Inductive arrangements

Industry

CPC
H01L23/645

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/645Inductive arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Organic interposer including a dual-layer inductor structure and me...
- Patent number 12,142,582
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package embedded magnetic inductor structures and manufacturing tec...
- Patent number 12,132,015
- Issue date Oct 29, 2024
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor built-in substrate
- Patent number 12,125,626
- Issue date Oct 22, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-scale planar-coil transformer with shield
- Patent number 12,125,630
- Issue date Oct 22, 2024
- Analog Devices International Unlimited Company
- Baoxing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier module
- Patent number 12,119,793
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,036
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 12,113,031
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductance traces protected through shielding layers
- Patent number 12,094,922
- Issue date Sep 17, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributing on chip inductors for monolithic voltage regulation
- Patent number 12,094,841
- Issue date Sep 17, 2024
- Oracle International Corporation
- Michael Henry Soltau Dayringer
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method for forming a device with an extended via semiconductor stru...
- Patent number 12,087,627
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure, semiconductor package and fabrication method th...
- Patent number 12,074,122
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of fabricating a semiconductor de...
- Patent number 12,068,359
- Issue date Aug 20, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lawrence Selvaraj Susai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure having conductive sheets having fan plate shape...
- Patent number 12,062,685
- Issue date Aug 13, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded inductors
- Patent number 12,057,252
- Issue date Aug 6, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip encapsulation structure and encapsulation method
- Patent number 12,057,361
- Issue date Aug 6, 2024
- Epicmems (Xiamen) Co., Ltd.
- Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transformer design with balanced interwinding capacitance for impro...
- Patent number 12,051,657
- Issue date Jul 30, 2024
- Texas Instruments Incorporated
- Raul Blecić
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device with integrated inductor and manufactu...
- Patent number 12,046,544
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ying-Chih Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising substrate with coupling element for integrated d...
- Patent number 12,027,476
- Issue date Jul 2, 2024
- QUALCOMM Incorporated
- Fnu Suraj Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor device isolation package
- Patent number 12,027,572
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor built-in substrate and method for manufacturing inductor b...
- Patent number 12,020,843
- Issue date Jun 25, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interconnect loss of high density package with magnetic material
- Patent number 12,009,320
- Issue date Jun 11, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management semiconductor package and manufacturing method the...
- Patent number 12,002,770
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ying-Chih Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transformer
- Patent number 12,002,618
- Issue date Jun 4, 2024
- Huawei Technologies Co., Ltd.
- Kai Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferrite electro-magnetic interference (EMI) shield between an integ...
- Patent number 11,990,422
- Issue date May 21, 2024
- High Tech Technology Limited
- Chik Wai (David) Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,984,411
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for delivering power to semiconductors
- Patent number 11,984,806
- Issue date May 14, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,984,412
- Issue date May 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,984,246
- Issue date May 14, 2024
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient IGBT switching
- Patent number 11,979,141
- Issue date May 7, 2024
- EHT Ventures LLC
- Timothy Ziemba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NANOWIRE, FABRICATION METHOD OF ARRAY SUBSTRATE, ARRAY SUBSTRATE AN...
- Publication number 20240387631
- Publication date Nov 21, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Hao WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...
- Publication number 20240379589
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379574
- Publication date Nov 14, 2024
- Rohm Co., Ltd.
- Yoshizo OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20240371787
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH CORE VIA COAXIAL-TYPE INDUCTORS WITH TWO OR MORE MAGNETIC M...
- Publication number 20240371799
- Publication date Nov 7, 2024
- Intel Corporation
- Aleksander ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER DESIGN WITH BALANCED INTERWINDING CAPACITANCE FOR IMPRO...
- Publication number 20240371800
- Publication date Nov 7, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Raul Blecic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371801
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...
- Publication number 20240363559
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363606
- Publication date Oct 31, 2024
- ROHM CO., LTD.
- Yoshizo OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...
- Publication number 20240355720
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YING-CHIH HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240347466
- Publication date Oct 17, 2024
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY
- Publication number 20240339412
- Publication date Oct 10, 2024
- Intel Corporation
- Cary KULIASHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MAGNETIC DEVICE INTEGRATED STRUCTURE AND MANUFACTURING MET...
- Publication number 20240332224
- Publication date Oct 3, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
- Publication number 20240331921
- Publication date Oct 3, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321812
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Takeshi MURASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240312922
- Publication date Sep 19, 2024
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORME...
- Publication number 20240282723
- Publication date Aug 22, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Matthew Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DEFINED COUPLED INDUCTORS WITH EMBEDDED SOLID FERRITE CORE
- Publication number 20240274549
- Publication date Aug 15, 2024
- ADVANCED MICRO DEVICES, INC.
- Alexander Helmut Pfeiffenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EX-SITU MANUFACTURE OF METAL MICRO-WIRES AND FIB PLACEMENT IN IC CI...
- Publication number 20240274550
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Michael Lee Dawson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate and Preparation Method thereof, Integrated Passive Device...
- Publication number 20240266235
- Publication date Aug 8, 2024
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yifan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC APPARATUS WITH INTEGRATED PINS AND METALLIZATION PINS, POW...
- Publication number 20240250044
- Publication date Jul 25, 2024
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD
- Publication number 20240213169
- Publication date Jun 27, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BUMPS OF A PACKAGE SUBSTRATE
- Publication number 20240203860
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Ashish RAJ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY HAVING ANTIFERROMAGNETIC FILM STRUCTURE TH...
- Publication number 20240186270
- Publication date Jun 6, 2024
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES, STACKED SEMICONDUCTOR DIE ASSEMB...
- Publication number 20240186295
- Publication date Jun 6, 2024
- Lodestar Licensing Group LLC
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION N...
- Publication number 20240162155
- Publication date May 16, 2024
- QUALCOMM Incorporated
- Lili XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20240153892
- Publication date May 9, 2024
- Kabushiki Kaisha Toshiba
- Yoshihiko FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Semiconductor Package wi...
- Publication number 20240128201
- Publication date Apr 18, 2024
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...
- Publication number 20240114622
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FOR ENHANCING QUALITY FACTOR OF INDUCTOR AND M...
- Publication number 20240113154
- Publication date Apr 4, 2024
- RICHWAVE TECHNOLOGY CORP.
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS

Inductive arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Organic interposer including a dual-layer inductor structure and me...

Package embedded magnetic inductor structures and manufacturing tec...

Inductor built-in substrate

Micro-scale planar-coil transformer with shield

Power amplifier module

Semiconductor package and manufacturing method thereof

Semiconductor device and method of making the same

Inductance traces protected through shielding layers

Distributing on chip inductors for monolithic voltage regulation

Method for forming a device with an extended via semiconductor stru...

Inductor structure, semiconductor package and fabrication method th...

Semiconductor devices and methods of fabricating a semiconductor de...

Semiconductor device and corresponding method of manufacture

Inductor structure having conductive sheets having fan plate shape...

Electronic substrates having embedded inductors

Chip encapsulation structure and encapsulation method

Transformer design with balanced interwinding capacitance for impro...

Semiconductor package device with integrated inductor and manufactu...

Package comprising substrate with coupling element for integrated d...

Integrated semiconductor device isolation package

Inductor built-in substrate and method for manufacturing inductor b...

Interconnect loss of high density package with magnetic material

Power management semiconductor package and manufacturing method the...

Transformer

Ferrite electro-magnetic interference (EMI) shield between an integ...

Semiconductor structure and manufacturing method thereof

Method and apparatus for delivering power to semiconductors

Electronic package and manufacturing method thereof

Vertical inductor for WLCSP

Efficient IGBT switching

Patents Applicationslast 30 patents

NANOWIRE, FABRICATION METHOD OF ARRAY SUBSTRATE, ARRAY SUBSTRATE AN...

ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

THROUGH CORE VIA COAXIAL-TYPE INDUCTORS WITH TWO OR MORE MAGNETIC M...

TRANSFORMER DESIGN WITH BALANCED INTERWINDING CAPACITANCE FOR IMPRO...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...

SEMICONDUCTOR MODULE

EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY

EMBEDDED MAGNETIC DEVICE INTEGRATED STRUCTURE AND MANUFACTURING MET...

ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORME...

SUBSTRATE DEFINED COUPLED INDUCTORS WITH EMBEDDED SOLID FERRITE CORE

EX-SITU MANUFACTURE OF METAL MICRO-WIRES AND FIB PLACEMENT IN IC CI...

Substrate and Preparation Method thereof, Integrated Passive Device...

MAGNETIC APPARATUS WITH INTEGRATED PINS AND METALLIZATION PINS, POW...

LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD

PACKAGE BUMPS OF A PACKAGE SUBSTRATE

MICROELECTRONIC ASSEMBLY HAVING ANTIFERROMAGNETIC FILM STRUCTURE TH...

MICROELECTRONIC DEVICE ASSEMBLIES, STACKED SEMICONDUCTOR DIE ASSEMB...

PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION N...

ISOLATOR

Semiconductor Device and Method of Forming Semiconductor Package wi...

EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...

SEMICONDUCTOR DEVICE FOR ENHANCING QUALITY FACTOR OF INDUCTOR AND M...