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H01L2224/78318

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78318inside the capillary

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,300,663
- Issue date May 13, 2025
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra fine pitch wedge for thicker wire
- Patent number 9,543,267
- Issue date Jan 10, 2017
- MICRO POINT PRO LTD.
- Uri Zaks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed wire semiconductor lead frame package
- Patent number 9,087,827
- Issue date Jul 21, 2015
- Infineon Technologies AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device with a contact pad on a sl...
- Patent number 8,674,511
- Issue date Mar 18, 2014
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wire bonding method
- Patent number 8,432,015
- Issue date Apr 30, 2013
- Toyota Jidosha Kabushiki Kaisha
- Hiroaki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,169,087
- Issue date May 1, 2012
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed wire semiconductor lead frame package
- Patent number 8,105,932
- Issue date Jan 31, 2012
- Infineon Technologies AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for controlling the generation of ultrasonic wire...
- Patent number 8,020,746
- Issue date Sep 20, 2011
- Technische Universitaet Berlin
- Ute Geissler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser bonding tool with improved bonding accuracy
- Patent number 7,872,208
- Issue date Jan 18, 2011
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method, device and system for bonding a semiconductor element
- Patent number 7,654,434
- Issue date Feb 2, 2010
- Infineon Technologies AG
- Dirk Siepe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond capillary design for ribbon wire bonding
- Patent number 7,578,422
- Issue date Aug 25, 2009
- Texas Instruments Incorporated
- Bernhard P. Lange
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and method for manufacturing same
- Patent number 7,563,648
- Issue date Jul 21, 2009
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding wedge
- Patent number 7,451,905
- Issue date Nov 18, 2008
- Edwards Enterprises
- Russell K. Bell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a semiconductor device having bonding pad of the...
- Patent number 7,331,737
- Issue date Feb 19, 2008
- NEC Electronics Corporation
- Mitsuru Oota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having bonding pad of the first chip thicker t...
- Patent number 7,256,485
- Issue date Aug 14, 2007
- NEC Electronics Corporation
- Mitsuru Oota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond capillary design for ribbon wire bonding
- Patent number 7,216,794
- Issue date May 15, 2007
- Texas Instruments Incorporated
- Bernhard P. Lange
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stabilized wire bonded electrical connections and method of making...
- Patent number 7,032,311
- Issue date Apr 25, 2006
- Eli Razon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bond fault detection method and apparatus
- Patent number 7,004,373
- Issue date Feb 28, 2006
- West Bond, Inc.
- Charles F. Miller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for laser welding of ribbons
- Patent number 6,717,100
- Issue date Apr 6, 2004
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for detecting wire in an ultrasonic bonding tool
- Patent number 6,667,625
- Issue date Dec 23, 2003
- Charles F. Miller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for coupling conductive leads of semiconducto...
- Patent number 6,602,778
- Issue date Aug 5, 2003
- Micron Technology, Inc.
- Troy A. Manning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for laser welding of ribbons
- Patent number 6,501,043
- Issue date Dec 31, 2002
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for coupling conductive leads of semiconducto...
- Patent number 6,380,635
- Issue date Apr 30, 2002
- Micron Technology, Inc.
- Troy A. Manning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angular velocity sensor, related method for manufacturing the senso...
- Patent number 6,360,600
- Issue date Mar 26, 2002
- Denso Corporation
- Hisao Kuroki
- G01 - MEASURING TESTING
Information Patent Grant
Wire bond monitoring system for layered packages
- Patent number 6,247,629
- Issue date Jun 19, 2001
- Micron Technology, Inc.
- John O. Jacobson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Deep access, close proximity, fine pitch bonding of large wire
- Patent number 6,206,275
- Issue date Mar 27, 2001
- F & K Delvotec Bondtechnik GmbH
- Kenneth L. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electrically coupling bond pads of a microelectronic device
- Patent number 6,192,578
- Issue date Feb 27, 2001
- Micron Technology, Inc.
- Troy A. Manning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making improved long life bonding tools
- Patent number 6,171,456
- Issue date Jan 9, 2001
- Kulicke and Soffa Industries Inc.
- Ilan Hadar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for electrically coupling bond pads of a microelectronic...
- Patent number 6,169,331
- Issue date Jan 2, 2001
- Micron Technology, Inc.
- Troy A. Manning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tool used in forming a chip scale package
- Patent number 6,136,681
- Issue date Oct 24, 2000
- Kulicke & Soffa Investments, Inc.
- Eli Razon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20250239567
- Publication date Jul 24, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA FINE PITCH WEDGE FOR THICKER WIRE
- Publication number 20140203065
- Publication date Jul 24, 2014
- Micro Point Pro LTD.
- Uri Zaks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130034955
- Publication date Feb 7, 2013
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip Mounting Structure and Flip-chip Mounting Method
- Publication number 20120273942
- Publication date Nov 1, 2012
- Japan Aviation Electronics Industry ,Limited
- Daisuke Uchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE
- Publication number 20120091568
- Publication date Apr 19, 2012
- INFINEON TECHNOLOGIES AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING...
- Publication number 20110031302
- Publication date Feb 10, 2011
- GREAT TEAM BACKEND FOUNDRY INC.
- CHUNG HSING TZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100276817
- Publication date Nov 4, 2010
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100258943
- Publication date Oct 14, 2010
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR AFFIXING A SILICON DEVICE TO A SUPPORT STRU...
- Publication number 20100255622
- Publication date Oct 7, 2010
- Honeywell International, Inc.
- Mark Eskridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20100207234
- Publication date Aug 19, 2010
- Hiroaki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING...
- Publication number 20100102429
- Publication date Apr 29, 2010
- GREAT TEAM BACKEND FOUNDRY, INC.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR CONTROLLING THE GENERATION OF ULTRASONIC WIRE...
- Publication number 20100025453
- Publication date Feb 4, 2010
- Technische Universitaet Berlin
- Ute Geissler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mixed Wire Semiconductor Lead Frame Package
- Publication number 20090014848
- Publication date Jan 15, 2009
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding and wire bonding method
- Publication number 20080093416
- Publication date Apr 24, 2008
- KABUSHIKI KAISHA SHINKAWA
- Tetsuya Utano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20070224805
- Publication date Sep 27, 2007
- NEC ELECTRONICS CORPORATION
- Mitsuru Oota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Capillary Design for Ribbon Wire Bonding
- Publication number 20070181652
- Publication date Aug 9, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Bernhard P. Lange
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device package and method for manufacturing same
- Publication number 20070161157
- Publication date Jul 12, 2007
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond capillary design for ribbon wire bonding
- Publication number 20060278682
- Publication date Dec 14, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Bernhard P. Lange
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20060220231
- Publication date Oct 5, 2006
- NEC Electronics Corporation
- Mitsuru Oota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser bonding tool with improved bonding accuracy
- Publication number 20060219672
- Publication date Oct 5, 2006
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method, Device and System for Bonding a Semiconductor Element
- Publication number 20060208037
- Publication date Sep 21, 2006
- Dirk Siepe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING WEDGE
- Publication number 20050279811
- Publication date Dec 22, 2005
- GAISER TOOL COMPANY
- Russell K. Bell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement for wire bonding and method for producing a bonding con...
- Publication number 20050150932
- Publication date Jul 14, 2005
- Khalil Hosseini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for laser welding of ribbons for electrical co...
- Publication number 20040256367
- Publication date Dec 23, 2004
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stabilized wire bonded electrical connections and method of making...
- Publication number 20030234451
- Publication date Dec 25, 2003
- Eli Razon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for laser welding of ribbons
- Publication number 20030127434
- Publication date Jul 10, 2003
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cleaner for cleaning a capillary tube for use in a wire bonding tool
- Publication number 20020096187
- Publication date Jul 25, 2002
- NEC Corporation
- Kouji Kuwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and methods for coupling conductive leads of semiconducto...
- Publication number 20020089070
- Publication date Jul 11, 2002
- Troy A. Manning
- H01 - BASIC ELECTRIC ELEMENTS

inside the capillary

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming wire interconnect structures and related wire bo...

Ultra fine pitch wedge for thicker wire

Mixed wire semiconductor lead frame package

Method of forming a semiconductor device with a contact pad on a sl...

Semiconductor device and wire bonding method

Semiconductor device

Mixed wire semiconductor lead frame package

Method and device for controlling the generation of ultrasonic wire...

Laser bonding tool with improved bonding accuracy

Method, device and system for bonding a semiconductor element

Bond capillary design for ribbon wire bonding

Semiconductor device package and method for manufacturing same

Wire bonding wedge

Method of forming a semiconductor device having bonding pad of the...

Semiconductor device having bonding pad of the first chip thicker t...

Bond capillary design for ribbon wire bonding

Stabilized wire bonded electrical connections and method of making...

Wire bond fault detection method and apparatus

Apparatus and method for laser welding of ribbons

Method and apparatus for detecting wire in an ultrasonic bonding tool

Apparatus and methods for coupling conductive leads of semiconducto...

Apparatus and method for laser welding of ribbons

Apparatus and methods for coupling conductive leads of semiconducto...

Angular velocity sensor, related method for manufacturing the senso...

Wire bond monitoring system for layered packages

Deep access, close proximity, fine pitch bonding of large wire

Method for electrically coupling bond pads of a microelectronic device

Method for making improved long life bonding tools

Apparatus for electrically coupling bond pads of a microelectronic...

Tool used in forming a chip scale package

Patents Applicationslast 30 patents

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

ULTRA FINE PITCH WEDGE FOR THICKER WIRE

SEMICONDUCTOR DEVICE

Flip-chip Mounting Structure and Flip-chip Mounting Method

MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE

FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR AFFIXING A SILICON DEVICE TO A SUPPORT STRU...

SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD

FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING...

METHOD AND DEVICE FOR CONTROLLING THE GENERATION OF ULTRASONIC WIRE...

Mixed Wire Semiconductor Lead Frame Package

Wire bonding and wire bonding method

Semiconductor device and manufacturing method therefor

Bond Capillary Design for Ribbon Wire Bonding

Semiconductor device package and method for manufacturing same

Bond capillary design for ribbon wire bonding

Semiconductor device and manufacturing method therefor

Laser bonding tool with improved bonding accuracy

Method, Device and System for Bonding a Semiconductor Element

WIRE BONDING WEDGE

Arrangement for wire bonding and method for producing a bonding con...

Apparatus and method for laser welding of ribbons for electrical co...

Stabilized wire bonded electrical connections and method of making...

Apparatus and method for laser welding of ribbons

Cleaner for cleaning a capillary tube for use in a wire bonding tool

Apparatus and methods for coupling conductive leads of semiconducto...