Inductive arrangements or effects of, or between, wiring layers

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H01L23/5227

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5227Inductive arrangements or effects of, or between, wiring layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit having current-sensing coil
- Patent number 11,569,030
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alan Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power transformer of the symmetric-asymmetric type with a fully-bal...
- Patent number 11,569,021
- Issue date Jan 31, 2023
- STMicroelectronics S.A.
- Vincent Knopik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with polygonal inductive device
- Patent number 11,569,164
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,562,957
- Issue date Jan 24, 2023
- Renesas Electronics Corporation
- Shinichi Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency capacitor with inductance cancellation
- Patent number 11,552,030
- Issue date Jan 10, 2023
- Intel Corporation
- Daniel Sira
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming entangled inductor structures
- Patent number 11,545,298
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ka Fai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimization of insertion loss variation in through-silicon vias (T...
- Patent number 11,545,416
- Issue date Jan 3, 2023
- Intel Corporation
- Jianyong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with an embedded inductor or transformer
- Patent number 11,538,771
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor capacitor filter in far back end of line and integration s...
- Patent number 11,538,751
- Issue date Dec 27, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lulu Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with floating pads
- Patent number 11,538,743
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Chang-Yen Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for tuning via profile in dielectric material
- Patent number 11,532,692
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable inductor arrangement, transceiver, method and computer program
- Patent number 11,527,347
- Issue date Dec 13, 2022
- Telefonaktiebolaget LM Ericsson (publ)
- Magnus Nilsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant LC tank package and method of manufacture
- Patent number 11,521,793
- Issue date Dec 6, 2022
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 11,515,291
- Issue date Nov 29, 2022
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having 3-dimensional inductive structures
- Patent number 11,508,657
- Issue date Nov 22, 2022
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,502,067
- Issue date Nov 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric field grading protection design surrounding a galvanic or...
- Patent number 11,476,045
- Issue date Oct 18, 2022
- Analog Devices International Unlimited Company
- Sombel Diaham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant inductive-capacitive isolated data channel
- Patent number 11,476,189
- Issue date Oct 18, 2022
- Texas Instruments Incorporated
- Klaas De Haan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor and transmission line with air gap
- Patent number 11,469,189
- Issue date Oct 11, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,469,174
- Issue date Oct 11, 2022
- Samsung Electronics Co., Ltd.
- Joon-Nyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable inductor arrangement, transceiver, method and computer program
- Patent number 11,456,102
- Issue date Sep 27, 2022
- Telefonaktiebolaget LM Ericsson (publ)
- Thomas Mattsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection element
- Patent number 11,444,078
- Issue date Sep 13, 2022
- Murata Manufacturing Co., Ltd.
- Noriyuki Ueki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures to facilitate heat transfer within package layers to the...
- Patent number 11,437,294
- Issue date Sep 6, 2022
- Intel Corporation
- Sameer Shekhar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 11,437,354
- Issue date Sep 6, 2022
- ROHM Co, Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable passive semiconductor elements
- Patent number 11,437,366
- Issue date Sep 6, 2022
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 11,424,228
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dies with integrated voltage regulators
- Patent number 11,417,593
- Issue date Aug 16, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming thereof
- Patent number 11,410,927
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including inductor structures
- Patent number 11,411,068
- Issue date Aug 9, 2022
- Samsung Electronics Co., Ltd.
- Sangwook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,411,104
- Issue date Aug 9, 2022
- Kabushiki Kaisha Toshiba
- Tatsuya Nishiwaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESONANT INDUCTIVE-CAPACITIVE ISOLATED DATA CHANNEL
- Publication number 20230031204
- Publication date Feb 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Klaas De Haan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROMAGNETIC-POLYMER COMPOSITE MATERIAL AND STRUCTURES COMPRISING...
- Publication number 20230027090
- Publication date Jan 26, 2023
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-AWARE METAL FILLS FOR INTEGRATED CIRCUIT PASSIVE COMPONENTS
- Publication number 20220413091
- Publication date Dec 29, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Zeshan AHMAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tunable Inductor Arrangement, Transceiver, Method and Computer Program
- Publication number 20220415554
- Publication date Dec 29, 2022
- Thomas Mattsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL TUNED INDUCTOR DEVICES AND METHODS THEREOF
- Publication number 20220415789
- Publication date Dec 29, 2022
- Intrinsix Corp.
- Kathiravan Krishnamurthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20220415806
- Publication date Dec 29, 2022
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PACKAGE PASSIVE INDUCTIVE ELEMENT FOR REFLECTION MITIGATION
- Publication number 20220415788
- Publication date Dec 29, 2022
- Xilinx, Inc.
- Zhaoyin Daniel WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20220415805
- Publication date Dec 29, 2022
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR ALIGNED VIAS
- Publication number 20220406654
- Publication date Dec 22, 2022
- Intel Corporation
- Changhua Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220406883
- Publication date Dec 22, 2022
- Samsung Electronics Co., Ltd.
- Hyelee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERIES INDUCTORS
- Publication number 20220399270
- Publication date Dec 15, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Venkata Narayana Rao VANUKURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED VIA SEMICONDUCTOR STRUCTURE, DEVICE AND METHOD
- Publication number 20220367343
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF
- Publication number 20220367351
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF
- Publication number 20220367352
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED TRANSFORMER MODULE
- Publication number 20220344260
- Publication date Oct 27, 2022
- Murata Manufacturing Co., Ltd.
- Takayuki TANGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220336349
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BAND STOP FILTER STRUCTURE AND METHOD OF FORMING
- Publication number 20220337214
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Hsien TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220328464
- Publication date Oct 13, 2022
- ROHM CO., LTD.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE, SEMICONDUCTOR SUBSTRATE, AND TEST SYSTEM...
- Publication number 20220317179
- Publication date Oct 6, 2022
- Samsung Electronics Co., Ltd.
- DAEHYUN KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING
- Publication number 20220310511
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-INTEGRATED MULTI-TURN COIL EMBEDDED IN A PACKAGE MAGNETIC CORE
- Publication number 20220310512
- Publication date Sep 29, 2022
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asymmetric spiral inductor
- Publication number 20220293331
- Publication date Sep 15, 2022
- REALTEK SEMICONDUCTOR CORPORATION
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON TRANSFORMER INTEGRATED CHIP
- Publication number 20220278041
- Publication date Sep 1, 2022
- Murata Manufacturing Co., Ltd.
- Takayuki TANGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEAR TIER DECOUPLING CAPACITORS
- Publication number 20220271005
- Publication date Aug 25, 2022
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20220262556
- Publication date Aug 18, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Tong WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE ISOLATION BARRIER WITH ELECTRIC OVERSTRESS INTEGRITY
- Publication number 20220254740
- Publication date Aug 11, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device And Manufacturing Method Therefor
- Publication number 20220254717
- Publication date Aug 11, 2022
- Huawei Technologies Co., Ltd
- Dong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER AND PACKAGE MODULE
- Publication number 20220254561
- Publication date Aug 11, 2022
- Hefei Silergy Semiconductor Technology Co., Ltd.
- Ke Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Packages Having a Die with an Enca...
- Publication number 20220246559
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING DIFFERENT METAL DENSITIES IN DIFFERENT REGIONS AND M...
- Publication number 20220246524
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Inductive arrangements or effects of, or between, wiring layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit having current-sensing coil

Power transformer of the symmetric-asymmetric type with a fully-bal...

Semiconductor device with polygonal inductive device

Semiconductor device and method of manufacturing the same

High frequency capacitor with inductance cancellation

Method of forming entangled inductor structures

Minimization of insertion loss variation in through-silicon vias (T...

Integrated circuit with an embedded inductor or transformer

Inductor capacitor filter in far back end of line and integration s...

Microelectronic device with floating pads

Process for tuning via profile in dielectric material

Tunable inductor arrangement, transceiver, method and computer program

Resonant LC tank package and method of manufacture

Integrated voltage regulator and passive components

Semiconductor devices having 3-dimensional inductive structures

Package structure and method for manufacturing the same

Electric field grading protection design surrounding a galvanic or...

Resonant inductive-capacitive isolated data channel

Inductor and transmission line with air gap

Semiconductor device

Tunable inductor arrangement, transceiver, method and computer program

ESD protection element

Structures to facilitate heat transfer within package layers to the...

Semiconductor device

Tunable passive semiconductor elements

Semiconductor structure and method for manufacturing the same

Dies with integrated voltage regulators

Semiconductor structure and method for forming thereof

Semiconductor packages including inductor structures

Semiconductor device

Patents Applicationslast 30 patents

RESONANT INDUCTIVE-CAPACITIVE ISOLATED DATA CHANNEL

FERROMAGNETIC-POLYMER COMPOSITE MATERIAL AND STRUCTURES COMPRISING...

FIELD-AWARE METAL FILLS FOR INTEGRATED CIRCUIT PASSIVE COMPONENTS

Tunable Inductor Arrangement, Transceiver, Method and Computer Program

DIFFERENTIAL TUNED INDUCTOR DEVICES AND METHODS THEREOF

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

IN-PACKAGE PASSIVE INDUCTIVE ELEMENT FOR REFLECTION MITIGATION

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

TECHNOLOGIES FOR ALIGNED VIAS

SEMICONDUCTOR DEVICE

SERIES INDUCTORS

EXTENDED VIA SEMICONDUCTOR STRUCTURE, DEVICE AND METHOD

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF

INTEGRATED TRANSFORMER MODULE

SEMICONDUCTOR PACKAGES

BAND STOP FILTER STRUCTURE AND METHOD OF FORMING

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE, SEMICONDUCTOR SUBSTRATE, AND TEST SYSTEM...

SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING

PACKAGE-INTEGRATED MULTI-TURN COIL EMBEDDED IN A PACKAGE MAGNETIC CORE

Asymmetric spiral inductor

SILICON TRANSFORMER INTEGRATED CHIP

NEAR TIER DECOUPLING CAPACITORS

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

HIGH VOLTAGE ISOLATION BARRIER WITH ELECTRIC OVERSTRESS INTEGRITY

Semiconductor Device And Manufacturing Method Therefor

TRANSFORMER AND PACKAGE MODULE

Methods of Forming Semiconductor Packages Having a Die with an Enca...

PACKAGE HAVING DIFFERENT METAL DENSITIES IN DIFFERENT REGIONS AND M...