Ink-jet print cartridges

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B81B2201/052

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2201/00Specific applications of micro-electromechanical systems

Current Industry

B81B2201/052Ink-jet print cartridges

Industries

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Patents Grantslast 30 patents

Information Patent Grant
MEMS chip assembly having multiple trenches
- Patent number 12,059,898
- Issue date Aug 13, 2024
- Memjet Technology Limited
- Elmer Dimaculangan Perez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three-dimensional features formed in molded panel
- Patent number 11,807,523
- Issue date Nov 7, 2023
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Corrosion tolerant micro-electromechanical fluid ejection device
- Patent number 11,787,180
- Issue date Oct 17, 2023
- Hewlett-Packard Development Company, L.P.
- Stanley J. Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deep reactive ion etching process for fluid ejection heads
- Patent number 11,746,005
- Issue date Sep 5, 2023
- FUNAI ELECTRIC CO. LTD
- David L. Bernard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing at least one recess in a material by means of...
- Patent number 11,478,880
- Issue date Oct 25, 2022
- LPKF Laser & Electronics AG
- Roman Ostholt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MEMS device, liquid ejecting head, liquid ejecting apparatus, manuf...
- Patent number 11,390,079
- Issue date Jul 19, 2022
- Seiko Epson Corporation
- Daisuke Yamada
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three-dimensional features formed in molded panel
- Patent number 11,148,942
- Issue date Oct 19, 2021
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inkjet printhead with encapsulant-retaining features
- Patent number 10,864,733
- Issue date Dec 15, 2020
- Memjet Technology Limited
- Elmer Dimaculangan Perez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inkjet printhead with grout retaining features
- Patent number 10,850,517
- Issue date Dec 1, 2020
- Memjet Technology Limited
- Elmer Dimaculangan Perez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for forming inkjet nozzle devices
- Patent number 10,822,228
- Issue date Nov 3, 2020
- Memjet Technology Limited
- Angus North
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded substrate body, method for manufacturing bonded substrate bo...
- Patent number 10,661,566
- Issue date May 26, 2020
- Canon Kabushiki Kaisha
- Yoshiyuki Fukumoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heating system and method for microfluidic and micromechanical appl...
- Patent number 10,654,714
- Issue date May 19, 2020
- STMicroelectronics, Inc.
- Ming Fang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for filling etched holes using first and second polymers
- Patent number 10,597,290
- Issue date Mar 24, 2020
- Memjet Technology Limited
- Angus North
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Nozzle substrate, ink-jet print head, and method for producing nozz...
- Patent number 10,500,857
- Issue date Dec 10, 2019
- Rohm Co., Ltd.
- Nobufumi Matsuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for processing silicon substrate and method for manufacturin...
- Patent number 10,464,325
- Issue date Nov 5, 2019
- Canon Kabushiki Kaisha
- Atsunori Terasaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming space for use in analysis devices
- Patent number 10,364,142
- Issue date Jul 30, 2019
- Canon Kabushiki Kaisha
- Masafumi Morisue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bond rings in semiconductor devices and methods of forming same
- Patent number 10,351,418
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming film and method for manufacturing inkjet print head
- Patent number 10,343,403
- Issue date Jul 9, 2019
- Canon Kabushiki Kaisha
- Atsushi Teranishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for filling etched holes using photoimageable thermoplastic...
- Patent number 10,329,146
- Issue date Jun 25, 2019
- Memjet Technology Limited
- Angus North
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device, liquid ejecting head, liquid ejecting apparatus, metho...
- Patent number 10,246,321
- Issue date Apr 2, 2019
- Seiko Epson Corporation
- Masashi Yoshiike
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device, head and liquid jet device
- Patent number 10,220,619
- Issue date Mar 5, 2019
- Seiko Epson Corporation
- Shuichi Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of joined body, manufacturing method of MEMS d...
- Patent number 10,207,484
- Issue date Feb 19, 2019
- Seiko Epson Corporation
- Hiroyuki Tsuchiya
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device, liquid ejecting head, and liquid ejecting apparatus
- Patent number 10,173,891
- Issue date Jan 8, 2019
- Seiko Epson Corporation
- Masashi Yoshiike
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluidic circuits and related manufacturing methods
- Patent number 10,065,186
- Issue date Sep 4, 2018
- Micronics, Inc.
- Andrew Kolb
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method to taylor mechanical properties on MEMS devices and nano-dev...
- Patent number 10,031,415
- Issue date Jul 24, 2018
- Funai Electric Co., Ltd.
- David L. Bernard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate etch
- Patent number 9,988,263
- Issue date Jun 5, 2018
- Hewlett-Packard Development Company, L.P.
- Patrick Wayne Sadik
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bond rings in semiconductor devices and methods of forming same
- Patent number 9,957,156
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate plate for MEMS devices
- Patent number 9,856,140
- Issue date Jan 2, 2018
- Oce-Technologies B.V.
- Maikel A. J. Huygens
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device, liquid ejecting head, and liquid ejecting apparatus
- Patent number 9,770,907
- Issue date Sep 26, 2017
- Seiko Epson Corporation
- Katsutomo Tsukahara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for filling etched holes
- Patent number 9,708,183
- Issue date Jul 18, 2017
- Memjet Technology Limited
- Angus North
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS DEVICE
- Publication number 20240083741
- Publication date Mar 14, 2024
- Rohm Co., Ltd.
- Daisuke NISHINOHARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE
- Publication number 20230415482
- Publication date Dec 28, 2023
- Hewlett-Packard Development Company, L.P.
- Stanley J. Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFLUIDIC PASSAGE WITH PROTECTIVE LAYER
- Publication number 20230241889
- Publication date Aug 3, 2023
- Hewlett-Packard Development Company, L.P.
- Juan Carlos Ramos
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS
- Publication number 20230226818
- Publication date Jul 20, 2023
- SEIKO EPSON CORPORATION
- Motoki TAKABE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEEP REACTIVE ION ETCHING PROCESS FOR FLUID EJECTION HEADS
- Publication number 20220281740
- Publication date Sep 8, 2022
- Funai Electric Co., Ltd.
- David L. BERNARD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EPITAXIAL-SILICON WAFER WITH A BURIED OXIDE LAYER
- Publication number 20220177296
- Publication date Jun 9, 2022
- Hewlett-Packard Development Company, L.P.
- Stanley J. Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE
- Publication number 20220040977
- Publication date Feb 10, 2022
- Hewlett-Packard Development Company, L.P.
- Stanley J. Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL FEATURES FORMED IN MOLDED PANEL
- Publication number 20220002149
- Publication date Jan 6, 2022
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, MANUF...
- Publication number 20210129535
- Publication date May 6, 2021
- SEIKO EPSON CORPORATION SEIKO EPSON CORPORATION SEIKO EPSON CORPORATION
- Daisuke YAMADA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR FORMING INKJET NOZZLE DEVICES
- Publication number 20200180949
- Publication date Jun 11, 2020
- MEMJET TECHNOLOGY LIMITED
- Angus North
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INKJET PRINTHEAD WITH ENCAPSULANT-RETAINING FEATURES
- Publication number 20190337291
- Publication date Nov 7, 2019
- MEMJET TECHNOLOGY LIMITED
- Elmer Dimaculangan Perez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR FILLING ETCHED HOLES USING FIRST AND SECOND POLYMERS
- Publication number 20190263657
- Publication date Aug 29, 2019
- MEMJET TECHNOLOGY LIMITED
- Angus North
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS
- Publication number 20190143690
- Publication date May 16, 2019
- SEIKO EPSON CORPORATION
- Masashi FUJIOKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
AMORPHOUS THIN METAL FILM
- Publication number 20190119101
- Publication date Apr 25, 2019
- Hewlett-Packard Development Company, L.P.
- James Elmer Abbott
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED SUBSTRATE BODY, METHOD FOR MANUFACTURING BONDED SUBSTRATE BO...
- Publication number 20180281414
- Publication date Oct 4, 2018
- Canon Kabushiki Kaisha
- Yoshiyuki Fukumoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL FEATURES FORMED IN MOLDED PANEL
- Publication number 20180265353
- Publication date Sep 20, 2018
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Bond Rings in Semiconductor Devices and Methods of Forming Same
- Publication number 20180230003
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING FILM AND METHOD FOR MANUFACTURING INKJET PRINT HEAD
- Publication number 20180147848
- Publication date May 31, 2018
- Canon Kabushiki Kaisha
- Atsushi Teranishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NOZZLE SUBSTRATE, INK-JET PRINT HEAD, AND METHOD FOR PRODUCING NOZZ...
- Publication number 20180117910
- Publication date May 3, 2018
- Rohm Co., Ltd.
- Nobufumi MATSUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, METHO...
- Publication number 20180093882
- Publication date Apr 5, 2018
- SEIKO EPSON CORPORATION
- Masashi YOSHIIKE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS
- Publication number 20180079641
- Publication date Mar 22, 2018
- SEIKO EPSON CORPORATION
- Masashi YOSHIIKE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD OF JOINED BODY, MANUFACTURING METHOD OF MEMS D...
- Publication number 20180050530
- Publication date Feb 22, 2018
- SEIKO EPSON CORPORATION
- Hiroyuki TSUCHIYA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING SPACE FOR USE IN ANALYSIS DEVICES
- Publication number 20180037455
- Publication date Feb 8, 2018
- Canon Kabushiki Kaisha
- Masafumi Morisue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE, HEAD AND LIQUID JET DEVICE
- Publication number 20180001639
- Publication date Jan 4, 2018
- SEIKO EPSON CORPORATION
- Shuichi Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR FILLING ETCHED HOLES USING PHOTOIMAGEABLE THERMOPLASTIC...
- Publication number 20170349431
- Publication date Dec 7, 2017
- Memjet Technology Ltd.
- Angus North
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOND RINGS IN SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME
- Publication number 20170275153
- Publication date Sep 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELASTIC DEVICE
- Publication number 20170210616
- Publication date Jul 27, 2017
- Hewlett-Packard Development Company, L.P.
- James Elmer Abbott
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS
- Publication number 20170144442
- Publication date May 25, 2017
- SEIKO EPSON CORPORATION
- Katsutomo TSUKAHARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRING STRUCTURE, MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTIN...
- Publication number 20170144438
- Publication date May 25, 2017
- SEIKO EPSON CORPORATION
- Masumi HAYAKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HEATING SYSTEM AND METHOD FOR MICROFLUIDIC AND MICROMECHANICAL APPL...
- Publication number 20160347610
- Publication date Dec 1, 2016
- STMicroelectronics, Inc.
- Ming FANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Ink-jet print cartridges

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

MEMS chip assembly having multiple trenches

Three-dimensional features formed in molded panel

Corrosion tolerant micro-electromechanical fluid ejection device

Deep reactive ion etching process for fluid ejection heads

Method for producing at least one recess in a material by means of...

MEMS device, liquid ejecting head, liquid ejecting apparatus, manuf...

Three-dimensional features formed in molded panel

Inkjet printhead with encapsulant-retaining features

Inkjet printhead with grout retaining features

Process for forming inkjet nozzle devices

Bonded substrate body, method for manufacturing bonded substrate bo...

Heating system and method for microfluidic and micromechanical appl...

Process for filling etched holes using first and second polymers

Nozzle substrate, ink-jet print head, and method for producing nozz...

Method for processing silicon substrate and method for manufacturin...

Method of forming space for use in analysis devices

Bond rings in semiconductor devices and methods of forming same

Method for forming film and method for manufacturing inkjet print head

Process for filling etched holes using photoimageable thermoplastic...

MEMS device, liquid ejecting head, liquid ejecting apparatus, metho...

MEMS device, head and liquid jet device

Manufacturing method of joined body, manufacturing method of MEMS d...

MEMS device, liquid ejecting head, and liquid ejecting apparatus

Fluidic circuits and related manufacturing methods

Method to taylor mechanical properties on MEMS devices and nano-dev...

Substrate etch

Bond rings in semiconductor devices and methods of forming same

Substrate plate for MEMS devices

MEMS device, liquid ejecting head, and liquid ejecting apparatus

Process for filling etched holes

Patents Applicationslast 30 patents

MEMS DEVICE

CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE

MICROFLUIDIC PASSAGE WITH PROTECTIVE LAYER

MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS

DEEP REACTIVE ION ETCHING PROCESS FOR FLUID EJECTION HEADS

EPITAXIAL-SILICON WAFER WITH A BURIED OXIDE LAYER

A CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE

THREE-DIMENSIONAL FEATURES FORMED IN MOLDED PANEL

MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, MANUF...

PROCESS FOR FORMING INKJET NOZZLE DEVICES

INKJET PRINTHEAD WITH ENCAPSULANT-RETAINING FEATURES

PROCESS FOR FILLING ETCHED HOLES USING FIRST AND SECOND POLYMERS

MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS

AMORPHOUS THIN METAL FILM

BONDED SUBSTRATE BODY, METHOD FOR MANUFACTURING BONDED SUBSTRATE BO...

THREE-DIMENSIONAL FEATURES FORMED IN MOLDED PANEL

Bond Rings in Semiconductor Devices and Methods of Forming Same

METHOD FOR FORMING FILM AND METHOD FOR MANUFACTURING INKJET PRINT HEAD

NOZZLE SUBSTRATE, INK-JET PRINT HEAD, AND METHOD FOR PRODUCING NOZZ...

MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, METHO...

MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS

MANUFACTURING METHOD OF JOINED BODY, MANUFACTURING METHOD OF MEMS D...

METHOD OF FORMING SPACE FOR USE IN ANALYSIS DEVICES

MEMS DEVICE, HEAD AND LIQUID JET DEVICE

PROCESS FOR FILLING ETCHED HOLES USING PHOTOIMAGEABLE THERMOPLASTIC...

BOND RINGS IN SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME

ELASTIC DEVICE

MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS

WIRING STRUCTURE, MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTIN...

HEATING SYSTEM AND METHOD FOR MICROFLUIDIC AND MICROMECHANICAL APPL...