Inertial sensors

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B81B2201/0228

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2201/00Specific applications of micro-electromechanical systems

Current Industry

B81B2201/0228Inertial sensors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
MEMS device built using the BEOL metal layers of a solid state semi...
- Patent number 12,209,009
- Issue date Jan 28, 2025
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor module having conductive bonding members with varying meltin...
- Patent number 12,000,857
- Issue date Jun 4, 2024
- Seiko Epson Corporation
- Masayasu Sakuma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device built using the BEOL metal layers of a solid state semi...
- Patent number 11,780,725
- Issue date Oct 10, 2023
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inertial sensor sampling with combined sense axes
- Patent number 11,726,107
- Issue date Aug 15, 2023
- NXP USA, INC.
- Andrew C McNeil
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,661,333
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Jhih Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device, system, method, and computer product for detecting and eval...
- Patent number 11,650,566
- Issue date May 16, 2023
- STMicroelectronics S.r.l.
- Luca Fontanella
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method for monitoring surface condition of contact surfa...
- Patent number 11,634,319
- Issue date Apr 25, 2023
- NATIONAL TAIWAN UNIVERSITY
- Wei-Chang Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a micromechanical device having a damper struc...
- Patent number 11,505,455
- Issue date Nov 22, 2022
- Robert Bosch GmbH
- Holger Hoefer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Z-axis inertial sensor with extended motion stops
- Patent number 11,499,987
- Issue date Nov 15, 2022
- NXP USA, INC.
- Andrew C McNeil
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Distributed sensor system
- Patent number 11,401,161
- Issue date Aug 2, 2022
- VERSANA MICRO INC
- Bishnu Prasanna Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mems device built using the BEOL metal layers of a solid state semi...
- Patent number 11,312,617
- Issue date Apr 26, 2022
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mems device built using the BEOL metal layers of a solid state semi...
- Patent number 11,267,692
- Issue date Mar 8, 2022
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Monolithically integrated multi-sensor device on a semiconductor su...
- Patent number 11,174,154
- Issue date Nov 16, 2021
- VERSANA MICRO INC
- Bishnu Prasanna Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical or/and nanoelectromechanical device with out...
- Patent number 11,156,459
- Issue date Oct 26, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Federico Maspero
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through silicon via (TSV) formation in integrated circuits
- Patent number 11,097,942
- Issue date Aug 24, 2021
- Analog Devices, Inc.
- Thomas Kieran Nunan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Proof mass offset compensation
- Patent number 11,009,350
- Issue date May 18, 2021
- Invensense, Inc.
- Matthew Thompson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical and/or nanoelectromechanical device offering...
- Patent number 11,008,213
- Issue date May 18, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Helene Lhermet
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic system comprising a microelectromechanical system and a...
- Patent number 10,994,988
- Issue date May 4, 2021
- Thales
- Bertrand Leverrier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS or NEMS device with stacked stop element
- Patent number 10,858,242
- Issue date Dec 8, 2020
- SAFRAN
- Guillaume Jerome Francois Lehee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensors with selectively adjusted damping of suspension
- Patent number 10,822,225
- Issue date Nov 3, 2020
- Honeywell International Inc.
- Mikulas Jandak
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a micromechanical inertial sensor
- Patent number 10,730,746
- Issue date Aug 4, 2020
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Rotational speed sensor with minimized interference movements in th...
- Patent number 10,655,965
- Issue date May 19, 2020
- Robert Bosch GmbH
- Benjamin Schmidt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical device and manufacturing process thereof
- Patent number 10,626,008
- Issue date Apr 21, 2020
- STMicroelectronics S.r.l.
- Lorenzo Baldo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Monolithically integrated multi-sensor device on a semiconductor su...
- Patent number 10,508,026
- Issue date Dec 17, 2019
- VERSANA MICRO INC
- Bishnu Prasanna Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated structure of mems pressure sensor and mems inertia sensor
- Patent number 10,407,300
- Issue date Sep 10, 2019
- Goertek Inc.
- Guoguang Zheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Monolithically integrated multi-sensor device on a semiconductor su...
- Patent number 10,280,074
- Issue date May 7, 2019
- VERSANA MICRO INC
- Bishnu Prasanna Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for protecting a MEMS unit against infrared investigations a...
- Patent number 10,273,145
- Issue date Apr 30, 2019
- Robert Bosch GmbH
- Michael Curcic
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Distributed sensor system
- Patent number 10,246,322
- Issue date Apr 2, 2019
- VERSANA MICRO INC
- Bishnu Prasanna Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integrated device including multiple cavities at differen...
- Patent number 10,221,065
- Issue date Mar 5, 2019
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical device and manufacturing process thereof
- Patent number 10,150,666
- Issue date Dec 11, 2018
- STMicroelectronics S.r.l.
- Lorenzo Baldo
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
INERTIAL SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20250026630
- Publication date Jan 23, 2025
- AAC TECHNOLOGIES PTE. LTD
- Veronica Tan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DIES EMBEDDED IN GLASS CORES
- Publication number 20240327201
- Publication date Oct 3, 2024
- Intel Corporation
- Numair Ahmed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DOUBLE LAYER MEMS DEVICES
- Publication number 20240286890
- Publication date Aug 29, 2024
- Murata Manufacturing Co., Ltd.
- Altti TORKKELI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE SENSOR
- Publication number 20240092630
- Publication date Mar 21, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Chunzhi DONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS
- Publication number 20240043265
- Publication date Feb 8, 2024
- STMicroelectronics S.r.l.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...
- Publication number 20230406693
- Publication date Dec 21, 2023
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPACT MICROELECTROMECHANICAL ANGULAR RATE SENSOR
- Publication number 20230322548
- Publication date Oct 12, 2023
- STMicroelectronics S.r.l.
- Luca Giuseppe FALORNI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE, SYSTEM, METHOD, AND COMPUTER PRODUCT FOR DETECTING AND EVAL...
- Publication number 20230251621
- Publication date Aug 10, 2023
- STMicroelectronics S.r.l.
- Luca FONTANELLA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT AND MANUFACTURING METHOD FOR A MICROMECHA...
- Publication number 20230242393
- Publication date Aug 3, 2023
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DISTRIBUTED SENSOR SYSTEM
- Publication number 20220315417
- Publication date Oct 6, 2022
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR MODULE
- Publication number 20220268806
- Publication date Aug 25, 2022
- SEIKO EPSON CORPORATION
- Masayasu Sakuma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTIPLY ENCAPSULATED MICRO ELECTRICAL MECHANICAL SYSTEMS DEVICE
- Publication number 20220219971
- Publication date Jul 14, 2022
- CAMBRIDGE ENTERPRISE LIMITED
- Ashwin SESHIA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220112074
- Publication date Apr 14, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-JHIH MAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...
- Publication number 20220089433
- Publication date Mar 24, 2022
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGING STRUCTURE AND FABRICATION METHOD THEREFOR
- Publication number 20220063987
- Publication date Mar 3, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20220063988
- Publication date Mar 3, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...
- Publication number 20220041434
- Publication date Feb 10, 2022
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...
- Publication number 20220033255
- Publication date Feb 3, 2022
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR MONITORING SURFACE CONDITION OF CONTACT SURFA...
- Publication number 20220002148
- Publication date Jan 6, 2022
- National Taiwan University
- Wei-Chang Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...
- Publication number 20210221674
- Publication date Jul 22, 2021
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...
- Publication number 20210206624
- Publication date Jul 8, 2021
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROMECHANICAL DEVICE HAVING A DAMPER STRUC...
- Publication number 20210179422
- Publication date Jun 17, 2021
- ROBERT BOSCH GmbH
- Holger Hoefer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL SENSOR SAMPLING WITH COMBINED SENSE AXES
- Publication number 20210123946
- Publication date Apr 29, 2021
- NXP USA, Inc.
- Andrew C McNeil
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR DETECTING TIGHTNESS STATE OF BOLT OR NUT
- Publication number 20210033393
- Publication date Feb 4, 2021
- Zhejiang Future Technology Institute (jiaxing)
- Shuangwen Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...
- Publication number 20210002129
- Publication date Jan 7, 2021
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...
- Publication number 20200079644
- Publication date Mar 12, 2020
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL DEVICE AND MANUFACTURING PROCESS THEREOF
- Publication number 20200024132
- Publication date Jan 23, 2020
- STMicroelectronics S.r.l.
- Lorenzo Baldo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS OR NEMS DEVICE WITH STACKED STOP ELEMENT
- Publication number 20190389722
- Publication date Dec 26, 2019
- SAFRAN
- Guillaume Jerome Francois LEHEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC SYSTEM COMPRISING A MICROELECTROMECHANICAL SYSTEM AND A...
- Publication number 20190276307
- Publication date Sep 12, 2019
- THALES
- Bertrand LEVERRIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...
- Publication number 20190218093
- Publication date Jul 18, 2019
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Inertial sensors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

MEMS device built using the BEOL metal layers of a solid state semi...

Sensor module having conductive bonding members with varying meltin...

MEMS device built using the BEOL metal layers of a solid state semi...

Inertial sensor sampling with combined sense axes

Semiconductor structure and manufacturing method thereof

Device, system, method, and computer product for detecting and eval...

Device and method for monitoring surface condition of contact surfa...

Method for producing a micromechanical device having a damper struc...

Z-axis inertial sensor with extended motion stops

Distributed sensor system

Mems device built using the BEOL metal layers of a solid state semi...

Mems device built using the BEOL metal layers of a solid state semi...

Monolithically integrated multi-sensor device on a semiconductor su...

Microelectromechanical or/and nanoelectromechanical device with out...

Through silicon via (TSV) formation in integrated circuits

Proof mass offset compensation

Microelectromechanical and/or nanoelectromechanical device offering...

Electronic system comprising a microelectromechanical system and a...

MEMS or NEMS device with stacked stop element

MEMS sensors with selectively adjusted damping of suspension

Method for manufacturing a micromechanical inertial sensor

Rotational speed sensor with minimized interference movements in th...

Micro-electro-mechanical device and manufacturing process thereof

Monolithically integrated multi-sensor device on a semiconductor su...

Integrated structure of mems pressure sensor and mems inertia sensor

Monolithically integrated multi-sensor device on a semiconductor su...

Method for protecting a MEMS unit against infrared investigations a...

Distributed sensor system

CMOS-MEMS integrated device including multiple cavities at differen...

Micro-electro-mechanical device and manufacturing process thereof

Patents Applicationslast 30 patents

INERTIAL SENSOR AND METHOD FOR FORMING THE SAME

MEMS DIES EMBEDDED IN GLASS CORES

DOUBLE LAYER MEMS DEVICES

CAPACITIVE SENSOR

MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS

MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...

COMPACT MICROELECTROMECHANICAL ANGULAR RATE SENSOR

DEVICE, SYSTEM, METHOD, AND COMPUTER PRODUCT FOR DETECTING AND EVAL...

MICROMECHANICAL COMPONENT AND MANUFACTURING METHOD FOR A MICROMECHA...

DISTRIBUTED SENSOR SYSTEM

SENSOR MODULE

MULTIPLY ENCAPSULATED MICRO ELECTRICAL MECHANICAL SYSTEMS DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...

MEMS PACKAGING STRUCTURE AND FABRICATION METHOD THEREFOR

MEMS PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...

MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...

DEVICE AND METHOD FOR MONITORING SURFACE CONDITION OF CONTACT SURFA...

MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...

MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...

METHOD FOR PRODUCING A MICROMECHANICAL DEVICE HAVING A DAMPER STRUC...

INERTIAL SENSOR SAMPLING WITH COMBINED SENSE AXES

METHOD AND SYSTEM FOR DETECTING TIGHTNESS STATE OF BOLT OR NUT

MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...

MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...

MICRO-ELECTRO-MECHANICAL DEVICE AND MANUFACTURING PROCESS THEREOF

MEMS OR NEMS DEVICE WITH STACKED STOP ELEMENT

ELECTRONIC SYSTEM COMPRISING A MICROELECTROMECHANICAL SYSTEM AND A...

MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...