTEGRATIONS OF SEMICONDUCTOR CHIPS...
- Publication number 20220157715
- Publication date May 19, 2022
- SUZHOU QING XIN FANG ELECTRONICS TECHNOLOGY CO., LTD.
- Jerry Zhijun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES
- Publication number 20220149146
- Publication date May 12, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Feng Wei KUO
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND MASSIVE DATA STORAGE SYSTEM INCLUDING THE...
- Publication number 20220139821
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Sungmin HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES
- Publication number 20220139814
- Publication date May 5, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INDUCTOR FOR WLCSP
- Publication number 20220122756
- Publication date Apr 21, 2022
- Intel IP Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
- Publication number 20220115268
- Publication date Apr 14, 2022
- Gula Consulting Limited Liability Company
- Ernest E. Hollis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR DEVICE AND SYSTEM
- Publication number 20220065664
- Publication date Mar 3, 2022
- Melexis Bulgaria Ltd.
- Hristo Angelov HRISTOV
- B60 - VEHICLES IN GENERAL
Information Patent Application
INDUCTOR CAPACITOR FILTER IN FAR BACK END OF LINE AND INTEGRATION S...
- Publication number 20220068809
- Publication date Mar 3, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- LULU PENG
- H01 - BASIC ELECTRIC ELEMENTS

Inductive arrangements or effects of, or between, wiring layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dies with integrated voltage regulators

Semiconductor device

Semiconductor structure and method for forming thereof

Semiconductor packages including inductor structures

Chip component

Multi-layer embedded magnetic inductor coil

In-situ component fabrication of a highly efficient, high inductanc...

Package-integrated multi-turn coil embedded in a package magnetic core

Band stop filter structure and method of forming

Conductor design for integrated magnetic devices

Semiconductor device having an inductor

Asymmetric spiral inductor

Module structure and method for manufacturing the module structure

Semiconductor device, electronic component and method

Radiofrequency device

Compound capacitor structures

Semiconductor chip having one or more on-chip metal winding and enc...

Semiconductor device with patterned ground shielding

High voltage isolation barrier with electric overstress integrity

Package inductor having thermal solution structures

Substrate integrated inductor with composite magnetic resin layer

Low impedance multi-conductor layered bus structure with shielding

Package structure and method of fabricating the same

Integrated circuit components with substrate cavities

Waver-level packaging based module and method for producing the same

Protection against electrostatic discharges and filtering

Integrated circuit components with dummy structures

Inductive device

Techniques for an inductor at a first level interface

Devices and methods of vertical integrations of semiconductor chips...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

HIGH VOLTAGE ISOLATION BARRIER WITH ELECTRIC OVERSTRESS INTEGRITY

Semiconductor Device And Manufacturing Method Therefor

TRANSFORMER AND PACKAGE MODULE

Methods of Forming Semiconductor Packages Having a Die with an Enca...

PACKAGE HAVING DIFFERENT METAL DENSITIES IN DIFFERENT REGIONS AND M...

PROTECTION AGAINST ELECTROSTATIC DISCHARGES AND FILTERING

MULTILAYER-TYPE ON-CHIP INDUCTOR STRUCTURE

MULTILAYER-TYPE ON-CHIP INDUCTOR STRUCTURE

TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE

INDUCTIVE DEVICE

TRANSFORMER DEVICE AND SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT COMPONENTS WITH DUMMY STRUCTURES

INSULATING CHIP

COMPOSITIONS OF INFLUENZA HEMAGGLUTININ WITH HETEROLOGOUS EPITOPES...

RESONANT INDUCTIVE-CAPACITIVE ISOLATED DATA CHANNEL

SEMICONDUCTOR STRUCTURE

MICROCOIL ELEMENT, ARRAY-TYPE MICROCOIL ELEMENT AND DEVICE

MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...

MAGNETIC CORE WITH HARD FERROMAGNETIC BIASING LAYERS AND STRUCTURES...

PACKAGED SEMICONDUCTOR DEVICES WITH WIRELESS CHARGING MEANS

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF

DEVICES AND METHODS OF VERTICAL INTEGRATIONS OF SEMICONDUCTOR CHIPS...

SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES

SEMICONDUCTOR DEVICE AND MASSIVE DATA STORAGE SYSTEM INCLUDING THE...

ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES

VERTICAL INDUCTOR FOR WLCSP

HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM

PROXIMITY SENSOR DEVICE AND SYSTEM

INDUCTOR CAPACITOR FILTER IN FAR BACK END OF LINE AND INTEGRATION S...